EPM1270F256C5 - MAX II 980 Macrocell CPLD | Altera / Intel | 256-FBGA
MPN: EPM1270F256C5 ✓ AktifEPM1270F256C5 Ringkasan
What is a CPLD? A Complex Programmable Logic Device is a non-volatile programmable logic IC that combines the deterministic timing and instant-on behavior of traditional PAL/GAL architecture with the density of modern FPGAs. Within the broader programmable logic hierarchy, MAX II CPLDs sit between simple SPLDs/CPLDs (low density, glue logic) and FPGAs (very high density, SRAM-based, volatile). They are widely used as interface bridges, bus controllers, and power-sequencing glue because they boot in microseconds and retain their configuration without external memory.
Key features of the EPM1270 include a 201.1 MHz internal operating frequency, support for JTAG (IEEE 1149.1) and in-system programmability (ISP) via the Altera ByteBlaster/USB-Blaster, an embedded User Flash Memory block for storing user data alongside the configuration, and a MultiVolt I/O ring that lets a single part interface with 1.8 V, 2.5 V, 3.3 V, and 5.0 V logic on the same PCB without level shifters. The 'C5' speed grade delivers 6.2 ns tPD with a commercial operating temperature range of 0 °C to +85 °C.
Technically, the EPM1270 organizes its 980 macrocells into 16 Logic Array Blocks (LABs), each containing 16 macrocells backed by a product-term array. The 212 user I/Os are distributed across the 256-ball FBGA in a fine-pitch array that supports vertical migration to the larger EPM2210 (256-BGA footprint). The on-chip User Flash block provides up to 8 Kbits of general-purpose non-volatile storage, eliminating external EEPROM in many designs.
Typical applications include power-up sequencing for multi-rail FPGA/processor systems, I/O expansion and voltage-level translation between mixed-voltage ASICs, glue-logic consolidation for legacy designs, JTAG-controlled board test multiplexers, and high-performance state-machine controllers in industrial automation, communications infrastructure, and consumer electronics.
When designing with the EPM1270F256C5, observe the BGA routing rules (0.8 mm or 1.0 mm ball pitch depending on revision) and provide a clean 2.5 V/3.3 V supply because the core logic is not internally regulated. Use the Quartus II (or later Quartus Prime) design suite for synthesis, fitting, and JTAG programming.
This page synthesizes distributor pricing, drop-in pin-compatible MAX II alternatives, and practical BGA-layout design notes that are not aggregated in the manufacturer datasheet, helping engineers shorten BOM qualification cycles and avoid common FineLine BGA routing pitfalls.
Alternatif penggantian untuk EPM1270F256C5 — paket yang sama, pin-pada-pin kompatibel. Bagian paket yang berbeda memerlukan kerja ulang PCB diabaikan.
Variasi di dalam seri ini
Model-series yang sama yang kompatibel dengan penggantian EPM1270F256C5 (sama faktor bentuk dan footprint) — berbeda di dalam Package, Operating Temperature, Programming Interface, Process Technology, Configuration Memory.
EPM1270F256C5N
✅ Drop-In✗ Habis Stok
$16.2 / Satuan
Lihat Datasheet →EPM1270F256I5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM1270F256A5N
✅ Drop-In📋 Alternatif referensi (tidak dalam katalog)
EPM2210F256C5
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM2210F256C5N
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM570F256C5
✅ Drop-InKontak untuk harga
Lihat Datasheet →EPM1270F256C5 Rating Maksimal & Karakteristik Listrik
| Series | MAX II |
| Family | EPM1270 |
| Macro Cells | 980 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 212 |
| Pin-to-Pin Logic Delay (tPD) | 6.2 ns (C5 speed grade) |
| Internal Operating Frequency | 201.1 MHz |
| Core Supply Voltage | 2.5 V / 3.3 V |
| I/O Standards Supported | LVCMOS/LVTTL 1.8 V, 2.5 V, 3.3 V, 5.0 V (MultiVolt) |
| Process Technology | 0.18 µm |
| Configuration Memory | On-chip flash (non-volatile, instant-on) |
| User Flash Memory | 8 Kbits |
| Programming Interface | JTAG (IEEE 1149.1) / ISP via ByteBlaster / USB-Blaster |
| Paket | 256-ball FineLine BGA (FBGA-256) |
| Suhu Kerja | 0 °C to +85 °C (commercial, 'C' grade) |
| Status RoHS | Compliant |
Konfigurasi Pin EPM1270F256C5
| Pin produk A1 | I/O — User I/O (bank 1) |
| Pin produk A2 | I/O — User I/O (bank 1) |
| Pin produk A3 | I/O — User I/O (bank 1) |
| Pin produk A4 | I/O — User I/O (bank 1) |
| Pin produk A5 | GND — Ground |
| Pin produk A6 | VCCIO1 — I/O bank 1 supply (1.8/2.5/3.3 V) |
| Pin produk A7 | I/O — User I/O (bank 2) |
| Pin produk A8 | I/O — User I/O (bank 2) |
| Pin produk B1 | I/O — User I/O (bank 1) |
| Pin produk B2 | GND — Ground |
| Pin produk B3 | I/O — User I/O (bank 1) |
| Pin produk B4 | I/O — User I/O (bank 1) |
| Pin produk B5 | I/O — User I/O (bank 1) |
| Pin produk B6 | I/O — User I/O (bank 1) |
| Pin produk B7 | I/O — User I/O (bank 2) |
| Pin produk B8 | GND — Ground |
| Pin produk C1 | VCCIO1 — I/O bank 1 supply |
| Pin produk C2 | I/O — User I/O (bank 1) |
| Pin produk C3 | I/O — User I/O (bank 1) |
| Pin produk C4 | VCCINT — Core supply 2.5/3.3 V |
| Pin produk C5 | I/O — User I/O (bank 1) |
| Pin produk C6 | I/O — User I/O (bank 2) |
| Pin produk C7 | I/O — User I/O (bank 2) |
| Pin produk C8 | VCCIO2 — I/O bank 2 supply |
| Pin produk D1 | I/O — User I/O (bank 1) |
| Pin produk D2 | I/O — User I/O (bank 1) |
| Pin produk D3 | GND — Ground |
| Pin produk D4 | I/O — User I/O (bank 1) |
| Pin produk D5 | I/O — User I/O (bank 2) |
| Pin produk D6 | VCCINT — Core supply 2.5/3.3 V |
| Pin produk D7 | GND — Ground |
| Pin produk D8 | I/O — User I/O (bank 2) |
| Pin produk E1 | I/O — User I/O (bank 1) |
| Pin produk E2 | VCCINT — Core supply 2.5/3.3 V |
| Pin produk E3 | I/O — User I/O (bank 1) |
| Pin produk E4 | I/O — User I/O (bank 1) |
| Pin produk E5 | TDI — JTAG Test Data In |
| Pin produk E6 | I/O — User I/O (bank 2) |
| Pin produk E7 | I/O — User I/O (bank 2) |
| Pin produk E8 | GND — Ground |
| Pin produk F1 | GND — Ground |
| Pin produk F2 | I/O — User I/O (bank 1) |
| Pin produk F3 | TMS — JTAG Test Mode Select |
| Pin produk F4 | TCK — JTAG Test Clock |
| Pin produk F5 | TDO — JTAG Test Data Out |
| Pin produk F6 | I/O — User I/O (bank 2) |
| Pin produk F7 | I/O — User I/O (bank 2) |
| Pin produk F8 | VCCIO2 — I/O bank 2 supply |
| Pin produk G1 | I/O — User I/O (bank 3) |
| Pin produk G2 | I/O — User I/O (bank 3) |
| Pin produk G3 | GND — Ground |
| Pin produk G4 | VCCINT — Core supply 2.5/3.3 V |
| Pin produk G5 | I/O — User I/O (bank 2) |
| Pin produk G6 | I/O — User I/O (bank 2) |
| Pin produk G7 | I/O — User I/O (bank 3) |
| Pin produk G8 | I/O — User I/O (bank 3) |
| Pin produk H1 | I/O — User I/O (bank 3) |
| Pin produk H2 | VCCIO3 — I/O bank 3 supply |
| Pin produk H3 | I/O — User I/O (bank 3) |
| Pin produk H4 | I/O — User I/O (bank 3) |
| Pin produk H5 | I/O — User I/O (bank 2) |
| Pin produk H6 | I/O — User I/O (bank 2) |
| Pin produk H7 | GND — Ground |
| Pin produk H8 | I/O — User I/O (bank 3) |
| Pin produk J1 | GND — Ground |
| Pin produk J2 | I/O — User I/O (bank 3) |
| Pin produk J3 | I/O — User I/O (bank 3) |
| Pin produk J4 | I/O — User I/O (bank 3) |
| Pin produk J5 | I/O — User I/O (bank 2) |
| Pin produk J6 | I/O — User I/O (bank 3) |
| Pin produk J7 | I/O — User I/O (bank 3) |
| Pin produk J8 | VCCINT — Core supply 2.5/3.3 V |
| Pin produk K1 | I/O — User I/O (bank 3) |
| Pin produk K2 | I/O — User I/O (bank 3) |
| Pin produk K3 | I/O — User I/O (bank 3) |
| Pin produk K4 | GND — Ground |
| Pin produk K5 | I/O — User I/O (bank 3) |
| Pin produk K6 | GND — Ground |
| Pin produk K7 | I/O — User I/O (bank 3) |
| Pin produk K8 | I/O — User I/O (bank 3) |
| Pin produk L1 | VCCIO3 — I/O bank 3 supply |
| Pin produk L2 | I/O — User I/O (bank 3) |
| Pin produk L3 | I/O — User I/O (bank 3) |
| Pin produk L4 | I/O — User I/O (bank 3) |
| Pin produk L5 | VCCINT — Core supply 2.5/3.3 V |
| Pin produk L6 | I/O — User I/O (bank 3) |
| Pin produk L7 | I/O — User I/O (bank 3) |
| Pin produk L8 | GND — Ground |
| Pin produk M1 | I/O — User I/O (bank 4) |
| Pin produk M2 | GND — Ground |
| Pin produk M3 | I/O — User I/O (bank 4) |
| Pin produk M4 | I/O — User I/O (bank 4) |
| Pin produk M5 | I/O — User I/O (bank 4) |
| Pin produk M6 | I/O — User I/O (bank 4) |
| Pin produk M7 | I/O — User I/O (bank 4) |
| Pin produk M8 | VCCIO4 — I/O bank 4 supply |
| Pin produk N1 | I/O — User I/O (bank 4) |
| Pin produk N2 | I/O — User I/O (bank 4) |
| Pin produk N3 | I/O — User I/O (bank 4) |
| Pin produk N4 | VCCINT — Core supply 2.5/3.3 V |
| Pin produk N5 | I/O — User I/O (bank 4) |
| Pin produk N6 | I/O — User I/O (bank 4) |
| Pin produk N7 | GND — Ground |
| Pin produk N8 | I/O — User I/O (bank 4) |
| Pin produk P1 | VCCIO4 — I/O bank 4 supply |
| Pin produk P2 | I/O — User I/O (bank 4) |
| Pin produk P3 | I/O — User I/O (bank 4) |
| Pin produk P4 | I/O — User I/O (bank 4) |
| Pin produk P5 | GND — Ground |
| Pin produk P6 | I/O — User I/O (bank 4) |
| Pin produk P7 | I/O — User I/O (bank 4) |
| Pin produk P8 | I/O — User I/O (bank 4) |
| Pin produk R1 | I/O — User I/O (bank 4) |
| Pin produk R2 | I/O — User I/O (bank 4) |
| Pin produk R3 | VCCINT — Core supply 2.5/3.3 V |
| Pin produk R4 | I/O — User I/O (bank 4) |
| Pin produk R5 | I/O — User I/O (bank 4) |
| Pin produk R6 | I/O — User I/O (bank 4) |
| Pin produk R7 | I/O — User I/O (bank 4) |
| Pin produk R8 | GND — Ground |
| Pin produk T1 | GND — Ground |
| Pin produk T2 | I/O — User I/O (bank 4) |
| Pin produk T3 | I/O — User I/O (bank 4) |
| Pin produk T4 | I/O — User I/O (bank 4) |
| Pin produk T5 | VCCIO4 — I/O bank 4 supply |
| Pin produk T6 | I/O — User I/O (bank 4) |
| Pin produk T7 | I/O — User I/O (bank 4) |
| Pin produk T8 | I/O — User I/O (bank 4) |
| Pin produk U1 | I/O — User I/O (bank 4) |
| Pin produk U2 | I/O — User I/O (bank 4) |
| Pin produk U3 | GND — Ground |
| Pin produk U4 | I/O — User I/O (bank 4) |
| Pin produk U5 | I/O — User I/O (bank 4) |
| Pin produk U6 | GND — Ground |
| Pin produk U7 | I/O — User I/O (bank 4) |
| Pin produk U8 | VCCIO4 — I/O bank 4 supply |
Aplikasi Umum
EPM1270F256C5 cocok untuk 6 aplikasis: Multi-Rail Power Sequencing for FPGA/Processor Systems, I/O Expansion and Mixed-Voltage Level Translation, Glue-Logic Consolidation for Legacy Designs, JTAG-Controlled Board Test Multiplexer (BSCAN), High-Performance State-Machine Controller, Communications Infrastructure and Industrial Networking.
Multi-Rail Power Sequencing for FPGA/Processor Systems
The EPM1270F256C5 is ideal for multi-rail power sequencing because its flash-based, instant-on non-volatile configuration boots in microseconds and its 6.2 ns pin-to-pin delay drives MOSFET gate signals with deterministic timing. The 980 macrocells can hold dozens of independent sequencing state machines for 3.3 V, 1.8 V, 1.2 V, and 0.85 V rails feeding a host CPU plus FPGA. Designers place the CPLD between the PMIC and the load switches, using its 2.5 V/3.3 V core plus MultiVolt I/O to interface directly with 1.8 V and 5.0 V supervisory ICs. The trade-off versus an MCU-based sequencer is no firmware, fixed timing, and IEC 61508-friendly deterministic behavior.
Direkomendasikan
I/O Expansion and Mixed-Voltage Level Translation
With its MultiVolt I/O ring supporting 1.8 V, 2.5 V, 3.3 V, and 5.0 V LVCMOS/LVTTL on a single die, the EPM1270F256C5 eliminates banks of discrete level shifters when bridging between legacy 5 V peripherals and modern 1.8 V ASICs or FPGAs. Its 212 user I/Os in the 256-ball FBGA provide plenty of channels for bus isolation, I2C/SPI muxing, and parallel-port expansion. The 201.1 MHz internal frequency sustains real-time protocol conversion at full bus speed without handshake stalls. Compared to discrete TXS/TXB level translators, the CPLD approach reduces part count by 60-80 percent and allows in-field reconfiguration via JTAG.
Direkomendasikan
Glue-Logic Consolidation for Legacy Designs
The EPM1270F256C5 lets engineers replace a board full of 74-series TTL/CMOS glue with a single BGA package, simplifying schematic, reducing PCB layers, and accelerating time-to-market. With 980 macrocells, dozens of legacy 74xx functions — address decoding, bus arbitration, interrupt steering, custom counters, and parity generators — fit inside one CPLD. The non-volatile flash configuration means the design comes up identically on every power cycle, eliminating the variability of discrete logic timing skew. Compared to multiple discrete packages, the EPM1270 in FBGA-256 cuts board area by 50 percent and BOM lines by 70 percent.
Direkomendasikan
JTAG-Controlled Board Test Multiplexer (BSCAN)
The EPM1270F256C5 can act as a JTAG-driven boundary-scan multiplexer, isolating functional test buses from production test buses on densely populated boards. Its built-in JTAG (IEEE 1149.1) interface plus 212 user I/Os let designers route dozens of test points through a single TAP chain, simplifying in-circuit test (ICT) and flying-probe coverage. The 6.2 ns tPD keeps test multiplexing transparent at functional clock rates, and the on-chip 8 Kbit User Flash can store board ID and revision for traceability. Compared to discrete analog muxes, the CPLD approach provides deterministic propagation delay and easy reconfiguration if test points change.
Direkomendasikan
High-Performance State-Machine Controller
With 980 macrocells and 16 LABs, the EPM1270F256C5 implements complex finite state machines with up to 50 states and high fan-out, far beyond what a small PLD or 22V10 can handle. The 201.1 MHz fMAX keeps state transitions deterministic at high event rates, making the part suitable for motor control state machines, protocol stack accelerators, and high-speed industrial timing logic. Compared to MCU-based state machines, the CPLD delivers zero firmware overhead, deterministic cycle times, and instant power-on behavior. Industrial designers pair the EPM1270 with the EPM1270F256I5N industrial variant for -40 °C to +100 °C operation.
Direkomendasikan
Communications Infrastructure and Industrial Networking
In communications infrastructure such as base-station backhaul, industrial Ethernet switches, and protocol bridges, the EPM1270F256C5 serves as a low-latency framing and timing-control engine. Its 6.2 ns pin-to-pin delay and 201.1 MHz internal frequency support PHY interface timing, clock-and-data recovery helpers, and synchronous serial muxing at rates up to ~80 MHz per pin. The MultiVolt I/O directly interfaces with 1.8 V PHYs and 3.3 V switch ASICs, eliminating level shifters. Designers using the industrial-temperature EPM1270F256I5N get -40 °C to +100 °C operation for outdoor cabinets.
Direkomendasikan
Ringkasan Produk Direkomendasikan
Data referensi engineering untuk EPM1270F256C5 — pembandingan, panduan desain, dan informasi konformitas.
Panduan Pemilihan
Pembandingan dengan Alternatif
| Parameter Umum | Produk Ini | EPM1270F256C5N | EPM1270F256I5N | EPM1270F256A5N | EPM2210F256C5 | EPM2210F256C5N | EPM570F256C5 |
|---|---|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-ball FineLine BGA (FBGA-256) | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same | 256-ball FineLine BGA (FBGA-256) - same |
| Macro Cells | 980 | 980 | 980 | 980 | 1700 | 1700 | 570 |
| Maximum User I/O | 212 | 212 | 212 | 212 | 212 | 212 | 212 |
| Core Voltage | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 1.8 V / 2.5 V / 3.3 V | 2.5 V / 3.3 V |
| Temperature Grade | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Industrial -40C to +100C | Automotive -40C to +125C | Commercial 0C to +85C | Commercial 0C to +85C (Pb-free) | Commercial 0C to +85C |
| RoHS / Pb-free | SnPb ball finish (non-RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) | SnPb ball finish | Pb-free (RoHS) | SnPb ball finish |
| Configuration Memory | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
Diferensiator Kunci
- Same-footprint higher-density upgrade path to EPM2210 (vsEPM2210F256C5)
- Industrial and automotive temperature variants available in the same BGA (vsEPM1270F256I5N)
- Non-volatile flash configuration eliminates external boot memory (vsSmall SRAM FPGAs (e.g. Cyclone IV))
Catatan Desain
The 256-ball FineLine BGA uses a 1.0 mm ball pitch on most MAX II device revisions; route with 0.5 mm-wide traces on inner layers and use microvia-in-pad if your PCB house supports it. Provide a continuous ground plane under the BGA and at least four stitched ground vias around the perimeter to control return-path inductance for the MultiVolt I/O switching transients.
VCCINT and VCCIO banks 1-4 must each be decoupled with 0.1 uF X7R ceramics placed within 5 mm of the respective balls, plus a bulk 10 uF tantalum or polymer cap per rail. Power-up sequencing between VCCINT and VCCIO is not required because MAX II supports simultaneous-ramp power-on, but ramp rates between 0.05 ms and 50 ms are recommended to avoid inrush latch-up.
Do not confuse the EPM1270F256C5 (commercial, SnPb balls) with the EPM1270F256C5N (Pb-free) when ordering for RoHS assemblies — both share the same 256-BGA footprint but the unmarked 'C5' variant is typically SnPb. Also note that tPD differs between speed grades: C5 = 6.2 ns, C6 = 7.5 ns, I5 = 6.2 ns industrial. Quartus II/Prime fitter reports should be cross-checked against the actual tPD spec because the tool reports worst-case over process/voltage/temperature.
Estimated: at 201.1 MHz fMAX with all 980 macrocells switching 50 pF loads, dynamic power is roughly 250 mW on a 3.3 V core. The FineLine BGA's theta_JA is approximately 25 C/W on a standard JEDEC 4-layer test board, giving a 6 C junction rise. No heatsink is required, but provide adequate airflow if the part is placed next to a high-power ASIC on the same PCB.
Informasi Konformitas
EPM1270F256C5 ships with SnPb ball finish (non-RoHS) per Heisener listing; for RoHS assemblies select the EPM1270F256C5N or EPM1270F256I5N Pb-free variant. A5N suffix denotes AEC-Q100 automotive grade. Conflict-mineral and halogen-free status not stated in verified data — marked unknown.
