H58G56AK6PX032 - 32Gb LPDDR5-6400 Automotive DRAM | SK Hynix
MPN: H58G56AK6PX032 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.2 | $262.00 |
| 100 | $24.1 | $2,410.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $20.9 | $20,900.00 |
Drop-in alternatives for H58G56AK6PX032 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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H58G56AK6PX032N
✅ Drop-In✓ In Stock
$11.35 / Unit
View Datasheet →H58G46AK6PX033
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$1 / Unit
View Datasheet →H58G46AK6PX033N
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Contact for price
View Datasheet →H58G46AK6QX033
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$9.75 / Unit
View Datasheet →H5CG46AGBDX015
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$4.95 / Unit
View Datasheet →H58G56AK6PX032 Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5 SDRAM |
| Density | 32Gb (4GB) |
| Organization | 512M x 64 |
| Data Rate | 6400 Mbps/pin |
| Bus Width | x16 (x64 per datasheet listing) |
| VDD2 Supply Voltage | 1.8 V |
| VDD1 Supply Voltage | 1.05 V |
| VDDQ Supply Voltage | 0.5 V |
| Package | FBGA-315 |
| Mounting Type | Surface Mount |
| Grade | Automotive |
| Applications | Automotive infotainment, ADAS, edge computing |
| Lifecycle Status | Active |
H58G56AK6PX032 fbga-315 Pin Configuration Guide
Complete pinout information for H58G56AK6PX032 (fbga-315 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H58G56AK6PX032.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H58G56AK6PX032 is suitable for 6 applications: Automotive ADAS Domain Controller, Automotive Infotainment Head Unit, Surround-View Camera Processing, Telematics and Connectivity Gateway, Industrial Edge AI Computing Module, Data Logging and Event Recorders.
Automotive ADAS Domain Controller
The H58G56AK6PX032's 6400 Mbps/pin LPDDR5 interface delivers approximately 51.2 GB/s of peak bandwidth on the x64 bus, which is the level demanded by modern ADAS perception stacks that must fuse surround-camera, radar, and lidar data in real time. Its 32Gb (4GB) capacity in one package provides the frame-buffer and neural-network scratch-pad memory required by sensor-fusion and object-detection workloads. The device is placed directly adjacent to the automotive SoC with short, length-matched fly-by routing to preserve signal integrity at speed. Unlike LPDDR4X, LPDDR5's WCK clocking architecture reduces clock-tree power, lowering total memory subsystem dissipation in thermally constrained engine-bay-adjacent enclosures.
Recommended
Automotive Infotainment Head Unit
In-vehicle infotainment platforms run multi-display clusters, navigation, and voice assistants concurrently, requiring 4GB-class working memory. The H58G56AK6PX032 supplies 32Gb of LPDDR5 at 6400 Mbps/pin, giving head-unit SoCs the bandwidth to drive multiple high-resolution displays while keeping response latency low. Its automotive-grade qualification addresses the extended temperature, vibration, and lifetime requirements of cabin electronics. The three-rail power architecture (1.8V VDD2, 1.05V VDD1, 0.5V VDDQ) allows the power tree to scale VDDQ dynamically, cutting standby draw when the vehicle is parked - a key factor for battery-drain compliance in always-connected vehicles.
Recommended
Surround-View Camera Processing
Surround-view parking and 360-degree camera systems must capture, stitch, and undistort four or more camera streams simultaneously. The H58G56AK6PX032's high data rate sustains the sustained write bandwidth of multiple concurrent video DMA streams, while its 4GB density holds multiple frames per camera plus the stitching workspace. Placed next to the camera-processing SoC, the FBGA-315 package keeps traces short, preserving eye margins at 6400 Mbps. LPDDR5's per-bank refresh reduces bus contention during isochronous video traffic, and deep power-down modes let the module meet the low quiescent draw demanded when the camera system is off.
Recommended
Telematics and Connectivity Gateway
Connected-vehicle gateways handle LTE/5G modems, V2X radios, and edge analytics, combining bursty network traffic with sustained data processing. The H58G56AK6PX032 provides 4GB of LPDDR5 working memory whose 6400 Mbps/pin rate absorbs modem bursts and TLS session buffering without stalling the gateway CPU. Automotive qualification makes it suitable for always-powered installations where the module must survive cold-crank and load-dump supply events through the host power design. The 0.5V VDDQ rail minimizes I/O power during sustained wireless transfers, and self-refresh mode retains session state through brief host sleeps, enabling fast resume for over-the-air update windows.
Recommended
Industrial Edge AI Computing Module
Industrial edge-AI modules for machine vision, predictive maintenance, and robotics inference need memory bandwidth comparable to automotive SoCs but in rugged fanless enclosures. The H58G56AK6PX032's 51.2 GB/s-class bandwidth feeds on-device CNN inference accelerators, while its LPDDR5 dynamic voltage scaling keeps module thermal budgets manageable without heatsinks or fans in sealed housings. Its FBGA-315 footprint supports dense memory placement beside the compute SoC on small SoM form factors. Designers should allocate PCB layers for length-matched LPDDR5 routing and use the manufacturer's layout guidelines; at 6400 Mbps, controlled-impedance stackup and reference-plane continuity are the primary determinants of pass/fail signal integrity.
Recommended
Data Logging and Event Recorders
Event data recorders and forensic vehicle loggers must buffer high-rate sensor streams in volatile memory before committing them to NAND storage. The H58G56AK6PX032's 32Gb capacity provides seconds of full-rate buffer headroom, absorbing NAND write-latency stalls without dropping samples, and its 6400 Mbps interface keeps the buffer drain time short so the logger is ready for the next event window. Automotive-grade construction suits recorders that must operate across the full vehicle temperature envelope and retain reliability for the vehicle lifetime. Deep power-down minimizes drain on the battery-backed supply rail when the recorder is in standby.
Recommended
Recommended Products Summary
Engineering reference data for H58G56AK6PX032 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H58G56AK6PX032N | H58G46AK6PX033 | H58G46AK6PX033N | H58G46AK6QX033 |
|---|---|---|---|---|---|
| Package | FBGA-315 | FBGA-315 - same | FBGA-315 - same | FBGA-315 - same | FBGA-315 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 32Gb (4GB) | 32Gb (4GB) | 16Gb (2GB) | 16Gb (2GB) | 16Gb (2GB) |
| Data Rate | 6400 Mbps/pin | 6400 Mbps/pin | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Memory Type | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 | LPDDR5 |
| Supply Rails | 1.8V / 1.05V / 0.5V | 1.8V / 1.05V / 0.5V | 1.8V / 1.05V / 0.5V (LPDDR5 standard) | 1.8V / 1.05V / 0.5V (LPDDR5 standard) | 1.8V / 1.05V / 0.5V (LPDDR5 standard) |
| Grade | Automotive | Automotive | Automotive | Automotive | Automotive |
| Indicative Unit Price (qty 1) | $28.50 (as of 2026-09-05) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Full 32Gb (4GB) density in a single package (vs H58G46AK6PX033)
- 6400 Mbps/pin automotive LPDDR5 (vs H58G46AK6QX033)
- Identical footprint to packing-code variant (vs H58G56AK6PX032N)
Design Notes
At 6400 Mbps/pin, LPDDR5 signal integrity dominates design success. Keep CA and DQ traces length-matched within the tolerance specified in the SK Hynix LPDDR5 design guide, route over continuous reference planes, and control single-ended impedance near 40 ohms for DQ. Minimize via transitions on WCK and DQS lines; each via adds impedance discontinuity. Simulate the full channel (SoC die, package, PCB) rather than PCB-only, and follow the SoC vendor's memory-training validation plan across temperature before releasing the layout.
LPDDR5 uses three rails: VDD2 1.8V, VDD1 1.05V, and VDDQ 0.5V. The VDDQ rail carries the highest transient currents during burst writes, so place a dedicated buck converter or LDO close to the ball with bulk capacitance sized per the datasheet and local high-frequency decoupling on every supply ball. Estimated: at 6400 Mbps with sustained traffic, VDDQ transient currents can reach amperes; verify with the DRAM current-profile model from SK Hynix and ensure the regulator's load-transient response keeps VDDQ within its tolerance window.
Reserve at least two internal routing layers for the LPDDR5 bus and place the H58G56AK6PX032 within approximately 10-15 mm of the SoC to minimize fly-by skew. Follow the package pin-map breakout pattern to avoid necking traces between balls. Use ground-stitch vias along bus routing return paths and avoid splitting the reference plane under the memory bus. For automotive platforms, add the manufacturer-recommended ESD protection on externally accessible lines and review the layout against the SoC vendor's LPDDR5 reference design before fabrication.
Do not assume cross-brand LPDDR5 compatibility: Micron MT53E-series parts match performance but use different FBGA ball counts, so the footprint must be redesigned. Also confirm the N-suffixed ordering code (H58G56AK6PX032N) is covered by your controller qualification and approved-vendor list before production substitution. Finally, obtain the official RoHS/material declarations from SK Hynix under NDA - distributor pages do not carry authoritative environmental data for automotive memory.
Compliance Information
Public distributor data does not state RoHS/REACH status. The device is marketed as automotive-grade per GlobalSpec listing. Obtain official material declarations from SK Hynix (IPC-1752A or equivalent) before release.
