H5ANAG6NCR-RDC - 16Gb DDR4 SDRAM 3200Mbps x16 | SK Hynix
部品番号: H5ANAG6NCR-RDC ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $85.23 | $85.23 |
| 10 | $82 | $820.00 |
| 100 | $78.5 | $7,850.00 |
| 500 | $75.2 | $37,600.00 |
| 1,000 | $72.1 | $72,100.00 |
H5ANAG6NCR-RDC 概要
DDR4 SDRAM (Double Data Rate Fourth Generation Synchronous Dynamic Random Access Memory) is the dominant main-memory technology for servers, workstations, embedded computing, and networking equipment. As a class of volatile semiconductor memory, DDR4 DRAM sits within the broader memory hierarchy of DRAM -> volatile memory -> semiconductor memory, succeeding DDR3 with lower operating voltage (1.2V vs 1.5V), higher bank counts (16 banks via bank groups), and improved signaling using DBI (Data Bus Inversion), CRC, and CA parity.
Key features of the H5ANAG6NCJR device family include auto self-refresh, auto precharge function, asynchronous reset function, data mask (DM) function, dynamic on-chip termination (ODT), ZQ calibration, CRC function, and write leveling. The x16 organization suits designs with narrower memory buses such as embedded processors, networking line cards, and industrial controllers.
Architecturally, this 16Gb die uses DDR4 bank-group architecture enabling back-to-back data access within a bank group at the internal core rate, sustaining the 3200 Mbps (PC4-25600 class) interface speed. The 96-ball FBGA (8 mm width rectangular body) minimizes footprint and parasitic inductance for high-speed signal integrity. Internal arrays operate from a separated VDD core supply while the DQ bus supports programmable termination.
Typical applications include networking and telecom equipment, industrial automation controllers, embedded computing modules, test and measurement systems, and server-memory modules where 16-bit-wide DDR4 channels are required.
When designing with this device, observe JEDEC DDR4 routing practices: length-match DQ/DM/UDQS byte groups within ±25 mils, series-terminate the clock and strobes, and implement the asynchronous RESET pin correctly so the device remains in a known state during power sequencing. Confirm speed-grade suffix (RDC) compatibility with your memory controller calibration settings.
This page synthesizes distributor inventory and pricing, drop-in SK Hynix family alternatives, and practical DDR4 design notes not consolidated in the manufacturer datasheet. Pricing references are as of 2026-09-05.
ドロップイン代替品: H5ANAG6NCR-RDC — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: H5ANAG6NCR-RDC （同一形状・フットプリント） — 相違点: Package, Interface, Data Rate, Organization, RoHS Status.
クイック比較ツール — 並列比較する代替部品を選択:
H5ANAG6NCR-PBC
✅ ドロップイン✓ 在庫あり
$70.2 / 個
データシートを見る →H5ANAG6NBJR-RDC
✅ ドロップイン✓ 在庫あり
$9.6 / 個
データシートを見る →H5ANAG6NAMR-UHC
✅ ドロップイン✓ 在庫あり
$4.5 / 個
データシートを見る →H5ANAG6NCJR-XNC
✅ ドロップイン✓ 在庫あり
$84.97 / 個
データシートを見る →H5ANAG8NCR-RDC
✅ ドロップイン✓ 在庫あり
$1 / 個
データシートを見る →H5ANAG8NCJR-XNC
✅ ドロップイン✓ 在庫あり
$65.625 / 個
データシートを見る →H5ANAG6NCR-RDC 最大定格＆電気的特性
| メモリタイプ | DDR4 SDRAM |
| メモリサイズ | 16 Gb (2 GB) |
| メモリ構成 | 1G x 16 |
| データレート | 3200 Mbps (PC4-25600 class) |
| Supply Voltage (VDD) | 1.2 V |
| パッケージ | 96-ball FBGA |
| Package Body | Rectangular, 8 mm width |
| Maximum Standby Current | 0.074 A |
| 実装タイプ | Surface Mount |
| Number of Terminals (Balls) | 96 |
| Auto Self-Refresh | Yes |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| Data Mask (DM) Function | Yes |
| Dynamic On-Chip Termination (ODT) | Yes |
| ZQ Calibration | Yes |
| CRC Function | Yes |
| Write Leveling | Yes |
H5ANAG6NCR-RDC rectangular, 8 mm width ピン配置ガイド
H5ANAG6NCR-RDC (rectangular, 8 mm width パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: H5ANAG6NCR-RDC.
詳細は データシート をご参照ください。
主な用途
H5ANAG6NCR-RDC の用途: 6 件s: Networking and Telecom Equipment, Embedded Computing and Industrial Controllers, Server and Storage Modules, Test and Measurement Instruments, Medical Imaging and Diagnostic Systems, Video Surveillance and Broadcast.
Networking and Telecom Equipment
The H5ANAG6NCR-RDC fits switch, router, and line-card designs whose SoCs expose 16-bit DDR4 channels at up to 3200 Mbps. The x16 organization reaches line-card buffer depths with only two devices on a 32-bit bus, reducing BGA count versus x8 alternatives, while CRC and CA parity protect data integrity in continuously running infrastructure. The 96-ball FBGA at 8 mm body width supports the dense routing typical of high-port-count systems. Placed with point-to-point fly-by or star topology and per-byte ODT enabled, the interface sustains full 3200 Mbps timing margins; DDR4's asynchronous RESET guarantees a defined state across system reboots, important for carrier-grade uptime requirements.
おすすめ
Embedded Computing and Industrial Controllers
Industrial automation controllers and embedded computers use the H5ANAG6NCR-RDC for main memory where its 1.2V supply lowers system power and heat versus DDR3 designs. The 16Gb density per device enables 4 GB+ memory on industrial motherboards with a few components, and auto self-refresh preserves memory contents in suspend-to-RAM low-power states common in factory HMI panels. With 0.074 A maximum standby current, battery-backed or always-on auxiliary systems see minimal drain. The ZQ calibration feature maintains termination accuracy across industrial temperature swings, sustaining 3200 Mbps signaling reliability on cost-effective 4-6 layer PCBs without exotic materials.
おすすめ
Server and Storage Modules
For storage controllers, memory buffers, and BMC subsystems, the H5ANAG6NCR-RDC supplies 2 GB per device at DDR4-3200 bandwidth. The 16-bit organization complements 64/72-bit UDIMM and RDIMM topologies, and the same-package x8 SK Hynix siblings allow ECC-enabled designs by mixing rank width with the x72 ECC byte. CRC and write leveling support reliable operation on long-module routing with multiple ranks, while dynamic ODT optimizes termination per rank during reads and writes. The FBGA-96 footprint reuses standard DDR4 module land patterns, so module designers can drop this part into existing certified layouts and re-qualify timing only at the new grade.
おすすめ
Test and Measurement Instruments
Oscilloscopes, signal generators, and protocol analyzers require deep capture memory fed by wide, fast DRAM banks. The H5ANAG6NCR-RDC provides 16Gb per device at 3200 Mbps, letting instrument designers build multi-GB capture buffers with four to eight devices on 32- or 64-bit buses. Write leveling and ZQ calibration sustain signal integrity across the long, matched-length routing typical of instrument main boards, and the asynchronous RESET input lets the FPGA/ASIC memory controller reinitialize the DRAM subsystem deterministically after configuration. The 1.2V rail simplifies power sequencing relative to multi-voltage legacy DRAM designs in precision instruments.
おすすめ
Medical Imaging and Diagnostic Systems
Ultrasound and digital radiography platforms buffer large image streams at sustained rates; the H5ANAG6NCR-RDC's 3200 Mbps x16 interface delivers the write bandwidth needed for multi-megapixel frame capture, while 16Gb density supports multi-second cineloop storage per device pair. Features such as CRC and CA parity reduce silent data corruption risk in diagnostic paths, and the 96-ball FBGA's low profile fits the compact heads and console electronics of modern medical hardware. Auto self-refresh supports instant-on standby behavior required in clinics, and the low 1.2V operation contributes to meeting enclosure thermal budgets without forced airflow in patient-proximate equipment.
おすすめ
Video Surveillance and Broadcast
NVR appliances and broadcast video servers use the H5ANAG6NCR-RDC as stream-buffer memory between camera/frame inputs and storage arrays. A pair of these x16 devices provides a 32-bit DDR4-3200 channel delivering 25.6 GB/s theoretical bandwidth, sufficient to absorb multi-channel 4K ingest bursts before disk writes complete. The 16Gb-per-device density minimizes component count in space-limited recorder chassis, and dynamic ODT maintains margins on the multi-drop fly-by topologies used in these systems. Because the part is footprint-compatible with other H5ANAG6N grade suffixes, appliance makers can qualify one PCB across multiple supply sources and speed bins.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: H5ANAG6NCR-RDC — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | H5ANAG6NCR-PBC | H5ANAG6NBJR-RDC | H5ANAG6NAMR-UHC | H5ANAG8NCR-RDC | H5ANAG6NCJR-XNC |
|---|---|---|---|---|---|---|
| Package | 96-ball FBGA | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same | 96-ball FBGA - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Memory Size | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb | 16 Gb |
| Organization | x16 | x16 | x16 | x16 | x8 | x16 |
| Data Rate | 3200 Mbps (R grade) | P grade class | 3200 Mbps (R grade) | UH grade (faster bin) | 3200 Mbps (R grade) | XN grade class |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Feature Set (CRC, DM, ODT, ZQ, Write Leveling) | All supported | All supported | All supported | All supported | All supported | All supported |
主な差別化要因
- 3200 Mbps R-grade timing at 1.2V （vs H5ANAG6NCR-PBC)
- x16 organization halves device count （vs H5ANAG8NCR-RDC)
- Supply availability advantage （vs H5ANAG6NCJR-XNC)
設計ノート
Route the x16 DQ/DM/UDQS/LDQS groups as matched-length byte pairs with intra-group skew held within ±25 mils and refer them to a continuous ground plane. Enable write leveling during controller calibration to deskew DQS at the DRAM, and keep the 240-ohm 1% ZQ calibration resistor within 10 mm of the ZQ ball with a short low-inductance ground return. At 3200 Mbps, stubs longer than 5 mm on strobe nets cause reflections that show up as first-transition errors during margin testing.
Provide a dedicated 1.2V rail with bulk capacitance (2x 100 uF) plus one 0.1 uF ceramic per few balls distributed across the FBGA field to handle simultaneous switching currents during burst writes. Estimated: at 3200 Mbps with roughly 10 pF per net switching, transient currents are multi-ampere; budget the VRM for worst-case IDD read/write currents per the SK Hynix datasheet IDD tables rather than the 0.074 A standby figure. Sequence VDD and VDDQ together and hold RESET low until rails stabilize.
Do not mix x16 and x8 SK Hynix siblings on the same data bus without confirming controller support: H5ANAG8NCR-RDC changes the DQ/DM/DQS ball mapping versus this x16 part even though the 96-ball FBGA footprint is shared. Also confirm the speed-grade suffix (RDC vs PBC vs UHC) is accepted by your memory controller's calibration tables - substituting grades without re-validating is the most common cause of post-substitution boot failures in the field.
コンプライアンス情報
Compliance statements were not present in the provided web data. SK Hynix standard DDR4 products are generally lead-free/RoHS-compliant, but this must be confirmed against the official product page before claiming compliance. No AEC-Q100 automotive qualification is indicated for the standard -RDC bin.
