H5ANAG6NCR-PBC - 16Gb DDR4 SDRAM x16, FBGA-96 | SK hynix
MPN: H5ANAG6NCR-PBC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.23 | $85.23 |
| 10 | $81.5 | $815.00 |
| 100 | $77 | $7,700.00 |
| 500 | $73.5 | $36,750.00 |
| 1,000 | $70.2 | $70,200.00 |
Drop-in alternatives for H5ANAG6NCR-PBC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
H5ANAG6NCJR-XNC
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View Datasheet →H5ANAG6NBJR-PBC
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View Datasheet →H5ANAG6NCR-PBC Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 16Gb (2GB) |
| Organization | x16 (1G x 16) |
| Supply Voltage | 1.14 V to 1.26 V (nominal 1.2 V) |
| Package | FBGA-96 |
| Number of Terminals | 96 balls |
| Operating Temperature | 0C to 85C |
| Mounting Type | Surface Mount |
| Auto Self-Refresh | Yes |
| Auto Precharge | Yes |
| Asynchronous Reset | Yes |
| Data Mask | Yes |
| Dynamic ODT | Yes |
| ZQ Calibration | Yes |
| CRC Function | Yes |
| Write Leveling | Yes |
| RoHS Status | Compliant |
H5ANAG6NCR-PBC fbga-96 Pin Configuration Guide
Complete pinout information for H5ANAG6NCR-PBC (fbga-96 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for H5ANAG6NCR-PBC.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5ANAG6NCR-PBC is suitable for 6 applications: Embedded Motherboard Main Memory, FPGA-Based Industrial Control Systems, Networking and Telecom Line Cards, Test and Measurement Instrumentation, Consumer Electronics Set-Top Boxes, Automotive-Adjacent ADAS Prototyping.
Embedded Motherboard Main Memory
The H5ANAG6NCR-PBC serves as main system memory on embedded x86 and ARM motherboards where SO-DIMM or UDIMM sockets are impractical. Each x16 device delivers 2GB on a 96-ball FBGA footprint, so four devices create an 8GB, 64-bit bank with minimal board area. The 1.14V to 1.26V supply window integrates cleanly with common 1.2V DC-DC rails, and dynamic ODT plus write leveling relax trace-length matching enough for 6-8 layer stackups. Place the devices on the controller fly-by bus and complete ZQ calibration during every boot; unlike DIMMs, soldered-down DRAM needs retraining after any die swap, so validate firmware training tables against the exact speed grade in your BOM.
Recommended
FPGA-Based Industrial Control Systems
Industrial controllers built on Intel (Altera) Arria 10 or similar FPGA SoCs use the H5ANAG6NCR-PBC as buffer memory for motion control, machine vision, and real-time data logging. The 16Gb x16 organization matches the 64-bit DDR4 hard controller with four devices, and the family 3200 Mbps class supports heavy streaming bandwidth. The asynchronous reset pin allows the FPGA to deterministically reset the DRAM after watchdog events, improving recovery time in unattended factory equipment. Because industrial ambient temperatures stress timing margins, derate the controller frequency from the datasheet maximum, keep the 0C to 85C operating range in mind for uncooled cabinets, and mount decoupling capacitors on the back side directly beneath each FBGA-96 ball field.
Recommended
Networking and Telecom Line Cards
Switch, router, and 5G baseband line cards consume large packet buffers, and four H5ANAG6NCR-PBC devices provide 8GB of deep buffering on a 64-bit bus. The DDR4 CRC function protects the write data path, an advantage in telecom systems where silent bit errors translate into corrupted payloads, and bank-group architecture sustains high bus utilization under random access patterns typical of packet queuing. The 96-ball FBGA package supports dense card layouts with devices on both sides of the board. Route the fly-by command/address bus with series termination at the controller end, respect per-byte length matching of roughly 25 mils skew, and budget the 1.2V rail at approximately 74 mA standby plus switching currents per device when sizing the power tree.
Recommended
Test and Measurement Instrumentation
Oscilloscope, logic analyzer, and signal generator platforms capture gigabytes of sample data per acquisition, making the 16Gb-per-die H5ANAG6NCR-PBC an efficient capture memory. Four devices yield 8GB per 64-bit channel, and multiple channels scale in parallel. The family 3200 Mbps transfer class supports sustained write streaming from high-speed ADC front ends, while ZQ calibration maintains output impedance accuracy across the 0C to 85C range inside instruments with warm interiors. Because instrument downtime is costly, second-source flexibility matters: pin-compatible SK hynix family variants such as H5ANAG6NCJR-XNC can be swapped without PCB revision, requiring only a memory training table update in instrument firmware.
Recommended
Consumer Electronics Set-Top Boxes
4K set-top boxes and smart-home gateways need 2-4GB of DDR4 for video decode buffers and application memory, and one or two H5ANAG6NCR-PBC devices meet this with a compact 96-ball FBGA footprint. The 1.2V nominal supply supports the low standby power budgets required for always-on voice-assistant designs, with family standby current around 74 mA maximum per the Vyrian terminal data. The x16 organization pairs naturally with cost-optimized SoCs that expose 16-bit or 32-bit DDR4 controllers. Consumer BOMs reward availability and price stability, so qualifying several speed-grade suffixes within the same H5ANAG6N family lets purchasing alternate between grades as commodity DRAM spot pricing moves.
Recommended
Automotive-Adjacent ADAS Prototyping
ADAS prototype and dev-kit platforms gather camera, radar, and lidar streams into large frame buffers, and four H5ANAG6NCR-PBC devices supply 8GB per 64-bit controller channel at family-class bandwidth. Note that commodity DDR4 of this class is generally not AEC-Q100 qualified, so this part suits development platforms and non-safety production tiers rather than ASIL-rated modules; for automotive production, move to the vendor automotive-grade DRAM lines. During prototyping, the asynchronous reset input lets the SoC recover the DRAM after camera-pipeline faults without power cycling, and the CRC-enabled write path guards against frame corruption. Keep trace skews within JEDEC DDR4 guidance and re-run training whenever a die revision changes.
Recommended
Recommended Products Summary
Engineering reference data for H5ANAG6NCR-PBC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5ANAG6NCJR-XNC | H5ANAG6NBJR-PBC | H5ANAG6NAMR-UHC |
|---|---|---|---|---|
| Package | FBGA-96 | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16Gb (2GB) | 16Gb (2GB) | 16Gb (2GB) | 16Gb (2GB) |
| Organization | x16 | x16 | x16 | x16 |
| Supply Voltage | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V | 1.14 V to 1.26 V |
| Transfer Rate | [DATA_NEEDED] (PBC suffix; family class 3200 Mbps) | 3200 Mbps | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | 0C to 85C | 0C to 85C | [DATA_NEEDED] | [DATA_NEEDED] |
| Dynamic ODT / ZQ Calibration / CRC | Yes / Yes / Yes | Yes / Yes / Yes | Yes / Yes / Yes | Yes / Yes / Yes |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- 16Gb monolithic die minimizes component count (vs H5AN8G6NCJR-PBC)
- Full DDR4 feature set including CRC and dynamic ODT (vs H5ANAG6NAMR-UHC)
- Standard JEDEC DDR4 x16 footprint for second sourcing (vs H5ANAG6NCJR-XNC)
Design Notes
Route the DDR4 command/address bus in fly-by topology from the controller through each H5ANAG6NCR-PBC device, terminating at the last device. Length-match each x16 data byte group within the device ball field (target skew typically under 25 mils within a group). Dynamic ODT and write leveling relax the legacy DDR3 margin requirements, but do not skip per-byte length matching on 3200 Mbps-class buses; run IBIS simulation with the SK hynix IBIS model before tape-out.
Budget three rails: VDD and VDDQ at 1.2V nominal (1.14V-1.26V) plus VPP at 2.5V for the array pump. Distributor data indicates maximum standby current around 74 mA per device, but active read/write current on 16Gb dies can peak near 1 A per device transiently; size the VRM and bulk capacitance (at least 22 uF per device plus 0.1 uF per ball pair decoupling) accordingly. Estimated: a 4-device 64-bit bus at 1.2V can draw several amps active, so plan copper weight and rail sense points near the FBGA field.
Two frequent mistakes with this family: (1) confusing DDR4 with LPDDR4 - one distributor page mislabels the H5ANAG6N series as LPDDR4; it is standard DDR4 and is not interface-compatible with LPDDR4 controllers. (2) Ignoring the speed-grade suffix - PBC, XNC, and other suffixes carry different timing tables. Verify the PBC speed grade against the official SK hynix datasheet, configure controller CAS latency and tRCD from that table, and re-run memory training after any die-revision swap.
Compliance Information
RoHS compliance stated by JLCPCB and LCSC listings for the H5ANAG6N family. Not AEC-Q100 qualified - commodity DDR4 for consumer/industrial use. REACH, halogen-free and conflict-minerals status not stated in retrieved data.
