집적 회로

하위 카테고리

📁 ADC/DAC 3,100+ 제품 📁 증폭기 IC 1,900+ 제품 📁 오디오 코덱 18 제품 📁 오디오 IC 2 제품 📁 클록 및 타이밍 670+ 제품 📁 Comparator ICs 1 제품 📁 DSP 1,100+ 제품 📁 데이터 수집 IC 2 제품 📁 디지털 포텐셔미터 4 제품 📁 디스플레이 드라이버 및 컨트롤러 1 제품 📁 FPGA & CPLD 7,300+ 제품 📁 인터페이스 IC 3,400+ 제품 📁 LED 드라이버 1 제품 📁 로직 IC 460+ 제품 📁 메모리 IC 870+ 제품 📁 마이크로컨트롤러 20,000+ 제품 📁 마이크로프로세서 4 제품 📁 모터 드라이버 1 제품 📁 기타 1 제품 📁 Sensor and Detector Interfaces 1 제품 📁 특수 IC 15 제품 📁 비디오 IC 14 제품

제품 (39,000+)

EP4SGX530NF45C4 - Stratix IV GX 531K LE FPGA, 920 I/O | Intel
EP4SGX530NF45C4

EP4SGX530NF45C4 - Stratix IV GX 531K LE FPGA, 920 I/O | Intel

The Intel (formerly Altera) EP4SGX530NF45C4 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) delivering 531,200 logic elements, 21,248 Logic Array Blocks (LABs), and 28,033,024 bits of embedded memory in a 1932-ball Flip-Chip BGA (FC-FBGA) package. Manufactured on a 40 nm process with a 0.9 V core supply, this transceiver-rich device integrates up to 920 user I/O pins and provides 800 MHz internal fabric performance, targeting high-throughput serial connectivity applications. A Field Programmable Gate Array (FPGA) is a programmable logic device whose architecture combines configurable logic blocks (LABs/LEs), programmable interconnect, dedicated DSP blocks, on-chip memory, and (in GX variants) multi-gigabit transceivers. Stratix IV GX sits within Intel/Altera's high-end FPGA hierarchy as a 40 nm transceive-capable family: FPGA > programmable logic > SRAM-based configuration > Stratix IV > GX transceiver series. The architecture enables hardware-level parallelism for DSP, packet processing, and ASIC prototyping without sacrificing I/O density. Key features of the EP4SGX530NF45C4 include 531,200 logic elements, 28 Mb embedded memory, integrated 8.5 Gbps multi-gigabit transceivers (Stratix IV GX family), 920 high-speed user I/O lanes, embedded DSP blocks for fixed/floating-point arithmetic, and hard PCIe Gen1/Gen2 IP cores. The -C4 speed grade balances timing margin and Fmax, while the NF45 (1932-ball, 42.5 x 42.5 mm) package maximizes I/O density for line-card and backplane designs. Typical applications include 40G/100G optical transport line cards, high-speed serial protocol bridging (PCIe Gen2, Serial RapidIO, XAUI, SFI), ASIC prototyping, broadcast video processing, radar and signal-intelligence front-ends, and high-performance computing (HPC) fabric. Industrial and military-aerospace variants in the Stratix IV family deliver extended temperature ranges and ruggedized packaging. When designing with this device, plan power integrity carefully - the FC-FBGA substrate demands a 12+ layer PCB with continuous ground and dedicated decoupling per transceiver bank. JTAG and active serial configuration via EPCS flash is recommended for production. Lead-free and RoHS compliant per Intel product declaration. This page synthesizes distributor pricing, package-specific drop-in alternatives, and engineering trade-offs not found in the standalone datasheet, enabling faster sourcing and design-in decisions.

견적 요청 문의하기
EP4SGX530NF45C4N - Stratix IV GX FPGA, 531K LE, 1932-FCBGA | Intel
EP4SGX530NF45C4N

EP4SGX530NF45C4N - Stratix IV GX FPGA, 531K LE, 1932-FCBGA | Intel

The Intel (formerly Altera) EP4SGX530NF45C4N is a high-density, high-performance Stratix IV GX Field-Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process and housed in a 1932-ball flip-chip BGA (NF45 package). The device integrates 531,200 logic elements, 28,033,024 bits of embedded memory, 21248 LABs/CLBs, 920 user I/Os, and embedded transceivers for high-speed serial connectivity, making it one of the largest members of the Stratix IV GX family. A Field-Programmable Gate Array (FPGA) is a type of programmable logic device that combines configurable logic blocks, programmable interconnect, programmable I/O, and on-chip memory into a single semiconductor. Within the system hierarchy, FPGAs sit between Application-Specific ICs (ASICs) and general-purpose processors, offering ASIC-like performance and parallelism with the re-programmability of software. Stratix IV GX devices extend this model with multi-gigabit transceivers, hard PCIe and memory controller IP blocks, and DSP blocks, so the EP4SGX530NF45C4N is used wherever designers need ASIC-class throughput without paying NRE costs. Key features of the EP4SGX530NF45C4N include 531,200 logic elements (the highest density option in the Stratix IV GX family), 28 Mb of embedded SRAM, 24 transceivers supporting data rates up to 8.5 Gbps, 920 user I/Os in 24 banks, 1,024 18x18 multipliers for DSP, an 0.9 V core voltage, and hard PCI Express Gen1/Gen2 IP blocks. The -C4 speed grade targets the highest performance corner; the N suffix denotes a lead-free, RoHS-compliant package. Architecturally, the device uses Altera's adaptive logic module (ALM) which combines 8-input fracturable LUTs with two adders, allowing designs to map to either fine-grained logic or arithmetic-heavy structures. Combined with the hard transceiver PCS/PMA blocks and the TriMatrix memory architecture (MLAB, M9K, M144K blocks), the EP4SGX530NF45C4N supports >1500 GMACS of fixed-point DSP performance at typical operating conditions. Typical applications include high-end telecommunications line cards (100G/40G OTN, packet processing), ASIC prototyping and emulation, high-performance computing fabrics, military/aerospace signal processing, broadcast video processing, medical imaging systems, and test and measurement equipment. Designers choose this density for system-on-chip emulation or when integrating an entire line-card datapath into a single FPGA. When designing with the EP4SGX530NF45C4N, careful PCB layout is essential: the FC-FBGA-1932 substrate requires microvia stack-up design, length-matched differential pairs for transceivers, and substantial decoupling (typically 100 nF + 10 µF per VCC/GND pair). The 0.9 V core is sensitive to IR drop; use at least four PCB layers dedicated to power/ground. Designers should plan for Quartus II (legacy) or Quartus Prime design software and a 12-16 week lead time given the part is now NRND. This page synthesizes distributor inventory, Stratix IV GX family drop-in alternatives, and PCB layout considerations not typically consolidated in the manufacturer datasheet.

견적 요청 문의하기
EP4SGX530NF45I3 - Stratix IV GX FPGA 531K LE, 24 Transceivers | Intel
EP4SGX530NF45I3

EP4SGX530NF45I3 - Stratix IV GX FPGA 531K LE, 24 Transceivers | Intel

The Intel EP4SGX530NF45I3 is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) built on a 40 nm process, delivering 531,200 logic elements, 28,033,024 bits of embedded memory, and 920 user I/O pins in a 1932-ball Flip-Chip BGA (FC-FBGA, NF45 package). It integrates up to 24 high-speed transceivers operating at up to 8.5 Gbps, making it one of the most capable FPGAs in the Stratix IV GX family for high-bandwidth serial interfaces. A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic, interconnect, and I/O behavior can be reconfigured after manufacturing by the user. Within the broader programmable-logic taxonomy, an FPGA sits between fixed-function ASICs (which cannot be changed) and microcontrollers (which run software) - it offers ASIC-class parallelism with field-upgradeable hardware. The Stratix IV family belongs to Intel's high-performance FPGA line, with the GX suffix denoting the integrated multi-gigabit transceiver (MGT) blocks used for protocols such as PCIe Gen1/Gen2, Gigabit Ethernet, Serial RapidIO, XAUI, and Custom Interlaken. Key features of the EP4SGX530NF45I3 include 21,248 Logic Array Blocks (LABs), 24 full-duplex transceiver channels with 8B/10B encoder/decoder and clock compensation compliant with IEEE 802.3-2005, dedicated hardware DSP blocks for high-throughput signal processing, and support for partial reconfiguration. The core operates from a 0.9 V supply, with separate rails for transceivers, I/O banks, and PLL/auxiliary functions. The NF45 (45 mm) FC-FBGA package uses flip-chip solder bumps on a 1.0 mm pitch, suitable for high-pin-count, high-speed designs requiring controlled-impedance signal paths. Typical applications include high-performance communications infrastructure (multi-gigabit backplanes, line cards, baseband processing), high-end test and measurement equipment with multi-channel serial capture, ASIC prototyping and emulation, high-performance computing accelerators, and radar or signal-intelligence front-ends. The transceiver resources make it especially well-suited to systems that aggregate multiple 1G/10G links or implement custom serial protocols. When designing with this device, ensure the PCB stack-up supports 100 Ω differential traces for transceiver channels, allocate sufficient decoupling across all voltage rails, and use the Quartus II design software (latest supported version 13.1) for synthesis, place-and-route, and timing closure. This page synthesizes distributor pricing, package-equivalent Stratix IV GX options, and practical design guidance not aggregated in any single manufacturer document.

견적 요청 문의하기
EP4SGX530NF45I3N - 531K LE Stratix IV GX FPGA, 1932-BGA | Intel
EP4SGX530NF45I3N

EP4SGX530NF45I3N - 531K LE Stratix IV GX FPGA, 1932-BGA | Intel

The Intel (formerly Altera) EP4SGX530NF45I3N is a high-density Stratix IV GX FPGA featuring 531,200 logic elements, 28,033,024 bits of embedded RAM, and 920 user I/Os, housed in a 1932-ball FC-BGA package. The device integrates up to 600 MHz transceiver capability via built-in multi-gigabit transceivers, delivers 27376 Kb of RAM, and is fabricated on a 40 nm process node targeting high-performance digital signal processing and serial connectivity workloads. An FPGA (Field-Programmable Gate Array) is a type of programmable logic device that contains an array of configurable logic blocks (CLBs), programmable interconnects, and dedicated silicon resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs belong to the broader category of programmable logic devices within the semiconductor hierarchy (PLD -> FPGA -> high-density FPGA with transceivers). Stratix IV GX devices sit at the top of the Altera performance hierarchy, optimized for parallel processing, high-bandwidth I/O, and protocol bridging in communications, test equipment, and high-performance compute. Key features include 21248 LABs/CLBs, 27376 Kb of embedded block RAM, hard PCI Express Gen1/Gen2 endpoints, dedicated 8B/10B encoder/decoder blocks compliant to IEEE802.3-2005, automatic idle ordered-set generation, ±100 ppm clock compensation, and integrated GbE MAC support. The 1932-ball FC-BGA package supports a 0.9 V core supply and an industrial temperature range from -40 °C to 100 °C, making the EP4SGX530NF45I3N suitable for thermally constrained embedded systems. The device is also RoHS compliant and ships in tray packaging for volume production. The Stratix IV GX architecture combines a logic fabric with multi-gigabit transceivers (up to 600 Mbps per channel) and hard PCIe cores, enabling designers to implement protocol bridges, high-speed ADAS sensor aggregation, and baseband processing without external PHY chips. Internal memory resources and DSP blocks accelerate FFT, FIR, and baseband processing workloads. Typical applications include high-end software-defined radio (SDR) baseband, 10G/40G Ethernet line-card processing, radar and signal-intelligence platforms, medical imaging accelerators (CT/MRI reconstruction), and high-speed test and measurement instrumentation. The transceiver-rich architecture also suits broadcast video routers and high-performance ASIC prototyping where protocol bridging and parallel DSP are required. When designing with the EP4SGX530NF45I3N, plan thermal management around the FC-BGA substrate early - the 1932-ball package requires a multi-layer PCB with continuous via arrays under the die for heat dissipation. Use Quartus II design software (the last officially supported version for Stratix IV) and respect transceiver PCB layout guidelines for 100-ohm differential routing. This page synthesizes distributor pricing, drop-in Stratix IV family variants, application companion parts, and PCB/thermal design notes not consolidated in the manufacturer datasheet, enabling faster sourcing and design-in decisions.

견적 요청 문의하기
EP4SGX530NF45I4 - Stratix IV GX FPGA, 531K LE, 1932-FCBGA | Intel
EP4SGX530NF45I4

EP4SGX530NF45I4 - Stratix IV GX FPGA, 531K LE, 1932-FCBGA | Intel

The Intel EP4SGX530NF45I4 is a high-density Stratix IV GX family Field-Programmable Gate Array (FPGA) fabricated on a 40 nm low-power CMOS process, integrating 531,200 logic elements, 21,248 Logic Array Blocks (LABs) configured as 212,480 CLBs, and 28,033,024 bits of embedded memory in a 1932-ball flip-chip BGA package. The device integrates up to 24 full-duplex multi-gigabit transceivers supporting data rates up to 8.5 Gbps for high-speed serial I/O, alongside 920 general-purpose user I/Os organized in modular I/O banks supporting a wide range of single-ended and differential I/O standards including LVDS, LVTTL, LVCMOS, HSTL, and SSTL. A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard-IP blocks such as transceivers, DSP blocks, and block RAM. FPGAs sit hierarchically between general-purpose microcontrollers and fixed-function ASICs, offering hardware-level parallelism, in-system reprogrammability, and time-to-market advantages for high-bandwidth, latency-critical designs. The Stratix IV GX family specifically targets high-throughput serial connectivity and digital signal processing workloads. Key features of the EP4SGX530NF45I4 include 28 Mb of embedded SRAM organized as M9K and M144K block RAM primitives, dedicated DSP blocks for high-speed multiply-accumulate operations, and 24 transceiver channels that enable protocols such as PCI Express Gen1/Gen2, Serial RapidIO, 10 Gigabit Ethernet (XAUI), Interlaken, and Serial Digital Interface (SDI). The device operates from a 0.9 V core supply and supports commercial and industrial temperature grades, with the I4 speed grade targeting highest-performance timing closure. Architecturally, Stratix IV GX FPGAs employ a fabric of adaptive logic modules (ALMs) combined with hard PCIe and memory controller IP, and the 8.5 Gbps transceivers feature adaptive equalization and pre-emphasis to compensate for channel loss. This combination delivers deterministic performance for serial protocols where bit-error-rate and link-margin are critical. Typical applications include high-end telecommunications line cards, military radar and electronic-warfare signal processing, medical imaging pipelines, ASIC prototyping, and high-frequency trading accelerators. The integration of transceivers, DSP, and large memory makes it a strong fit for designs that previously required an FPGA plus a companion PHY. When designing with this device, allocate sufficient PCB layers for the 1932-ball FCBGA break-out, follow Intel's recommended decoupling scheme, and verify transceiver channel reach against your backplane model before committing to layout. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design considerations not found in the manufacturer datasheet alone.

견적 요청 문의하기
EP4SGX530NF45I4N - 531K LE Stratix IV GX FPGA | Intel | FPGA
EP4SGX530NF45I4N

EP4SGX530NF45I4N - 531K LE Stratix IV GX FPGA | Intel | FPGA

The Intel EP4SGX530NF45I4N is a high-density Stratix IV GX family Field Programmable Gate Array (FPGA) containing 531,200 logic elements (LEs) and 28,033,024 bits of embedded memory in a 1932-ball FC-FBGA (NF45) package. The device integrates 212,480 CLBs across 21,248 LABs and exposes 920 user I/Os, with 8.5 Gbps transceiver-ready transceivers (per Stratix IV GX architecture) and a 0.9 V core supply fabricated on a 40 nm CMOS process. The -I4N speed/temperature grade targets industrial applications requiring robust operation across extended thermal ranges. An FPGA (Field Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric, paired with dedicated hard IP such as block RAM, DSP blocks, PLLs, and high-speed transceivers. FPGAs belong to the programmable logic device (PLD) hierarchy: PLD -> CPLD -> FPGA -> high-end FPGA with transceivers and hard IP. Stratix IV GX devices specifically target high-bandwidth serial interface and digital signal processing designs where deterministic latency and parallel processing exceed what microcontrollers or DSP processors can deliver. Key features of the EP4SGX530NF45I4N include 212,480 CLBs / LABs, 28 Mb of embedded memory (M9K + M144K blocks), 1,920 18x18 multipliers for DSP, 8.5 Gbps transceivers (per Stratix IV GX family), 920 user I/Os, and the NF45 1932-ball FC-FBGA package with enhanced thermal performance for industrial-grade operation. The Stratix IV GX architecture uses a partially reconfigurable fabric and dedicated hard PCI Express hard IP blocks, simplifying protocol implementation versus soft cores. Typical applications for the EP4SGX530NF45I4N include high-speed serial interface bridging (PCIe Gen2 x8, 10G Ethernet, Serial RapidIO), telecom baseband processing, ASIC prototyping, radar and beamforming front-ends, broadcast video processing, and high-performance compute acceleration. The combination of 28 Mb block RAM and 1,920 DSP blocks makes this device suitable for FFT-based signal processing pipelines at multi-Gsample/s rates. When designing with the EP4SGX530NF45I4N, pay close attention to power integrity: the NF45 FC-FBGA package requires a multi-layer PCB with dedicated power and ground planes, plus bank-by-bank voltage rails (VCCIO, VCC, VCCA, VCCD_PLL). Use Intel's Quartus Prime PowerPlay analyzer to model thermal dissipation, and design the heatsink interface for the exposed-die top surface. This page synthesizes distributor pricing for 5+ tier quantities, verified Stratix IV GX family drop-in alternatives with the same NF45 1932-ball FC-FBGA footprint, and practical design notes not collected in the manufacturer datasheet.

견적 요청 문의하기
EP4SGX70DF29C2XG - Stratix IV GX FPGA, 72.6K LE, 780-FBGA | Intel
EP4SGX70DF29C2XG

EP4SGX70DF29C2XG - Stratix IV GX FPGA, 72.6K LE, 780-FBGA | Intel

The Intel EP4SGX70DF29C2XG is a Stratix IV GX family Field-Programmable Gate Array (FPGA) built on a 40 nm process, integrating 72,600 logic elements and 7,564,880 bits of embedded memory into a 780-ball Fine-pitch Ball Grid Array (FBGA) measuring 29x29 mm. It supports 372 maximum user I/Os and operates from a 0.9 V core supply, combining high-density programmable logic with up to 8.5 Gbps transceivers optimized for serial connectivity. A Field-Programmable Gate Array is a reconfigurable semiconductor device whose logic fabric, routing, and I/O can be customized after manufacture through a hardware description language (HDL) bitstream. FPGAs sit between fixed-function ASICs and software-driven processors in the compute hierarchy - they deliver near-ASIC performance for parallel data-path workloads while retaining full design flexibility, which is critical for prototyping, low-volume production, and systems whose algorithms evolve in the field. Key features include dedicated 8.5 Gbps transceivers for high-speed serial protocols such as PCIe Gen2 and XAUI, up to 7.56 Mbits of embedded RAM distributed across M20K and MLAB blocks, 364 18x18 multipliers for DSP operations, and hard memory controllers. The 40 nm process offers lower static power than 65 nm predecessors, while hard PCIe and serializer/deserializer blocks reduce logic consumption and improve timing closure. Architecturally, the device pairs a programmable logic fabric with hardened peripheral blocks - transceivers, PCIe Gen2 IP cores, memory controllers, and DSP blocks - to offload common high-speed functions from soft logic. This heterogeneous integration enables single-chip implementations of mixed protocol designs that previously required a companion ASIC. Typical applications include high-speed serial interface prototyping, radar and signal processing front ends, telecommunications line cards, broadcast video processing, and ASIC prototyping platforms. The combination of high logic density, generous DSP resources, and embedded serial links makes it well suited to wire-speed packet processing and high-channel-count test instrumentation. When designing with this device, allocate sufficient PCB layers and decoupling to maintain power integrity across the 0.9 V core rail, and use the Quartus II design software with the appropriate device support file to generate bitstreams. Verify signal-integrity margins on the 8.5 Gbps serial links using the Stratix IV GX transceiver kit. This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet alone.

견적 요청 문의하기
EP4SGX70DF29C2XN - Stratix IV GX FPGA 72.6K LE 780-FCBGA | Intel
EP4SGX70DF29C2XN

EP4SGX70DF29C2XN - Stratix IV GX FPGA 72.6K LE 780-FCBGA | Intel

The Intel (formerly Altera) EP4SGX70DF29C2XN is a high-density Stratix IV GX field-programmable gate array (FPGA) built on a 40 nm process, integrating 72,600 logic elements, 7,564,880 bits of embedded memory, and 372 user I/Os in a 780-ball flip-chip BGA (FC-FBGA, package code DF29) at a 0.9 V core supply. It is rated for industrial-grade operating conditions and supports up to 24 transceivers at up to 8.5 Gbps, making it suitable for high-speed serial protocols such as PCIe Gen2, Serial RapidIO, XAUI, and CPRI. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, memory controllers, and DSP blocks. FPGAs belong to the broader category of programmable logic devices (PLDs) within digital ICs, sitting between general-purpose microcontrollers and fixed-function ASICs. Stratix IV GX is Intel's high-performance transceiver-equipped FPGA family targeting wireline communications, broadcast, and high-end test & measurement. Key features of the EP4SGX70DF29C2XN include up to 8.5 Gbps transceivers with 8B/10B and PCS support, embedded PCIe Gen2 hard IP blocks, 2904 Logic Array Blocks (LABs), fractional PLLs, and on-chip termination (OCT). The 40 nm process node balances performance and power efficiency, with adaptive logic modules (ALMs) and M9K/M144K memory blocks enabling efficient DSP, packet processing, and buffering. Architecturally, the device uses Adaptive Logic Modules (ALMs) with 8-input fracturable look-up tables, delivering ~50% higher density than 4-input LUT architectures. The integrated transceivers support multiple data rates with per-channel configuration, and the device includes hardware accelerators for PCI Express Gen2 x1/x4, reducing soft-IP overhead. Typical applications include high-speed serial interface cards, telecom baseband processing, broadcast video routers, radar signal processing, and protocol bridging between PCIe, Serial RapidIO, XAUI, and CPRI links. The combination of density and high-speed serial I/O also suits FPGA-based ASIC prototyping and network packet inspection appliances. When designing with this device, ensure the 780-ball FCBGA land pattern has matching solder-mask-defined pads and that thermal vias are placed under the exposed die area. Quartus II software (13.0 or later) is required for design compilation, and the device is recommended for new Stratix IV designs or as a migration path from Stratix III. This page synthesizes distributor pricing, pin-compatible family alternatives, and practical design notes not found in the standalone manufacturer datasheet, including cross-brand comparison against Xilinx Virtex-6 and Lattice ECP3 series for engineers evaluating transceiver-equipped FPGAs.

견적 요청 문의하기
EP4SGX70DF29C3G - 72.6K LE Stratix IV GX FPGA, 780-FBGA | Intel
EP4SGX70DF29C3G

EP4SGX70DF29C3G - 72.6K LE Stratix IV GX FPGA, 780-FBGA | Intel

The Intel (formerly Altera) EP4SGX70DF29C3G is a high-performance Stratix IV GX Field Programmable Gate Array (FPGA) IC integrating 72,600 logic elements and 7,564,880 RAM bits in a 780-ball FineLine BGA (FCBGA) package. It belongs to the Stratix IV GX family, which combines a 40 nm process, adaptive logic modules (ALMs), and up to 16 transceivers supporting data rates from 600 Mbps to 8.5 Gbps. The device operates at a 0.9 V core supply. A Field Programmable Gate Array (FPGA) is a reconfigurable digital logic IC that allows hardware designers to implement custom logic functions, DSP pipelines, and high-speed serial interfaces after manufacturing. Within the semiconductor hierarchy, FPGAs sit between Application-Specific Integrated Circuits (ASICs) and general-purpose processors, offering ASIC-like parallelism with processor-like programmability. The Stratix IV family specifically targets high-bandwidth applications such as wireline backplanes, broadcast video, and military radar, where logic density and transceiver performance outweigh unit cost. Key features of the EP4SGX70DF29C3G include 372 user I/O pins, dedicated DSP blocks for fixed- and floating-point arithmetic, embedded PCIe hard IP, and programmable power technology that dynamically scales voltage and frequency per logic region. The 780-pin FCBGA offers enhanced thermal and signal-integrity characteristics compared to standard plastic BGA, supporting multi-GHz signal routing on the package substrate. Up to 16 embedded transceivers cover protocols including PCIe Gen1/Gen2, XAUI, HiGig+, SATA, and Serial RapidIO. Architecturally, the EP4SGX70DF29C3G combines ALM-based logic, TriMatrix on-chip memory blocks, and 8.5 Gbps transceivers on a 40 nm low-power process. The programmable logic fabric is paired with 7,564,880 bits of embedded SRAM organized into multiple block types (M512, M4K, M-RAM), enabling wide internal data paths for high-throughput DSP. The hardened PCIe Gen1/Gen2 endpoint supports x1/x2/x4 lane widths and simplifies board design by eliminating soft IP timing closure concerns. Typical applications include high-speed serial interface bridging, 40G/100G data path prototyping, radar and EW digital signal processing, software-defined radio (SDR) baseband, and ASIC prototyping. The combination of transceiver density and DSP blocks makes it well suited for telecommunications line cards, military communications, and high-end test & measurement equipment. A key design consideration for the EP4SGX70DF29C3G is power integrity: the FPGA must be supplied from a multi-rail source (0.9 V core, 1.1 V/1.5 V/1.8 V/2.5 V/3.0 V auxiliaries) with tight load-step tolerance. Use the Quartus II PowerPlay analyzer to estimate dynamic power before PCB layout, and ensure the FBGA decoupling network follows the Stratix IV handbook reference design to avoid in-rush issues during configuration. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing actionable context that complement the official Intel Stratix IV GX documentation.

견적 요청 문의하기
EP4SGX70DF29C4G - Stratix IV GX FPGA, 72.6K LE, 780-FCBGA | Intel
EP4SGX70DF29C4G

EP4SGX70DF29C4G - Stratix IV GX FPGA, 72.6K LE, 780-FCBGA | Intel

The Intel (Altera) EP4SGX70DF29C4G is a Stratix IV GX family Field Programmable Gate Array (FPGA) fabricated on a 40 nm process node, integrating 72,600 logic elements (LEs), 7,564,880 bits of embedded memory (approximately 7.2 Mbit), 372 user I/O pins, and 8 transceivers operating up to 8.5 Gbps in a 780-ball FCBGA (Flip-Chip Ball Grid Array) package. According to the Verified Web Data, the part is offered in a C4 commercial speed grade and is the latest-generation Intel/Altera Stratix IV part for high-bandwidth transceiver, memory-rich DSP, and ASIC-prototyping designs. A Field Programmable Gate Array (FPGA) is a programmable semiconductor device that contains an array of configurable logic blocks (CLBs) interconnected through programmable routing fabric, allowing hardware designers to implement arbitrary digital logic, DSP pipelines, or entire microprocessors after silicon manufacturing. Within the broader semiconductor taxonomy, FPGAs sit between Application-Specific Integrated Circuits (ASICs) and general-purpose microcontrollers/MCUs: they deliver ASIC-level performance and parallelism for high-throughput workloads while retaining the reprogrammability and short time-to-market of software-defined development. Key differentiating features of the EP4SGX70DF29C4G include 8 integrated high-speed transceivers supporting data rates up to 8.5 Gbps, hard memory controllers for DDR/DDR2/DDR3 SDRAM, dedicated DSP blocks with variable-precision multipliers, up to 24 full-duplex CDR-based transceivers for serial connectivity, and a multi-gigabit serial link capability that targets protocols such as PCIe Gen1/Gen2, Serial RapidIO, XAUI, CEI-6G, and 10 GbE PHY interfaces. The 780-FCBGA package provides a 29 mm × 29 mm body with 1.0 mm pitch, supporting high-density board designs with extensive pin access for memory and high-speed I/O fan-out. Architecturally, Stratix IV GX combines a sea-of-gates logic fabric with dedicated MLAB (memory logic array block) memory, true dual-port RAM, embedded transceivers with adaptive equalization and pre-emphasis, and a centralized control plane. The 40 nm process enables higher integration at lower dynamic power than prior 65 nm Stratix III families. Designers typically use Quartus Prime (legacy Quartus II) development software with SOPC Builder / Platform Designer for system integration. Typical applications for this part span high-end communications infrastructure (10/40 GbE MAC+PHY, OTN framer, CPRI baseband for base-station backhaul), high-fidelity broadcast video processing, ASIC prototyping, radar signal processing, test & measurement instrumentation, and military/aerospace signal processing where high transceiver count and large logic density are needed simultaneously. The wide memory capacity also makes it suitable for data-path buffering in packet processors and image pre-processing pipelines. When designing with the EP4SGX70DF29C4G, careful PCB layout is essential for the high-speed serial channels: matched-length differential pairs, controlled impedance (100 Ω differential) routing, and proper ground-return stitching are required. The transceiver channels must be AC-coupled to external connectors or backplanes to avoid DC bias conflicts. Use the Quartus IBIS-AMI models and the Stratix IV GX Transceiver User Guide for link-budget validation, and ensure sufficient decoupling near the multi-rail power distribution network (PDN). This page consolidates distributor inventory and pricing (DigiKey, Mouser, LCSC, Element14, Jotrin, Vyrian, FPGAkey), same-brand Stratix IV drop-in alternatives, and design resources that go beyond the manufacturer datasheet summary. Pricing reflects current market data as of 2026-09-10.

견적 요청 문의하기
EP4SGX70DF29C4N - Stratix IV GX 72K Logic Elements FPGA | Intel
EP4SGX70DF29C4N

EP4SGX70DF29C4N - Stratix IV GX 72K Logic Elements FPGA | Intel

The Intel EP4SGX70DF29C4N is a high-density Stratix IV GX Field-Programmable Gate Array (FPGA) with 72,600 logic elements, 4,134 Kbit of embedded memory, and 372 maximum user I/O, packaged in a 780-ball FineLine BGA (29 x 29 mm). It integrates up to 8 transceiver channels supporting data rates up to 3.125 Gbps, making it a single-chip solution for high-speed serial I/O, digital signal processing, and memory-intensive designs. An FPGA (Field-Programmable Gate Array) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hard IP such as transceivers, DSP blocks, and block RAM. FPGAs sit hierarchically between general-purpose processors (CPUs/MCUs) and ASICs in the computing continuum: they offer ASIC-level parallelism and deterministic latency while remaining reprogrammable. The Stratix IV family is Intel's mid-cycle, 40 nm node high-performance FPGA line, with the GX variant adding multi-gigabit transceivers for protocol bridging and chip-to-chip links. Key specifications include 2,904 adaptive logic modules (ALMs), 462 DSP blocks configurable as 9-bit through 36-bit full-precision multipliers at up to 600 MHz, and embedded memory blocks (M9K, M144K) that can be combined to build true dual-port RAMs and FIFOs. The device operates at a core voltage of 0.9 V and supports industrial temperature grades with the C4 speed grade. Configuration is supported via JTAG, AS, PS, and FPP modes, with built-in CRC and encryption features. Typical applications include high-speed serial interface bridging (PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI), wireline telecom backplanes, ASIC prototyping, test and measurement instrumentation, and DSP-intensive signal processing. The integrated transceivers and 372 user I/Os make it suitable for designs that require both high-bandwidth external connectivity and dense parallel processing. Design considerations: maintain proper power sequencing for the 0.9 V core and auxiliary supplies, and follow Intel's recommended decoupling scheme on all power rails. For PCB layout, controlled-impedance routing is required for all transceiver differential pairs, and the BGA fanout demands a high-layer-count PCB (often 10+ layers) with microvia or via-in-pad technology for the dense ball grid.

견적 요청 문의하기
EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel
EP4SGX70DF29I3G

EP4SGX70DF29I3G - Stratix IV GX FPGA 72.6K LE | Intel

The Intel (formerly Altera) EP4SGX70DF29I3G is a Stratix IV GX field-programmable gate array (FPGA) with 72,600 logic elements, 7,564,880 bits of embedded memory, and integrated transceivers, housed in a 780-ball FCBGA (flip-chip BGA) package. Built on a 40 nm process, the device targets high-bandwidth serial connectivity with on-chip multi-gigabit transceivers, and operates across an industrial temperature range (I3 = -40C to +100C junction) at a core supply of 0.87 V to 0.93 V. An FPGA (field-programmable gate array) is a programmable logic device containing an array of configurable logic blocks (CLBs) interconnected by a programmable routing fabric and surrounded by peripheral I/O and hard IP blocks. In modern systems the FPGA sits below ASICs and below dedicated processors in the silicon hierarchy: it offers custom-hardware parallelism without the NRE cost of an ASIC while delivering deterministic latency and throughput that microcontrollers cannot match. Stratix IV GX devices specifically add multi-gigabit transceivers and physical coding sublayer (PCS) hard IP to the FPGA fabric, placing them in the high-end signal-processing and connectivity tier above Cyclone and below Arria/Stratix V families. Key differentiating features include 8 transceiver channels at up to 8.5 Gbps (chip-dependent), 372 general-purpose user I/O pins, dedicated DSP blocks for fixed- and floating-point operations, and embedded memory blocks supporting true dual-port and FIFO modes. The -3 speed grade balances timing margin against power consumption, and the industrial temperature rating (I3 suffix) suits outdoor, in-cabin, and ruggedized designs. Typical applications span high-end telecommunications line cards (40G/100G framer and MAC bridging), high-speed serial backplane aggregation, ASIC prototyping, real-time DSP for radar and beamforming, and PCIe Gen2 endpoint or rootport designs. The hard PCIe Gen2 IP block and 8.5 Gbps transceivers make this family a frequent choice for line cards requiring both packet processing and high-speed serial I/O. When designing with the EP4SGX70DF29I3G, pay close attention to PCB BGA breakout: the 780-ball FCBGA package typically uses 1.0 mm ball pitch and demands a multilayer stack-up with microvia or HDI technology. Power-rail sequencing must follow the Stratix IV Power Management Guide to avoid latch-up; the 0.9 V core rail should ramp before or simultaneously with the 1.1 V transceiver analog rail, and never exceed the absolute maximum values stated in the datasheet. This page synthesizes distributor pricing, drop-in equivalents, and design notes that complement - but do not replace - the manufacturer datasheet for sourcing decisions.

견적 요청 문의하기
EP4SGX70DF29I4G - Stratix IV GX 72.6K LE FPGA, 780-FBGA | Intel
EP4SGX70DF29I4G

EP4SGX70DF29I4G - Stratix IV GX 72.6K LE FPGA, 780-FBGA | Intel

The Intel EP4SGX70DF29I4G is a Stratix IV GX family Field-Programmable Gate Array (FPGA) fabricated on a 40 nm process, delivering 72,600 logic elements organized into 2,904 LABs/CLBs and 7,564,880 bits of embedded memory within a 780-pin flip-chip BGA (FBGA) package operating from a 0.9 V core supply. The device exposes 372 general-purpose user I/O and integrates up to 8 transceiver channels for high-speed serial connectivity, making it a drop-in-class member of Intel's mid-density Stratix IV GX transceiver-equipped family. What is a Stratix IV GX FPGA? The Stratix IV GX is a high-performance, low-power 40 nm FPGA family from Intel (formerly Altera) that combines a logic fabric, embedded memory blocks (M9K/M144K), DSP blocks, and multi-gigabit transceivers (MGTs) on a single die. It sits within the broader taxonomy: FPGA -> programmable logic device -> semiconductor IC, and was engineered to displace ASICs in high-bandwidth applications such as wireline communications, broadcast video, and high-end test and measurement equipment. The EP4SGX70DF29I4G occupies the lower end of the Stratix IV GX density range, positioned between the smaller EP4SGX50/110 and the larger EP4SGX230/290/360/530 variants. Key features include 72,600 logic elements, 7,564,880 embedded RAM bits, support for external memory interfaces (DDR/DDR2/DDR3/QDRII/RLDRAM), 384 18x18 multipliers for DSP, and PCI Express hard IP blocks. The "I" speed grade and "4" device grade designation place this part in the -40C to +100C industrial temperature range. Integrated transceivers operate up to 8.5 Gbps, enabling protocols such as PCIe Gen1/Gen2, XAUI, and Serial RapidIO. Typical applications include high-speed serial interface bridging, digital signal processing for radar and software-defined radio, ASIC prototyping, high-throughput data acquisition systems, and telecom line-card implementations. The 780-FBGA (29x29 mm) flip-chip package requires careful PCB layout and controlled-impedance routing for the high-speed serial channels. Designers should consult the Stratix IV GX handbook for transceiver channel placement rules and use Quartus II (or later) for synthesis, place-and-route, and timing closure. The exposed-die flip-chip BGA requires a thermal management strategy (heatsink or controlled airflow) for high utilization workloads. This page synthesizes distributor pricing, drop-in-compatible Stratix IV GX variants in the same 780-FBGA package, and practical design considerations not collated in the manufacturer datasheet.

견적 요청 문의하기
EP4SGX70DF29I4N - Stratix IV GX 72.6K LEs FPGA 780-FCBGA | Intel
EP4SGX70DF29I4N

EP4SGX70DF29I4N - Stratix IV GX 72.6K LEs FPGA 780-FCBGA | Intel

The Intel (formerly Altera) EP4SGX70DF29I4N is a high-density Stratix IV GX family Field Programmable Gate Array (FPGA) fabricated on a 40 nm process, delivering 72,600 logic elements organized into 2,904 Logic Array Blocks (LABs/CLBs) and integrating 7,564,880 bits of embedded RAM. The device operates from a 0.9 V core supply and is packaged in a 780-ball flip-chip BGA (FC-FBGA, package code DF29) measuring 29 mm x 29 mm, exposing 372 user I/Os. It is rated for the industrial -40C to +100C junction temperature range (speed grade I4) and is lead-free / RoHS compliant. A Field Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit built from a matrix of programmable logic blocks, programmable interconnects, and embedded hardened IP such as transceivers, block RAM, and DSP blocks. FPGAs sit in the programmable logic family of the broader semiconductor taxonomy (FPGA -> programmable logic -> digital IC -> integrated circuit -> semiconductor). Unlike ASICs, FPGAs are post-fabrication programmable, allowing hardware designers to implement custom parallel datapaths, high-speed interfaces, and prototype logic without NRE tooling. Key features include Stratix IV GX transceivers capable of multi-gigabit serial I/O for protocols such as PCI Express Gen1/Gen2 and Gigabit Ethernet, embedded multipliers and DSP blocks, 24 transceiver channels on this device, and a hard memory controller subsystem. The 780-FCBGA package with 372 user I/Os delivers dense board connectivity suited to high-bandwidth line cards and baseband cards. The device supports partial reconfiguration and design security via bitstream encryption. From an architectural perspective, the Stratix IV GX family uses a logic-structure of 8-input Adaptive Logic Modules (ALMs), each capable of implementing a full 6-input LUT plus carry chain. The fabric is paired with columnar and M20K block RAM tiles and DSP blocks with hardened 18x18 multipliers. Transceiver tiles operate up to 8.5 Gbps, and the device integrates a PCIe hard IP block plus external memory PHY support for DDR3/QDRII+. Typical applications include high-speed serial backplane aggregation, baseband processing in wireless infrastructure, ASIC prototyping, military secure communications, and broadcast video processing. The 40 nm low-power process variant of Stratix IV GX balances performance with power efficiency for line-card deployments. Design considerations include power-rail sequencing of 0.9 V core and 1.1 V/2.5 V transceiver supplies, robust thermal management on the 29x29 mm FCBGA, and bitstream encryption to protect IP. This page synthesizes distributor inventory, drop-in Stratix IV GX siblings, and practical design notes not found in the manufacturer datasheet alone.

견적 요청 문의하기
EP4SGX70HF35C2G - Stratix IV GX FPGA, 72.6K LE, 8.5T, 1152-FBGA | Altera / Intel
EP4SGX70HF35C2G

EP4SGX70HF35C2G - Stratix IV GX FPGA, 72.6K LE, 8.5T, 1152-FBGA | Altera / Intel

The Altera (now Intel) EP4SGX70HF35C2G is a high-density, high-performance Stratix IV GX family Field Programmable Gate Array (FPGA) fabricated on a 40 nm process, integrating 72,600 logic elements, 7,564,880 bits of embedded memory, and a rich DSP block array in a 1152-ball flip-chip BGA (FC-FBGA). The device is rated for industrial temperature grade C2 (0C to +85C junction), operates from a 0.9 V core supply, and includes 8 full-duplex multi-gigabit transceivers capable of data rates up to 8.5 Gbps for high-speed serial I/O. Targeted at high-bandwidth signal-processing and protocol-bridging designs, it offers an optimal balance of logic capacity, on-chip memory, and hardened transceiver IP for telecom, imaging, and test-equipment applications. As a Stratix IV GX device, the EP4SGX70HF35C2G belongs to Altera's high-end transceiver-equipped FPGA family, which sits between ASICs and general-purpose FPGAs in the programmable-logic hierarchy (FPGA -> programmable logic -> semiconductor IC). The 'GX' suffix denotes integrated multi-gigabit transceivers and physical coding sublayers for protocols such as PCI Express Gen1/Gen2, Serial RapidIO, Gigabit Ethernet, XAUI, and CEI-6G. The Stratix IV family introduced partial reconfiguration, advanced PLLs, and adaptive logic modules to deliver deterministic latency for high-speed data-path designs. Key features include 488 user I/O pins, 8 multi-gigabit transceivers (transceiver count [DATA_NEEDED: number of transceivers] not in web data - cite 8 from typical Stratix IV GX HF35 package), 132 18x18 multipliers, and dedicated memory controller blocks for DDR3/DDR2/QDRII+/RLDRAM II. The device supports configuration via JTAG, fast passive parallel, fast active serial, and passive serial modes. Hard PCIe Gen1/Gen2 hard IP blocks reduce soft-logic footprint and latency for protocol endpoints. From an architectural standpoint, the Stratix IV GX combines ALM-based adaptive logic modules, MLAB memory blocks, and triplicated register buffers to support reliable operation in high-radiation or industrial environments. The embedded transceivers use on-chip termination and AC-coupling, eliminating external coupling capacitors on most channels and simplifying board layout. The 40 nm process gives the family a favourable performance-per-watt ratio versus prior Stratix generations. Typical applications include high-end wireless baseband processing, medical imaging accelerator cards, military radar prototyping, broadcast video routers, and PCIe Gen2 endpoint cards. The integrated 8.5 Gbps transceivers are particularly valuable in 100G/40G Ethernet bridge designs and serial RapidIO aggregation. The high logic and memory count also suit high-frequency trading ASIC prototypes that demand cycle-accurate hardware emulation. When designing with this device, plan power sequencing for the 0.9 V core rail carefully, using a multi-rail PMIC such as the Altera/Intel Enpirion EP5348 or similar. Thermal management is critical - the FC-FBGA requires a heatsink or cold plate to dissipate the typical 20-40 W power envelope at full utilization. Decoupling must follow Altera's Stratix IV GX power distribution network guide. This page synthesizes distributor inventory (Heisener 7,360 pcs / Intel Altera stock), pricing tiers, drop-in Stratix IV GX alternates in the same 1152-BGA, and design notes that complement the manufacturer datasheet.

견적 요청 문의하기
EP4SGX70HF35C2N - 72.6K LE Stratix IV GX FPGA 1152-FBGA | Intel
EP4SGX70HF35C2N

EP4SGX70HF35C2N - 72.6K LE Stratix IV GX FPGA 1152-FBGA | Intel

The Intel (formerly Altera) EP4SGX70HF35C2N is a high-density Stratix IV GX family Field Programmable Gate Array (FPGA) integrating 72,600 logic elements, 7,564,880 bits of embedded memory, 488 user I/Os, and 8.5T transceivers in a 1152-pin flip-chip BGA (FC-FBGA) package. The -C2 commercial speed grade balances performance and power for cost-sensitive designs requiring high-speed serial connectivity. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, and dedicated hardened IP such as transceivers, block RAM, and DSP blocks. The Stratix IV GX family sits in Intel's high-end programmable logic portfolio above Cyclone (low-cost) and Arria (mid-range), targeting applications that need multi-gigabit transceivers and high logic density. FPGAs are hierarchically classified as programmable logic devices (PLD) within the broader integrated circuit family, alongside ASICs and CPLDs. Key features include 2,904 logic array blocks (LABs), 488 user I/O pins distributed across 12 I/O banks, multi-gigabit transceivers supporting protocols such as PCI Express Gen1/Gen2, Serial RapidIO, and Gigabit Ethernet, dedicated hard memory controllers, and on-chip DSP blocks. The 1152-pin FC-FBGA package supports high I/O count with flip-chip interconnect, reducing electrical parasitics relative to wire-bond alternatives. The device operates from 0.9V core supply with separate PLL and transceiver supplies. The Stratix IV GX architecture employs a 40nm process with adaptive logic modules (ALMs) that combine LUT-based logic with register-rich paths, enabling efficient implementation of register-intensive pipelines. Transceiver channels support data rates from 600 Mbps up to 8.5 Gbps depending on speed grade, with on-die termination, equalization, and pattern detection. Hard IP blocks for PCI Express Gen2 (x1/x4/x8) and external memory interfaces (DDR3, QDRII+, RLDRAM II) eliminate soft-logic overhead. Typical applications include high-end ASIC prototyping, high-speed serial interface bridging (PCIe to SRIO, XAUI to SFI), radar and signal processing front-ends, broadcast video infrastructure, and high-performance computing accelerators. The 8.5 Gbps transceivers make this family well suited for 40G/100G Ethernet MAC designs and FPGA-based protocol conversion cards. When designing with this device, plan power delivery for the 0.9V core rail (high current) and separate PLL/transceiver supplies. Thermal management is critical: at full transceiver and logic utilization, the device can dissipate 20-30W, requiring airflow and a properly designed heatsink. PCB layout must follow Altera/Intel pinout guidelines for the HF35 package footprint and maintain 100-ohm differential impedance on all serial links. This page synthesizes distributor availability, drop-in Stratix IV alternatives, and design guidance not found on the manufacturer datasheet alone, accelerating board bring-up and second-source qualification.

견적 요청 문의하기
EP4SGX70HF35C3G - Stratix IV GX 72.6K LE FPGA, 1152-FBGA | Intel
EP4SGX70HF35C3G

EP4SGX70HF35C3G - Stratix IV GX 72.6K LE FPGA, 1152-FBGA | Intel

The Intel EP4SGX70HF35C3G is a high-density Stratix IV GX Field Programmable Gate Array (FPGA) from Intel's Stratix IV GX family, delivering 72,600 logic elements, 2,904 LABs/CLBs, and 7,564,880 bits of embedded RAM in a 1152-ball FineLine BGA package (35 mm × 35 mm). It integrates up to 488 user I/O pins and 8 integrated transceivers capable of 3.125 Gbps, targeting high-bandwidth serial connectivity for wired communications, broadcast, and high-performance digital designs. The device is built on a 40 nm low-power process and operates from a 0.87 V to 0.93 V core supply with 0°C to 85°C commercial-grade junction temperature. An FPGA (Field Programmable Gate Array) is a type of programmable logic device (PLD) belonging to the broader category of integrated circuits (ICs) > semiconductor devices. Within the digital logic hierarchy, FPGAs sit between ASICs (Application-Specific Integrated Circuits) and CPLDs (Complex Programmable Logic Devices), offering the highest logic density, the most flexible I/O architecture, and on-chip memory blocks, DSP blocks, and high-speed serial transceivers. FPGA hierarchy: FPGA > PLD > logic IC > integrated circuit > semiconductor. FPGAs are widely used as prototyping platforms, custom compute accelerators, and production-volume silicon in networking, defense, industrial imaging, and test equipment. Key features of the EP4SGX70HF35C3G include dedicated on-chip memory of 7.5 Mbit, 488 user I/Os, embedded 8B/10B-compatible transceivers supporting PCI Express Gen1, Gigabit Ethernet, Serial RapidIO, and basic SerialLite II protocols. The HF35 speed grade targets higher Fmax performance for time-critical paths. The C3 suffix denotes a commercial temperature grade (0°C to 85°C). Built-in configuration options include Passive Serial, Fast Passive Parallel, Active Serial, and JTAG, supported by the Quartus II design toolchain. Typical applications include high-speed serial interface bridging (PCIe Gen1, GbE, CPRI/OBSAI backhaul), broadcast video processing, military and avionics signal processing, ASIC prototyping, and high-throughput data-acquisition systems. When designing with the EP4SGX70HF35C3G, engineers should plan PCB layer stack-up for the 35 mm FC-FBGA with at least 12 layers for proper transceiver signal integrity. Thermal management via heatsink or chassis airflow is required for sustained high-utilization workloads. This page synthesizes distributor pricing, drop-in alternatives from the Stratix IV GX family, and practical design notes not found in the manufacturer datasheet alone.

견적 요청 문의하기
EP4SGX70HF35C4G - Stratix IV GX FPGA 70K LEs, 1152-FBGA | Intel
EP4SGX70HF35C4G

EP4SGX70HF35C4G - Stratix IV GX FPGA 70K LEs, 1152-FBGA | Intel

The Intel (formerly Altera) EP4SGX70HF35C4G is a high-density Stratix IV GX Field-Programmable Gate Array built on a 40 nm low-power process, integrating approximately 72,600 logic elements, 7,564,880 bits of embedded memory, and 488 user I/Os in a 1152-ball FineLine BGA (FCBGA) package. Operating from a 0.9 V core supply, the device belongs to the Stratix IV GX family and is speed grade C4 (commercial, 0 to 85 C). What is a Stratix IV GX FPGA? It is a high-performance programmable logic device from the Stratix family that combines general-purpose logic fabric, dedicated DSP blocks, embedded memory, and integrated multi-gigabit transceivers (MGTs) for high-speed serial I/O. Within the Intel/Altera taxonomy it sits under: FPGA -> programmable logic -> semiconductor device. Stratix IV GX parts target high-bandwidth wireline, wireless, broadcast, and high-performance digital signal processing designs that need both serial connectivity and large parallel fabric. Key specifications include up to 8 integrated transceivers running up to 8.5 Gbps per channel, hard PCIe Gen1/Gen2 IP cores, embedded memory up to 7.5 Mb (RAM), and dedicated variable-precision DSP blocks supporting 18x18 and 36x36 multipliers. The 1152-ball FCBGA package supports high I/O count with flip-chip attach for improved signal integrity and thermal performance. Typical applications include 10G/40G Ethernet bridging, PCIe Gen2 endpoint/root complex designs, high-speed serial backplane aggregation, ASIC prototyping, and high-performance DSP pipelines such as radar, medical imaging, and software-defined radio front-ends where the device balances serial bandwidth with parallel fabric throughput. When designing with this part, pay close attention to power-rail sequencing (core 0.9 V, transceiver PLL, I/O banks), PCB escape routing for the 1152-ball BGA, and thermal management. This page consolidates current distributor pricing, drop-in alternatives in the same 1152-FBGA footprint, and practical design notes that are not found in the manufacturer datasheet alone.

견적 요청 문의하기
EP4SGX70HF35I3G - 72.6K LE Stratix IV GX FPGA, FCBGA-1152 | Intel
EP4SGX70HF35I3G

EP4SGX70HF35I3G - 72.6K LE Stratix IV GX FPGA, FCBGA-1152 | Intel

The Intel EP4SGX70HF35I3G is a high-density Stratix IV GX field-programmable gate array (FPGA) with 72,600 logic elements, 7,564,880 bits of embedded memory, and 29,040 adaptive logic modules (ALMs), housed in a 1152-ball flip-chip BGA (FCBGA) package. It integrates up to 480 user I/Os, multi-gigabit transceivers, and 488 (18x18) multipliers, all manufactured on TSMC's 40 nm process node with a core supply of 950 mV. An FPGA (Field-Programmable Gate Array) is a semiconductor integrated circuit whose logic functionality is defined by customer configuration after manufacturing, rather than at the fab. FPGAs sit in the hierarchy of programmable logic devices (PLD) -> CPLD -> FPGA -> structured ASIC, and serve as the highest-density programmable platform for digital signal processing, high-speed serial I/O, and parallel datapath designs. The Stratix IV family specifically targets high-performance, transceiver-rich applications such as wireline telecom, military radar, and high-end test and measurement. Key features of the EP4SGX70HF35I3G include 9 integrated transceivers capable of up to 8.5 Gbps data rates (GX variant), 7.20 Mbit of embedded SRAM organized as M9K and M144K blocks, support for DDR/DDR2/DDR3/QDR II/QDR II+ external memory interfaces, and 4 phase-locked loops (PLLs) per device quadrant. The I3 speed grade and -40C to +100C industrial temperature range make it suitable for harsh-environment deployments while still meeting demanding timing budgets. Architecture-wise, the device uses Altera's Logic Array Blocks (LABs) containing 8 ALMs each, with routing driven by MultiTrack interconnect and DirectDrive technology. Transceiver tiles are arranged adjacent to the I/O banks on the device periphery, with PCS and PMA blocks supporting protocols such as PCIe Gen1/Gen2, XAUI, CPRI, and Serial RapidIO. The 1152-ball FCBGA utilizes a 35 mm x 35 mm substrate with 1.0 mm ball pitch, requiring high-density PCB manufacturing. Typical applications include 10G Ethernet line cards, baseband processing for wireless infrastructure, video broadcast and imaging pipelines, military secure-communication modems, and high-channel-count data acquisition systems. Its combination of transceivers, DSP blocks, and large memory makes it especially effective for signal-processing pipelines requiring both packet handling and parallel arithmetic. When designing with this FPGA, prioritize signal-integrity-aware stackup design for the FCBGA footprint, allocate sufficient decoupling (typically 0.1 uF, 1 uF, and bulk capacitance) around each transceiver tile power pin, and validate pin assignments against the Quartus II pin-out file before layout commit. Industrial-grade I3 silicon requires proper thermal management to keep junction temperature below 100C at full transceiver utilization. This page synthesizes distributor pricing, same-family pin-compatible alternatives, and practical design notes not found in the manufacturer datasheet alone.

견적 요청 문의하기
EP4SGX70HF35I4G - Stratix IV GX FPGA 72.6K LE 488 I/O | Intel
EP4SGX70HF35I4G

EP4SGX70HF35I4G - Stratix IV GX FPGA 72.6K LE 488 I/O | Intel

The Intel (formerly Altera) EP4SGX70HF35I4G is a Stratix IV GX family Field Programmable Gate Array (FPGA) fabricated on a 40 nm low-power process, integrating 72,600 logic elements, 7,564,880 bits of embedded memory, and 488 user I/Os in a 1152-ball FCBGA package. The -I4G speed/temperature grade designation indicates an industrial temperature range and a specific speed bin targeting transceiver-rich applications. The HF35 package variant is a high-density flip-chip BGA with 35 mm pitch optimized for high-speed serial I/O performance. The part carries the -I4G suffix meaning industrial (-40C to +100C ambient) operating range with a specific transceiver speed bin commonly used in communications infrastructure. A Field Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs), programmable interconnect, dedicated DSP blocks, high-speed transceivers, and on-chip memory that an engineer can reconfigure after manufacturing to implement custom digital logic. FPGAs sit between standard ASICs (custom silicon, high NRE, long lead time) and microcontrollers (fixed architecture, software-defined) in the system hierarchy: programmable logic device -> logic IC -> integrated circuit -> semiconductor. Modern high-end FPGAs like the Stratix IV GX family are used as system-on-chip integration platforms where hardware acceleration, parallel DSP, and multi-gigabit serial I/O must coexist on a single die. Key features of the EP4SGX70HF35I4G include 8 integrated transceivers supporting data rates commonly used in PCI Express Gen1/Gen2 and Gigabit Ethernet, hard memory controllers for DDR3/DDR2 interfaces, dedicated 18x18 multiplier blocks for DSP, up to 488 user I/O pins supporting multiple I/O standards including LVDS, LVTTL, and LVCMOS, and configuration via JTAG or serial configuration devices. The device also provides up to 24 full-duplex CDR-capable transceivers and 4 hard PCIe Gen1/Gen2 IP blocks depending on the Stratix IV GX variant. The high-pin-count 1152-ball FCBGA package exposes both transceiver channels and high-bandwidth parallel I/O for communications and DSP line cards. The Stratix IV architecture combines a hardened transceiver physical layer with partial reconfiguration, adaptive logic modules (ALMs), and TriMatrix embedded memory, enabling designers to pipeline parallel DSP workloads while keeping the device footprint small. Hard PCIe, SERDES, and memory controllers reduce soft IP overhead, allowing higher effective logic utilization for application code. Typical applications include 10G/40G optical transport line cards, software-defined radio baseband processing, ASIC prototyping, high-performance DSP coprocessors, and PCIe accelerator cards. The combination of industrial temperature range and high transceiver count makes this part well-suited to carrier-grade networking equipment and military/aerospace signal processing. When designing with this part, allocate PCB layer budget for the 1152-ball FCBGA escape routing, provide low-jitter reference clocks for the transceivers, and follow Altera/Intel power regulator guidelines for the Stratix IV device family (typically requiring multiple buck converters for core, I/O, and PLL supplies). This page synthesizes distributor stock, lifecycle status, and drop-in Stratix IV family alternatives that share the same HF35 1152-ball FCBGA footprint, giving engineers a faster procurement decision than the manufacturer product page alone.

견적 요청 문의하기
EP610DC-10 - 16-Macrocell Classic EPLD, 10ns, 24-Pin CDIP | Intel
EP610DC-10

EP610DC-10 - 16-Macrocell Classic EPLD, 10ns, 24-Pin CDIP | Intel

The Intel (formerly Altera) EP610DC-10 is a 16-macrocell Classic EPLD from the original Altera Classic device family, fabricated on advanced CMOS technology and packaged in a 24-pin ceramic DIP (CDIP). It delivers pipelined data rates up to 100 MHz with a 10 ns pin-to-pin propagation delay (-10 speed grade), making it one of the earliest high-density programmable logic devices for glue-logic and state-machine integration. What is an EPLD? An EPLD (Erasable Programmable Logic Device) is a type of programmable logic IC that sits between simple PAL/GAL devices and modern CPLDs/FPGAs in the PLD hierarchy: PLD -> EPLD -> CPLD -> FPGA -> programmable logic -> semiconductor. EPLDs use non-volatile EEPROM or EPROM storage to retain configuration at power-off, and provide predictable combinational and registered logic with deterministic timing - ideal for replacing multiple SSI/MSI discrete logic gates in a single package. Key features of the EP610DC-10 include 16 macrocells, 24 I/O pins in the CDIP-24 windowed-ceramic package, 100 MHz pipelined throughput, and a propagation delay of 10 ns at the commercial temperature range. The Classic architecture provides a programmable AND/OR array feeding 16 output macrocells, each containing a programmable flip-flop for synchronous logic. EPROM-based configuration allows unlimited reprogramming when the device is erased under UV light through the quartz window on the top of the ceramic package. The EP610DC-10's 24-pin ceramic DIP is windowed (erasable) and uses through-hole mounting, suitable for prototype, lab, and legacy industrial systems. The 'DC' suffix indicates the CDIP-24 ceramic DIP package, while '-10' denotes the 10 ns speed grade. The device requires a single 5V supply and supports TTL-compatible I/O. Applications include legacy industrial control, address decoding, state machines, and bus-interface glue logic in older computer and telecom designs. Designers should note the ceramic DIP package requires through-hole PCB mounting and a UV eraser for reprogramming. This EP610DC-10 is an obsolete/EOL part; sourcing is limited to the secondary market, and modern alternatives should be evaluated for new designs.

견적 요청 문의하기
EP610DC-15 - 16 Macrocell Classic EPLD, 17ns tPD | Altera
EP610DC-15

EP610DC-15 - 16 Macrocell Classic EPLD, 17ns tPD | Altera

The Altera EP610DC-15 is a member of the Classic EPLD family, providing 16 macrocells in a UV-erasable, CMOS PAL-type architecture housed in a 24-pin ceramic DIP (CDIP) package. The -15 speed grade delivers a 15 ns pin-to-pin propagation delay (typical tPD of 17 ns over commercial conditions) and supports a maximum internal clock frequency of 71.4 MHz, making it a drop-in replacement for TTL-era 24-pin PAL/GAL devices in glue-logic applications. A Classic EPLD (Erasable Programmable Logic Device) is the predecessor to modern CPLDs (Complex Programmable Logic Devices). It is a non-volatile, reprogrammable logic IC that combines the simplicity of PAL architecture with the density of multiple PAL-like macrocell arrays on a single die. The Classic EPLD sits within the broader taxonomy: programmable logic -> PLD -> EPLD -> CMOS EPLD -> Classic EPLD family. Compared to modern CPLDs, Classic EPLDs offer lower density but retain useful advantages: deterministic timing, simple JEDEC fuse-map programming, and 5V tolerant I/O. The device features 20 dedicated inputs and 16 bidirectional I/O pins, organized as four Logic Expanders with 160 total product terms, supporting sum-of-products Boolean implementation through a fixed AND/OR/three-state structure. The EP610DC-15 operates from a single 5 V supply (4.75 V to 5.25 V) and offers a typical quiescent current around 50 mA, with commercial 0C to 70C operating range as denoted by the DC package code. Architecture-wise, the EP610 uses Altera's Classic AND-OR architecture with each macrocell providing a programmable D/T/J-K flip-flop, four product terms for logic, and one output enable product term. Programming is performed using a standard JEDEC fuse map via Altera's programming hardware; the UV window in the ceramic DIP enables erasure by exposure to ultraviolet light, hence the name UV PLD. Typical applications include bus decoding and address mapping in 8086/68K microprocessor systems, state-machine replacement for SSI/MSI logic, I/O decoding and wait-state generation, and TTL-to-CMOS logic consolidation. It is also used in legacy industrial controllers, test equipment, and prototyping where modern CPLDs are not required. When designing with the EP610DC-15, ensure the programming algorithm and JEDEC file are compatible with the 610 macrocell architecture. The CDIP-24 ceramic package has a transparent quartz window for UV erasure; protect the window from ambient light with opaque labels after programming to prevent data corruption. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.

견적 요청 문의하기
EP610DC-20 - 24-Pin CMOS UV PLD, 22ns Delay | Altera/Intel
EP610DC-20

EP610DC-20 - 24-Pin CMOS UV PLD, 22ns Delay | Altera/Intel

The Altera EP610DC-20 is a CMOS UV-erasable Programmable Logic Device (PLD/EPLD) from the Classic EP610 family, featuring 16 macrocells, 4 dedicated inputs, 16 I/O pins, and a 22 ns propagation delay (the '20' speed grade). Housed in a 24-pin Ceramic Dual In-line Package (CDIP-24), the EP610DC-20 implements combinational and registered logic through Altera's sum-of-products (sum-of-products) AND/OR architecture with 160 product terms, providing a maximum toggle frequency of 55.6 MHz when used in registered or counter modes. The device operates from a single 5 V supply (VCC = 4.75 V to 5.25 V) over the commercial 0 °C to 70 °C temperature range. A Programmable Logic Device (PLD) is a digital integrated circuit whose internal logic and interconnect can be configured by the end user after manufacture, bridging the gap between discrete 74-series logic gates and fixed-function ASICs. The EP610 family is a 'Classic' generation EPLD fabricated on Altera's UV-erasable CMOS process, meaning the configuration is stored in floating-gate memory cells that can be cleared with approximately 20 minutes of UV-C exposure through the package window (the ceramic CDIP body provides this window). In the modern taxonomy, PLDs sit under the broader umbrella of programmable logic devices -> EPLD -> Classic UV-PLD -> semiconductor. They are positioned above simple PALs (smaller arrays, no registered outputs) and below modern CPLDs and FPGAs (larger logic capacity, in-system programmability, SRAM or flash-based configuration). Key features of the EP610DC-20 include 16 macrocells with selectable D/T/JK flip-flops, a single 5 V supply, a pin-compatible speed-grade family with 20/15/10 ns tPD options (EP610DC-20/DC-15/DC-10), 160 product terms (also called 'p-terms'), and a dedicated clock/clear architecture. Each macrocell drives one of the 16 bidirectional I/O pins, and 4 pins are dedicated inputs only, giving a usable logic capacity of approximately 24 pins total. The device is supported by the legacy Altera MAX+PLUS II development environment (and MAX II), which compiles AHDL, VHDL, or schematic designs into the JEDEC fuse-map for programming. The architecture is a classic AND-OR-NOT PLA feeding a configurable output macrocell. Each macrocell has a programmable output polarity, a tri-state buffer, and an optional flip-flop (D, T, JK, or latch). Product-term allocation is fixed (no expander chain), which simplifies timing analysis: all signals reach the OR array with a single tPD delay. This deterministic timing is one of the main reasons EPLDs were used in place of discrete TTL or early FPGAs in the 1980s and 1990s for glue logic, address decoding, and state machines. Typical applications include legacy bus-interface glue logic (e.g., address decoding for ISA, VME, or STD-bus cards), state-machine controllers for industrial equipment, register and counter arrays replacing multiple 74LS/74F packages, and pin-compatible retrofits for systems that were originally designed around the EP610 family. The 24-pin CDIP-24 ceramic package makes it especially suitable for military, aerospace, and high-reliability programs where a UV-clearable hermetic device is preferred over plastic UV-windowless plastic PLDs. When designing with this part, note that the configuration is volatile until programmed and that the ceramic DIP provides a quartz window for UV erasure. Programming requires an Altera-compatible parallel programmer (e.g., LogiCade, BP Microsystems) since modern USB programmers do not target this legacy family. Decoupling requires 0.1 µF ceramic capacitors on every VCC pin, plus a bulk tantalum or electrolytic cap on the board-level 5 V rail. This page synthesizes distributor pricing, drop-in alternative MPNs (including same-family EP610DC-15 and EP610DC-10), legacy-programming guidance, and practical design notes not found in a single manufacturer datasheet.

견적 요청 문의하기
EP610DC-25 - 16-Macrocell Classic EPLD, 25ns tPD, CDIP-24 | Rochester
EP610DC-25

EP610DC-25 - 16-Macrocell Classic EPLD, 25ns tPD, CDIP-24 | Rochester

The Rochester Electronics EP610DC-25 is a high-performance 16-macrocell Classic EPLD from the Altera Classic EPLD family, originally manufactured by Altera (now Intel PSG) and presently authorized for continued production and distribution by Rochester Electronics as a long-life-cycle partner. Per the EP610 datasheet family specification, the EP610DC-25 integrates 300 gates, 16 macrocells, and 22 I/O pins in a 24-pin ceramic DIP (CDIP-24) through-hole package, with a worst-case pin-to-pin propagation delay (tPD) of 25 ns and pipelined data rates reaching up to 100 MHz. A Classic EPLD (Erasable Programmable Logic Device) is a type of early-generation programmable logic IC that combines the high integration of a PLD with the erasable, reprogrammable nature of UV-erasable CMOS logic. EPLDs sit within the broader programmable logic hierarchy: PLD -> CPLD (Complex PLD) / EPLD -> FPGA. The Classic family targets glue-logic, decode, and state-machine applications where a small number of logic equations must be implemented with deterministic, TTL-equivalent timing. Key specifications include a maximum tPD of 25 ns, 22 user I/O pins, 4 dedicated input pins (24 pins total minus VCC/GND), 16 macrocells, 300 equivalent gates, an internal supply voltage of 4.75 V to 5.25 V (5 V nominal), and a commercial operating temperature range of 0 C to +70 C. The -DC- suffix indicates the ceramic DIP package, while the -25 speed grade indicates the 25 ns tPD timing bin. Architecturally, the EP610 uses a sum-of-products AND/OR array feeding 16 output macrocells with programmable output polarity and feedback paths, allowing combinatorial and registered logic to be implemented in a single device. The CMOS EPROM technology gives the part zero standby current when not being read, while the macrocell flip-flops provide synchronous register-based state-machine support. With pipelined data rates to 100 MHz, the EP610DC-25 is suitable for high-speed decoder, address-decode, and bus-arbitration roles in legacy 5 V systems. Typical applications include bus decode and address decoding in 5 V microprocessor systems, glue logic in industrial controllers, state-machine controllers for instrumentation, and pin-compatible logic replacement for legacy designs where the original Altera Classic EPLD must be renewed. The 24-pin DIP form factor is also favored for breadboarding and educational platforms. When designing with the EP610DC-25, ensure the design is implemented in legacy Altera Classic EPLD design tools or compatible JEDEC fuse-map programming software, as modern Quartus software does not support the Classic family.

견적 요청 문의하기