H5ANAG6NBJR-VKC - 16Gb DDR4 SDRAM 2666Mbps | SK Hynix | Memory IC
부품 번호: H5ANAG6NBJR-VKC ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $19.75 | $19.75 |
| 10 | $18.5 | $185.00 |
| 100 | $17.25 | $1,725.00 |
| 500 | $16.1 | $8,050.00 |
| 1,000 | $15 | $15,000.00 |
H5ANAG6NBJR-VKC 개요
DDR4 SDRAM (Double Data Rate fourth-generation Synchronous Dynamic Random Access Memory) is the mainstream volatile memory technology bridging the processor and storage hierarchy. In the memory hierarchy, DDR4 DRAM sits below CPU caches and above SSD/NAND storage, providing high-bandwidth working memory. It evolved from DDR3 by lowering the core voltage from 1.5V to 1.2V, raising bank-group parallelism, and introducing features such as a dynamic on-chip termination (ODT) scheme, ZQ calibration, write leveling, CRC for command/address integrity, and asynchronous reset, all of which this SK Hynix family supports.
Key features of the H5ANAG6NBJR family include the 16Gb die density on advanced process nodes, 1.2V operation, auto self-refresh and self-refresh temperature operation across an industrial-relevant range of -40C to +95C (per the related VKC-grade SK Hynix DDR4 components listed by LCSC), data mask (DM) functionality, and CRC/ACTM-based signal integrity features for reliable multi-DIMM operation.
Architecturally, this 16Gb DDR4 device uses bank groups with internal prefetch to sustain the 2666 Mbps DDR4 data rate while managing refresh overhead. On-die termination and driver strength calibration (ZQ) maintain eye margins on high-speed address/command and data buses, enabling robust operation on dense PCB stacks.
Typical applications include industrial PCs and embedded controllers, network appliances and routers, set-top boxes and smart TVs, and gaming/consumer computing boards where high density per component reduces part count and BOM size.
Design consideration: DDR4 routing demands length-matched fly-by or point-to-point topologies, controlled impedance, and careful VDDQ plane decoupling; verify the exact speed bin and temperature grade against the full SK Hynix datasheet before layout sign-off.
This page adds engineering value beyond the datasheet by consolidating drop-in same-footprint alternates from the same SK Hynix DDR4 family, distributor stock signals, and practical layout guidance for the 96-ball FBGA footprint. Pricing shown is indicative as of 2026-09-04.
드롭인 대체품: H5ANAG6NBJR-VKC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: H5ANAG6NBJR-VKC (동일 폼 팩터 및 풋프린트) — 차이점: RoHS Status, Package, Interface, Density, Organization.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
H5ANAG6NBJR-UHC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.09 / 개
데이터시트 보기 →H5ANAG6NBJR-RDC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$9.6 / 개
데이터시트 보기 →H5ANAG6NBJR-PBC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$6.45 / 개
데이터시트 보기 →H5ANAG8NBJR-VKC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$8.6 / 개
데이터시트 보기 →H5ANAG8NBJR-RDC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.55 / 개
데이터시트 보기 →H5ANAG8NBJR-PBC
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$31.5 / 개
데이터시트 보기 →H5ANAG6NBJR-VKC 최대 정격 & 전기적 특성
| Manufacturer | SK Hynix |
| Part Number | H5ANAG6NBJR-VKC |
| 메모리 유형 | DDR4 SDRAM |
| Memory Density | 16Gb (2GB) |
| 데이터 속도 | 2666 Mbps (per family reference, VKC speed code) |
| 공급 전압 | 1.2 V (DDR4 standard) |
| 인터페이스 | DDR4, SSTL-12 |
| 패키지 | FBGA-96 (PBGA96) |
| 실장 유형 | Surface Mount |
| 동작 온도 | -40C to +95C (family grade reference) |
| Auto Self-Refresh | Yes |
| Data Mask Function | Yes |
| Asynchronous Reset | Yes |
| Dynamic On-Chip Termination | Yes |
| ZQ Calibration | Yes |
| Write Leveling | Yes |
| CRC Function | Yes |
H5ANAG6NBJR-VKC fbga-96 (pbga96) 핀 구성 가이드
H5ANAG6NBJR-VKC(fbga-96 (pbga96) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: H5ANAG6NBJR-VKC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
H5ANAG6NBJR-VKC 적합 용도: 6 애플리케이션s: Industrial PCs and Embedded Controllers, Networking Appliances and Routers, Consumer Computing and Gaming Boards, Test and Measurement Instruments, Edge AI and Vision Systems, Automotive-Adjacent Telematics and Dashboards.
Industrial PCs and Embedded Controllers
Industrial PCs and embedded controllers require 2GB to 16GB of DDR4 working memory that survives -40C to +95C ambient conditions on the factory floor. The H5ANAG6NBJR-VKC's 16Gb density delivers 2GB per component, halving part count versus 8Gb devices and simplifying BOM management. Mounted on the CPU or SoC memory bus at 2666 Mbps, its ZQ calibration and dynamic on-chip termination maintain signal integrity across temperature drift without board-level recalibration. Auto self-refresh preserves data through CPU-initiated low-power states, extending uptime in always-on automation gateways and machine-vision controllers.
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Networking Appliances and Routers
Enterprise routers, switches, and network appliances use DDR4 for packet buffering, routing tables, and control-plane software. The H5ANAG6NBJR-VKC at 2666 Mbps class provides the bandwidth headroom that network processors require for line-rate forwarding, while the 96-ball FBGA footprint packs 2GB in minimal board area for 1U appliance density. Its asynchronous reset feature lets the system CPU hard-reset memory independently of power sequencing - valuable in rack equipment where a single failed buffer must be recovered without a full chassis reboot. CRC on command/address improves reliability in electrically noisy 19-inch rack environments.
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Consumer Computing and Gaming Boards
Motherboards, set-top boxes, and gaming peripherals solder down SK Hynix 16Gb DDR4 to reach 8GB to 16GB total memory without sockets. The H5ANAG6NBJR-VKC's 1.2V operation cuts memory subsystem power versus DDR3, which matters in fanless media players where the whole board may dissipate under 10W. Write leveling and the data mask function simplify controller integration across SoC vendors. For cost-optimized consumer designs, the related 4Gb H5AN4G6NBJR-VKC can be mixed in the same footprint during platform derating when lower total density is acceptable, keeping one PCB layout across product tiers.
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Test and Measurement Instruments
Oscilloscopes, logic analyzers, and signal generators capture and process large waveform datasets that must be streamed into DDR4 acquisition memory at high sustained rates. The H5ANAG6NBJR-VKC's 2666 Mbps data rate and x16-class bus deliver substantial streaming bandwidth per component, while its CRC and calibrated ODT protect capture integrity inside instruments whose own fast switching edges create a noisy local environment. The -40C to +95C range suits bench instruments transported between unheated field sites and warm labs. Dense 2GB-per-chip packaging lets designers scale acquisition depth by paralleling multiple FBGA parts on a fly-by bus.
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Edge AI and Vision Systems
Edge AI modules and smart-camera SoCs process neural network inference and multiple video streams, demanding multi-gigabyte low-latency buffers close to the processor. The H5ANAG6NBJR-VKC provides 2GB per package on a compact 96-ball footprint, letting a four-chip bank deliver 8GB within camera module size constraints. The 2666 Mbps class bandwidth feeds vision SoCs that move hundreds of megabytes per frame between sensor input, DRAM scratch space, and NPU compute. Auto self-refresh keeps model weights retained through duty-cycled sleep states, extending battery life in solar-powered or battery-driven surveillance deployments at the network edge.
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Automotive-Adjacent Telematics and Dashboards
Telematics gateways, digital cluster SoCs, and ADAS domain controllers in the extended-temperature tier use industrial-grade -40C to +95C DDR4 components. The VKC grade family supports this range with auto self-refresh, which compensates for cabin temperature swings from cold soak to direct solar load. The 16Gb density supports map caching, sensor fusion buffers, and over-the-air update staging that modern cockpits require. Its 1.2V rail eases integration with the low-voltage power tree of automotive SoCs. For full AEC-Q100 flows, verify the exact qualification status with SK Hynix, as commodity DRAM grades differ from automotive-qualified orderable codes.
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추천 제품 요약
엔지니어링 참조 데이터: H5ANAG6NBJR-VKC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | H5ANAG6NBJR-UHC | H5ANAG6NBJR-RDC | H5ANAG6NBJR-PBC | H5ANAG8NBJR-VKC | H5ANAG8NBJR-RDC |
|---|---|---|---|---|---|---|
| Package | FBGA-96 (PBGA96) | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same | FBGA-96 - same |
| Brand | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix | SK Hynix |
| Density | 16Gb (2GB) | 16Gb (2GB) | 16Gb (2GB) | 16Gb (2GB) | 16Gb (2GB) | 16Gb (2GB) |
| Memory Type | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM | DDR4 SDRAM |
| Speed Grade | VKC (2666 Mbps class) | UHC grade | RDC grade | PBC grade | VKC (2666 Mbps class) | RDC grade |
| Die Generation | BJR | BJR - same | BJR - same | BJR - same | AG8N (later die revision) | AG8N (later die revision) |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
주요 차별점
- Highest density in the same 96-ball footprint family (vs H5AN4G6NBJR-VKC)
- Extended temperature operation (vs H5ANAG6NCJR-VKC)
- Latest die generation option available in footprint (vs H5ANAG6NBJR-PBC)
설계 노트
At 2666 Mbps, DDR4 data strobes require tight intra-byte length matching (typically within +/-25 mils per controller vendor guideline) and controlled 40-ohm single-ended impedance on DQ/DQS. Route the fly-by clock/address chain at 50 ohms with VTT termination. The H5ANAG6NBJR-VKC's write leveling, ZQ calibration, and dynamic ODT features must be enabled in the memory controller training sequence to close the eye at speed - do not bypass training, even for solder-down single-rank designs.
Plan the 1.2V VDD and VDDQ rails with generous bulk capacitance (multiple 10uF ceramics per device) plus 0.1uF decouplers placed inside the ball field. Estimated: a single 16Gb DDR4 running at 2666 Mbps typically draws on the order of several hundred milliamperes average with burst peaks above 1A, so size the VTT termination regulator for the full bus load, not one device. Follow the memory controller vendor's power distribution guideline for VTT rail sequencing relative to VDDQ.
Do not mix die generations (BJR vs AG8N) on the same memory channel without updating SPD and re-running platform memory validation - die revisions can differ in timing and refresh parameters. Confirm the exact speed and temperature meaning of the VKC suffix against the official SK Hynix part numbering guide rather than relying on family assumptions. For industrial deployments, verify junction temperature at worst-case ambient including the DRAM self-heating contribution at sustained 2666 Mbps traffic.
규정 준수 정보
Compliance status not stated in the retrieved web data. SK Hynix DRAM products are generally RoHS-compliant, but confirm via the official SK Hynix product page or datasheet before design-in.
