10AS057H2F34I2LG - Arria 10 SX SoC FPGA 570K LE | Altera
MPN: 10AS057H2F34I2LG ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4850 | $4,850.00 |
| 10 | $4550 | $45,500.00 |
| 100 | $4200 | $420,000.00 |
| 500 | $3925 | $1,962,500.00 |
| 1,000 | $3675 | $3,675,000.00 |
Drop-in alternatives for 10AS057H2F34I2LG — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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10AS057H2F34I1HG
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View Datasheet →10AS057H2F34I2LG Maximum Ratings & Electrical Characteristics
| Family | Arria 10 SX |
| Device | 10AS057 |
| Logic Elements | 570K |
| Process Technology | 20 nm |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum Core Frequency | 1.5 GHz |
| Core Voltage | 0.9 V |
| Operating Temperature Grade | Industrial |
| Package | 1152-FCBGA, 35x35 mm |
| Package Code | BGA |
| Package Shape | Square |
| Terminal Form | Ball |
| Number of Terminals | 1152 |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Product Category | System On Chip (SoC) |
10AS057H2F34I2LG square Pin Configuration Guide
Complete pinout information for 10AS057H2F34I2LG (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10AS057H2F34I2LG.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
10AS057H2F34I2LG is suitable for 6 applications: Industrial Machine Vision, Software Defined Radio (SDR), Medical Imaging Systems, Radar and Electronic Warfare, 5G Baseband Processing, High-Performance Motor Control and Industrial Drives.
Industrial Machine Vision
The 10AS057H2F34I2LG's 570K logic elements and dual ARM Cortex-A9 MPCore at 1.5 GHz are well-matched to multi-camera industrial inspection lines. The FPGA fabric absorbs Bayer-to-RGB demosaicing, lens distortion correction, and edge detection at multi-megapixel rates, while the HPS runs a Linux-based vision stack (OpenCV, ROS2) for decision-making and PLC hand-off. The 20nm Arria 10 SX process delivers high DSP throughput at moderate power, critical for fanless factory-floor enclosures. The 1152-ball FCBGA exposes sufficient user I/O for Camera Link, CoaXPress, and GigE Vision interfaces simultaneously, allowing one SoC FPGA to replace what was previously an FPGA plus external DSP cluster.
Recommended
Software Defined Radio (SDR)
The Arria 10 SX 10AS057H2F34I2LG integrates dual ARM Cortex-A9 cores alongside 570K LE of programmable logic, making it a strong fit for wideband SDR platforms including 4G LTE base stations and tactical radio modems. The FPGA fabric handles DDC/DUC, channelization, and digital predistortion at full ADC sample rate, while the HPS runs the protocol stack (L1/L2/L3), encryption, and network interface. Arria 10's integrated transceivers deliver multi-Gbps serial links for ADC/DAC JESD204B/C interfaces. The single-chip SoC FPGA approach reduces PCB area and power versus a discrete FPGA-plus-processor architecture, both of which are constrained in deployable radio systems.
Recommended
Medical Imaging Systems
The 10AS057H2F34I2LG supports high-resolution ultrasound, CT, and MRI image reconstruction by exploiting the SoC's parallel DSP fabric and deterministic HPS control plane. Beamforming in ultrasound front-ends, CT back-projection, and MRI FFT pipelines run in FPGA logic at sample rates exceeding 200 MHz per channel, while the ARM Cortex-A9 subsystem handles patient I/O, DICOM stack, and display rendering under a real-time OS. The industrial temperature grade and high logic density position the part well in cart-based and stationary imaging carts. The integrated processor eliminates the need for a separate medical-grade SBC, simplifying IEC 60601-1 regulatory compliance by reducing the bill of materials.
Recommended
Radar and Electronic Warfare
In phased-array radar and electronic countermeasures, the 10AS057H2F34I2LG's 570K LE and 20nm logic density enable real-time pulse compression, MTI/MTD filtering, and direction-finding algorithms at multi-GHz sample rates. The dual ARM Cortex-A9 MPCore handles tracker, classification, and operator-display tasks, with the on-die AXI bus providing microsecond-scale coupling between FPGA fabric and processor code. Arria 10's hardened floating-point DSP blocks accelerate beamforming weight updates without consuming general fabric. The industrial temperature grade supports military/aerospace platform environments, and the 1152-ball FCBGA exposes sufficient transceiver channels for multi-element antenna arrays.
Recommended
5G Baseband Processing
The Arria 10 SX 10AS057H2F34I2LG is positioned for small-cell and macro-cell 5G NR baseband units where forward error correction, FFT/iFFT, and resource de-mapping are accelerated in FPGA fabric. The HPS subsystem runs the L2/L3 protocol stack with virtualization support, while the FPGA implements LDPC decoding and channel estimation at line rate. Arria 10's integrated transceivers support CPRI and eCPRI fronthaul to remote radio heads, with sufficient user I/O for multi-sector antenna interfaces. The SoC FPGA's lower power versus a CPU server blade is critical in space-constrained radio cabinets, and the consolidated architecture reduces system-level MTBF.
Recommended
High-Performance Motor Control and Industrial Drives
The 10AS057H2F34I2LG fits high-end servo drives and industrial motion controllers where current-loop sampling must complete in single-digit microseconds. The FPGA fabric implements field-oriented control (FOC), space-vector PWM, and encoder interface (EnDat, BiSS, Hiperface DSL) at 50-100 kHz loop rates, while the dual ARM Cortex-A9 runs the position loop, trajectory planner, and EtherCAT/CANopen master stack. Arria 10 SX's industrial temperature grade and high logic density enable a single-chip replacement for the legacy architecture of DSP plus external MCU. The 1152-ball FCBGA package supports simultaneous connection to power-stage gate drivers, multi-axis encoder feedback, and industrial Ethernet PHYs.
Recommended
Recommended Products Summary
Engineering reference data for 10AS057H2F34I2LG — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10AS057H2F34I1HG | 10AS057H2F34E2LG | 10AS057H2F34E2SG | 10AS057H2F34E1HG | 10AS057H1F34I1HG |
|---|---|---|---|---|---|---|
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Package | 1152-FCBGA, F34 (35x35 mm) | 1152-FCBGA, F34 (35x35 mm) - same | 1152-FCBGA, F34 (35x35 mm) - same | 1152-FCBGA, F34 (35x35 mm) - same | 1152-FCBGA, F34 (35x35 mm) - same | 1152-FCBGA, F34 (35x35 mm) - same |
| Family | Arria 10 SX (SoC) | Arria 10 SX (SoC) | Arria 10 SX (SoC) | Arria 10 SX (SoC) | Arria 10 SX (SoC) | Arria 10 SX (SoC) |
| Logic Elements | 570K | 570K | 570K | 570K | 570K | 570K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight | Dual ARM Cortex-A9 MPCore + CoreSight |
| Temperature Grade | Industrial (I2) | Industrial (I1) | Extended (E2) | Extended (E2) | Extended (E1) | Industrial (I1) |
| Speed Grade | H2 | H2 | H2 | H2 | H2 | H1 (-1 speed bin) |
| Process Technology | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm | 20 nm |
| Core Voltage | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V | 0.9 V |
Key Differentiators
- Integrated ARM Cortex-A9 MPCore HPS on the same die as 570K LE FPGA fabric (vs Discrete FPGA + external processor design)
- Industrial temperature grade (I2 suffix) with extended junction range (vs 10AS057H2F34E2LG (Extended temperature variant))
- Speed grade H2 provides tighter timing margins over H1 (vs 10AS057H1F34I1HG (H1 speed bin))
- Same F34 1152-FCBGA package as the entire Arria 10 SX 10AS057 family (vs Cross-family migration to 10AS048 (Arria 10 SX 480K))
Design Notes
The 1152-ball FCBGA F34 package requires a high-density PCB stack-up with microvias (laser-drilled, 0.1 mm or smaller). Use a 1-2-1 or 1-2-2-1 HDI stack-up with 0.4 mm ball pitch escape. Place BGA fanout vias on a 0.5 mm or 0.65 mm grid, and follow Altera's F34 package pin connection guidelines for power/ground ball assignments. Avoid routing signal traces beneath the BGA except on the breakout layer, and use proper reference planes for all high-speed transceiver channels. Plan for at least 4 PCB layers dedicated to power and ground planes beneath the FPGA to provide adequate decoupling and return path.
Estimated: At 1.5 GHz HPS core clock and typical Arria 10 SX utilization around 70%, total device power can reach 25-35W. The F34 FCBGA's thermal performance depends heavily on PCB thermal design - use a minimum 1 oz copper on outer layers with thermal via arrays beneath the central ground balls to extract heat to inner copper planes. For industrial-grade operation up to +100C junction, a heatsink with thermal interface material (TIM) is recommended. Avoid placing the FPGA directly adjacent to high-heat components (e.g. DC-DC regulators) without thermal isolation. Refer to Altera's AN 632 power estimator and AN 708 thermal management guidelines.
Arria 10 SX transceivers require strict length matching and impedance control for the serial channels. Use 100-ohm differential routing for transceiver channels with 5 mil trace width / 5 mil spacing on a low-loss dielectric (e.g. Megtron 6 or FR4-408HR). Place AC coupling capacitors as close to the transmitter balls as possible, with reference planes intact beneath the routing. For HPS DDR3/DDR4 interfaces, follow the JEDEC-specific length matching rules from Altera's external memory interface handbook, and use fly-by topology for multi-DDR4 chip-select designs. Decouple every power rail with the recommended capacitor mix (100uF bulk, 10uF ceramic, 1uF, 100nF).
Common design pitfalls: (1) using the wrong Quartus Prime device family library can result in bitstream incompatibility - always confirm the device is set to 10AS057H2F34 before compile; (2) failing to configure HPS boot from the correct flash interface (typically QSPI or SD/MMC) can leave the HPS in an undefined state on power-up; (3) underestimating configuration time for MSPI/x4 modes may require external watchdog reset logic; (4) ignoring the HPS-to-FPGA AXI bridge clock domain crossing can cause intermittent data corruption. Always run the Quartus Prime TimeQuest timing analyzer with industrial-grade temperature/voltage corners for production sign-off.
Compliance Information
RoHS compliance per Altera/Intel product page. Not AEC-Q100 qualified (FPGA, not an automotive-grade IC). Halogen-free status not explicitly stated in retrieved distributor data - marked unknown per Data Authenticity Rule.
