5CSXFC6D6F31I7 - 110K Logic Elements, 800 MHz Cyclone V SX | Altera
부품 번호: 5CSXFC6D6F31I7 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $543.56676 | $543.57 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
5CSXFC6D6F31I7 개요
An FPGA is a field-programmable gate array, a semiconductor device whose logic and interconnects can be configured after manufacturing. An SoC FPGA integrates programmable logic with processor and memory-related system resources on one device. Within the system hierarchy, 5CSXFC6D6F31I7 spans FPGA architecture, SoC integration, embedded processing, and digital system design. This combination allows deterministic hardware acceleration alongside operating-system-based control, networking, protocol handling, and application processing.
The principal device characteristics are 110,000 logic elements, 800 MHz frequency, and an 896-FBGA package. The Cyclone V SX architecture provides configurable logic for parallel datapaths, interface bridging, filtering, control, and signal processing. The dual ARM Cortex-A9 MPCore provides a programmable processing platform, while CoreSight technology supports system debug and trace functions. The package exposes 288 I/O according to the available distributor and catalog data.
The device is suited to designs that need both FPGA acceleration and embedded software. Typical examples include industrial control equipment, communications infrastructure, video and imaging systems, test and measurement equipment, and embedded appliances. In these systems, the FPGA fabric can implement high-speed interfaces or repetitive processing operations while the ARM subsystem manages configuration, control, networking, and user applications.
The 896-FBGA package requires careful PCB design, including controlled-impedance routing, signal-integrity analysis, decoupling placement, thermal assessment, and verification of the exact ball map and power requirements. Logic capacity and processor frequency are headline parameters, but designers must also validate power architecture, memory interfaces, I/O standards, configuration method, temperature grade, and timing closure. These details are not fully established by the supplied search excerpts and require the manufacturer documentation.
The supplied data identifies the package as 896-FBGA and describes the device as a Cyclone V SX FPGA with 110,000 logic elements and 800 MHz operation. Verified distributor listings also report 288 I/O. Pricing is not established in the supplied distributor snippets. This page separates confirmed catalog values from parameters marked for datasheet verification.
드롭인 대체품: 5CSXFC6D6F31I7 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSXFC6D6F31I7 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Logic Elements, Mounting Type, Process Technology, Family.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSXFC6D6F31C6N
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →5CSXFC6D6F31A7N
✅ 드롭인✓ 재고 있음
$345.5 / 개
데이터시트 보기 →5CSXFC5D6F31I7N
✅ 드롭인✓ 재고 있음
$138.2 / 개
데이터시트 보기 →5CSTFD6D5F31I7N
✅ 드롭인✓ 재고 있음
$290 / 개
데이터시트 보기 →5CSXFC6D6F31C7N
✅ 드롭인✓ 재고 있음
$360 / 개
데이터시트 보기 →5CSXFC6D6F31I7 최대 정격 & 전기적 특성
| Product Type | System on Chip FPGA |
| Product Line | Cyclone V SX |
| Device Family | 5CSXC6 |
| 패키지 | 896-FBGA |
| Package Dimensions | 31 mm x 31 mm |
| Logic Elements | 110,000 |
| Operating Frequency | 800 MHz |
| Processor Core | Dual ARM Cortex-A9 MPCore |
| CoreSight Technology | Integrated |
| I/O Count | 288 |
| 실장 유형 | Surface Mount |
| Package Code | BGA |
| Package Shape | Square |
| Terminal Count | 896 |
5CSXFC6D6F31I7 square 핀 구성 가이드
5CSXFC6D6F31I7(square 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSXFC6D6F31I7.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSXFC6D6F31I7 적합 용도: 6 애플리케이션s: Industrial Control and Automation, Communications Infrastructure, Video and Imaging Equipment, Test and Measurement Instruments, Embedded Networking Gateways, Software-Defined Embedded Platforms.
Industrial Control and Automation
5CSXFC6D6F31I7 fits industrial control systems that need both deterministic FPGA hardware and ARM-based supervisory processing. Its confirmed 110,000 logic elements support parallel control, interface conversion, filtering, protocol handling, and timing-sensitive state machines. The dual ARM Cortex-A9 MPCore can run control software, diagnostics, communications stacks, and data-management functions while the FPGA fabric handles high-speed or repetitive operations. The 288 I/O count provides a substantial connection budget for sensors, actuators, field buses, and local control modules. The 896-FBGA package, however, requires disciplined power integrity, thermal analysis, and signal-integrity layout. The supplied data does not confirm industrial temperature grading, so qualification must be checked in the manufacturer documentation before deployment.
추천
Communications Infrastructure
5CSXFC6D6F31I7 can serve communications equipment requiring packet processing, protocol conversion, traffic management, and hardware-assisted control. The 110,000 logic elements are appropriate for configurable datapaths, framing, scrambling, filtering, and interface adaptation, while the dual ARM Cortex-A9 MPCore supports network management, software configuration, and control-plane tasks. The confirmed 800 MHz operating frequency and 288 I/O provide a useful starting point for line cards, gateway platforms, and embedded communications controllers. Designers should still validate transceiver availability, I/O standards, memory interfaces, and timing closure from the official datasheet; those details are not established by the search excerpts. The 896-FBGA package also demands controlled impedance and careful power distribution for reliable high-speed operation.
추천
Video and Imaging Equipment
5CSXFC6D6F31I7 is relevant to video and imaging products that combine sensor acquisition, image processing, buffering, and embedded control. The FPGA fabric can implement pixel processing, synchronization, filtering, format conversion, and camera-interface functions in parallel. The dual ARM Cortex-A9 MPCore can manage configuration, user interfaces, compression workflows, metadata, and network transmission. The confirmed 110,000 logic elements, 800 MHz frequency, and 288 I/O support a broad range of compact imaging designs, but actual performance depends on memory bandwidth, clock resources, selected IP, and timing closure. The supplied excerpts do not confirm video interfaces, memory capacity, or power limits, so those items require datasheet verification. Proper decoupling and controlled-impedance routing are essential for the 896-FBGA device.
추천
Test and Measurement Instruments
5CSXFC6D6F31I7 can provide the processing and control foundation for test and measurement instruments that need simultaneous acquisition, digital signal processing, stimulus generation, and user-interface control. The FPGA fabric is well suited to deterministic filtering, trigger logic, protocol analysis, waveform generation, and real-time data reduction. The dual ARM Cortex-A9 MPCore can run calibration, display, communications, storage, and instrument-management software. With 110,000 logic elements, 800 MHz operation, and 288 I/O, the platform offers substantial integration for compact equipment, although analog front ends, converters, memory architecture, and timing requirements remain board-level design decisions. The verified snippets do not specify conversion performance, on-chip memory, or power dissipation, so those values must be taken from the manufacturer datasheet before design sign-off.
추천
Embedded Networking Gateways
5CSXFC6D6F31I7 is a plausible platform for embedded gateways that bridge industrial, service-provider, or local-area networks while providing hardware acceleration. The dual ARM Cortex-A9 MPCore can handle protocol stacks, security services, management, and application software, while the 110,000 logic elements can accelerate packet classification, encryption or decryption assistance, traffic shaping, and interface adaptation. The confirmed 800 MHz frequency and 288 I/O support multiple external interfaces, but packet throughput cannot be inferred from the headline parameters alone. Memory bandwidth, Ethernet MAC availability, transceivers, operating-system support, and board power design must be verified from official documentation. Because the package is 896-FBGA, the design should include robust decoupling, via-in-pad review, impedance control, and thermal validation.
추천
Software-Defined Embedded Platforms
5CSXFC6D6F31I7 supports software-defined embedded platforms by combining a programmable FPGA fabric with a dual ARM Cortex-A9 MPCore. Hardware functions can be reconfigured for interfaces, accelerators, signal processing, or control logic, while software handles operating-system services, application logic, configuration management, and external communication. The confirmed 110,000 logic elements and 800 MHz frequency make the device suitable for modular products that must support evolving protocols or processing requirements. The 288 I/O count offers flexibility for system integration. Designers should confirm the exact configuration interface, supported memory, available transceivers, power rails, and package thermal limits from the official data. The 896-FBGA package is large and integration-intensive, so a successful platform also depends on high-quality PCB stack-up, decoupling, clock distribution, and signal-integrity simulation.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSXFC6D6F31I7 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSXFC6D6F31C6N | 5CSXFC6D6F31A7N | 5CSXFC5D6F31I7N | 5CSTFD6D5F31I7N | 5CSXFC6D6F31C7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 896-FBGA, 31 mm x 31 mm | 896-FBGA | 896-FBGA | 896-FBGA | 896-FBGA | 896-FBGA |
주요 차별점
- Confirmed 800 MHz operating frequency (vs 5CSXFC6D6F31A7N)
- Large 896-ball BGA integration (vs 5CSXFC6D6F31A7N)
- Dual ARM Cortex-A9 processing integration (vs [DATA_NEEDED: alternative processor])
- 288 I/O connections (vs [DATA_NEEDED: alternative I/O count])
설계 노트
Use a controlled PCB stack-up and verify the complete 896-FBGA ball map against the official 5CSXFC6D6F31I7 datasheet before routing. The 31 mm by 31 mm BGA package requires careful fan-out, via placement, and impedance control. Do not infer individual ball assignments from distributor snippets. Confirm whether any balls are power, ground, configuration, clock, or user I/O before schematic release.
Power integrity is critical for a high-pin-count SoC FPGA. Determine the required voltage rails, current budgets, sequencing, and tolerances from the manufacturer datasheet because those values are not included in the supplied search excerpts. Place decoupling capacitors close to the appropriate power and ground balls, use a continuous reference plane, and simulate voltage droop and rail noise under representative I/O and logic activity.
Perform thermal analysis after the electrical configuration and utilization are known. The supplied data does not provide power dissipation, junction-to-air thermal resistance, or junction-to-board thermal resistance for 5CSXFC6D6F31I7. Do not calculate reliability from an assumed power value. Validate the package thermal path, airflow, copper spreading, heat spreading, and allowable ambient range using the official thermal guidance before production release.
Route clocks and high-speed interfaces with controlled impedance and verified layer transitions. The 896-FBGA package and 288 I/O count increase the importance of return-path continuity, via stubs, crosstalk control, and simultaneous-switching-noise analysis. Establish timing budgets from the selected I/O standards and external memory or interface devices, then verify them with the FPGA design tool and post-route timing analysis.
The 896-FBGA package name alone does not prove electrical or pin-to-pin compatibility between ordering variants. The search data identifies 5CSXFC6D6F31A7N at 700 MHz and 5CSXFC6D6F31C6N with a 1.1 V description, but it does not establish full equivalence. Validate configuration mode, speed grade, voltage rails, temperature grade, I/O standards, and the complete ball map before approving any replacement.
규정 준수 정보
The supplied search results describe an Altera product page with trade-compliance and material-attribute information, but no explicit compliance values are provided. Verify RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status on the current manufacturer page or declaration.
