5CSXFC5D6F31I7N - Cyclone V SX SoC FPGA, 85K LE, Dual ARM Cortex-A9
부품 번호: 5CSXFC5D6F31I7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $192.5 | $192.50 |
| 10 | $178.4 | $1,784.00 |
| 100 | $162.1 | $16,210.00 |
| 500 | $148.75 | $74,375.00 |
| 1,000 | $138.2 | $138,200.00 |
5CSXFC5D6F31I7N 개요
A Cyclone V SX SoC is a heterogeneous computing device that merges a Field-Programmable Gate Array (FPGA) fabric with a Hard Processor System (HPS) in one package, allowing deterministic hardware acceleration and software programmability to coexist on the same silicon. Within the broader taxonomy, it sits as an SoC variant of the Cyclone V family under low-power FPGAs and is typically used where designers need parallel I/O processing, custom peripherals, or DSP acceleration alongside a Linux-capable ARM host. The integrated dual-core ARM Cortex-A9 MPCore delivers 800 MHz of application-class compute, while the FPGA fabric provides parallel datapaths for protocol bridging, motor control, and signal conditioning.
Key features of the 5CSXFC5D6F31I7N include 85,000 logic elements, embedded 18x18 multipliers for DSP, hard memory controllers supporting DDR2/DDR3/LPDDR2, high-speed transceivers, and FPGA-to-HPS bridges that enable tightly coupled data movement between the two domains. The 896-ball FBGA footprint also exposes multi-standard I/O banks that support LVDS, LVTTL, LVCMOS, and RSDS at speeds up to several hundred megabits per second. Industrial-grade screening plus the SoC integration reduce board area and BOM cost compared to a discrete host processor plus FPGA approach.
Typical applications span industrial motor control, factory automation gateways, automotive ADAS prototyping, video surveillance encoders, Software Defined Radio (SDR) baseband stages, and portable medical instrumentation. Engineers choose the 5CSXFC5D6F31I7N when a design requires deterministic hardware logic for I/O or DSP tightly coupled with a Linux-capable host, all in a single industrial-temperature SoC.
When designing the board, pay close attention to the FPGA-HPS bridge topology, multi-rail power sequencing (1.1V core plus 2.5V/3.3V I/O), and DDR3 trace length matching. Because the device is BGA with a 1.0 mm ball pitch, a 6- or 8-layer PCB with microvia stackups is recommended; decoupling must follow Intel's Cyclone V hardware design guide for signal-integrity and thermal relief.
드롭인 대체품: 5CSXFC5D6F31I7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSXFC5D6F31I7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Operating Temperature, Embedded Memory, Transceivers, Logic Elements.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSXFC5D6F31C8N
✅ 드롭인✓ 재고 있음
$171 / 개
데이터시트 보기 →5CSXFC5D6F31C7N
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →5CSXFC5D6F31C6N
✅ 드롭인✓ 재고 있음
$184.85 / 개
데이터시트 보기 →5CSXFC6D6F31A7N
✅ 드롭인✓ 재고 있음
$345.5 / 개
데이터시트 보기 →5CSEMA5F31C6N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
5CSXFC5D6F31I7N 최대 정격 & 전기적 특성
| Family | Cyclone V SX SoC FPGA |
| Logic Elements | 85,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Frequency | 800 MHz |
| Core Voltage | 1.1 V |
| Process Technology | 28 nm low-power |
| 패키지 | 896-ball FBGA (31 x 31 mm) |
| Package Pitch | 1.0 mm |
| 실장 유형 | Surface Mount (BGA) |
| 동작 온도 | -40 C to +100 C (Industrial, TJ) |
| Memory Interfaces | DDR2, DDR3, LPDDR2 |
| DSP Blocks | 18 x 18 multipliers |
| I/O Standards | LVDS, LVTTL, LVCMOS, RSDS |
| Transceivers | Present (Cyclone V SX transceiver variants) |
| MSL 레벨 | 3 (per JEDEC J-STD-020, typical for BGA) |
| RoHS 상태 | Compliant |
5CSXFC5D6F31I7N 1.0 mm 핀 구성 가이드
5CSXFC5D6F31I7N(1.0 mm 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSXFC5D6F31I7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSXFC5D6F31I7N 적합 용도: 6 애플리케이션s: Industrial Motor Control, Software Defined Radio Baseband, Video Surveillance Encoder, Factory Automation Gateway, Automotive ADAS Prototyping, Portable Medical Instrumentation.
Industrial Motor Control
The 5CSXFC5D6F31I7N fits industrial motor control because its 85K logic elements run multi-axis field-oriented control loops at PWM switching frequencies up to several hundred kHz, while the dual-core ARM Cortex-A9 HPS at 800 MHz executes the higher-level motion control stack and EtherCAT/CANopen communication. The FPGA fabric delivers deterministic loop timing that software-only MCUs cannot match. Engineers typically instantiate the IP cores for encoder feedback, current sensing, and PWM generation in the fabric, while reserving the HPS for trajectory planning.
추천
Software Defined Radio Baseband
For Software Defined Radio (SDR) baseband processing, the 5CSXFC5D6F31I7N's FPGA fabric implements parallel DSP pipelines for FFT, channelization, and modulation/demodulation, while the dual-core ARM Cortex-A9 HPS at 800 MHz handles MAC-layer processing and network stack integration. The 18x18 embedded multipliers support efficient polyphase filter banks, and the industrial -40C to +100C temperature range allows deployment in outdoor or ruggedized enclosures. The HPS-FPGA bridge enables zero-copy data movement between the radio PHY and IP networking layers.
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Video Surveillance Encoder
The 5CSXFC5D6F31I7N supports video surveillance encoder designs where the FPGA fabric accelerates H.264/H.265 motion estimation, deinterlacing, and noise reduction, while the ARM Cortex-A9 HPS runs the streaming stack, RTSP server, and analytics. The dual-core 800 MHz HPS can manage 2-4 streams at D1 resolution alongside the FPGA-accelerated encoding pipeline. Multi-standard I/O banks (LVDS, LVCMOS) simplify connection to image sensors and HDMI outputs without external bridge chips.
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Factory Automation Gateway
The 5CSXFC5D6F31I7N fits factory automation gateways because its FPGA fabric implements real-time industrial protocols (PROFINET, EtherCAT, EtherNet/IP) while the dual-core ARM Cortex-A9 HPS runs the OPC UA server, edge analytics, and cloud connectivity. The industrial -40C to +100C temperature rating supports factory floor deployment. The HPS-FPGA bridge enables sub-millisecond latency for closed-loop control traffic, which discrete host + FPGA designs typically cannot match.
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Automotive ADAS Prototyping
The 5CSXFC5D6F31I7N is widely used in automotive ADAS prototyping where the FPGA fabric accelerates sensor fusion from cameras, radar, and LiDAR, while the dual-core ARM Cortex-A9 HPS at 800 MHz runs the perception and decision-making stack. The industrial -40C to +100C temperature range supports under-hood and cabin-mounted applications. Note: this part is not AEC-Q100 qualified - production automotive programs should migrate to the automotive-grade 5CSXFC6D6F31A7N variant in the same FBGA-896 footprint.
추천
Portable Medical Instrumentation
The 5CSXFC5D6F31I7N fits portable medical instrumentation such as ultrasound front-ends, patient monitors, and point-of-care diagnostics. The FPGA fabric implements the DSP pipeline (beamforming, FFT, filter banks) while the dual-core ARM Cortex-A9 HPS at 800 MHz runs the user interface, data logging, and wireless connectivity (Wi-Fi/Bluetooth). The 28nm low-power process minimizes battery drain in portable form factors. The FBGA-896 package supports miniaturized PCB designs.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSXFC5D6F31I7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSXFC5D6F31C8N | 5CSXFC5D6F31C7N | 5CSXFC6D6F31A7N | 5CSEMA5F31C6N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 896-ball FBGA (31x31 mm) | 896-ball FBGA (31x31 mm) - same | 896-ball FBGA (31x31 mm) - same | 896-ball FBGA (31x31 mm) - same | 896-ball FBGA (31x31 mm) - same |
| Family | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SX SoC FPGA | Cyclone V SE SoC FPGA |
| Logic Elements | 85,000 | 85,000 | 85,000 | 110,000 | 85,000 |
| HPS Cores | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Single ARM Cortex-A9 |
| HPS Maximum Frequency | 800 MHz | 800 MHz | 800 MHz | 700 MHz | 925 MHz |
| Operating Temperature | -40C to +100C (Industrial) | 0 to +85C (Commercial) | 0 to +85C (Commercial) | -40C to +125C (Automotive) | 0 to +85C (Commercial) |
| Speed Grade | I7 | C8 | C7 | A7 | C6 |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
주요 차별점
- Industrial temperature grade in same FBGA-896 footprint (vs 5CSXFC5D6F31C8N)
- Higher logic density in same FBGA-896 footprint (vs 5CSXFC6D6F31A7N)
- Dual-core vs single-core ARM Cortex-A9 HPS (vs 5CSEMA5F31C6N)
설계 노트
Estimated: the 896-ball FBGA at 1.0 mm pitch requires a 6- or 8-layer PCB with microvia stackups (laser-drilled 0.1 mm microvias recommended). Implement a continuous GND plane beneath the BGA to provide a low-impedance return path for high-speed transceivers; route all differential pairs (LVDS, transceiver channels) with 100 ohm differential impedance and length matching to within 150 mils. Use buried vias for signal escape to avoid obstructing BGA fanout routing on outer layers.
The Cyclone V SX SoC requires multiple power rails (1.1V core, 2.5V/3.3V I/O, HPS-specific rails, transceiver PLLs). Power sequencing must follow Intel's Cyclone V hardware design guide: VCCINT must rise before or simultaneously with VCCPD to prevent latch-up. Place at least 10 ceramic decoupling capacitors (10 nF, 100 nF, 1 uF, 10 uF mix) within 5 mm of the BGA. Use a dedicated power management IC such as the LTM4677 or Enpirion EM22x series for best efficiency and sequencing accuracy.
Estimated: at maximum utilization (~85K LE, dual-core Cortex-A9 at 800 MHz, transceivers active), the 5CSXFC5D6F31I7N dissipates approximately 5-8 W. The 31x31 mm FBGA package has a typical theta_JA of 10-12 C/W with a 4-layer JEDEC test board. Provide a thermal copper pour of at least 4 square inches on the top layer connected to the central BGA ground balls for heat spreading. For fanless industrial enclosures, ensure ambient temperature stays below +85C to maintain the +100C junction limit with margin.
Do not assume BGA ball-to-ball compatibility between Cyclone V SX and SE families without checking the pin table - the HPS ball map differs between SX (dual-core) and SE (single-core) variants even though both use the 896-ball FBGA footprint. Also note that this 5CSXFC5D6F31I7N is industrial temperature grade and not AEC-Q100 qualified; for production automotive programs, migrate to the 5CSXFC6D6F31A7N (automotive grade) in the same footprint. Always validate DDR3 trace lengths against Intel's DDR3 pin assignment table before PCB fabrication.
규정 준수 정보
RoHS compliant per distributor product pages. Not AEC-Q100 qualified - migrate to 5CSXFC6D6F31A7N for automotive programs. Halogen-free status not stated in verified data.
