5CSXFC6D6F31I7 - 110K Logic Elements, 800 MHz Cyclone V SX | Altera
MPN: 5CSXFC6D6F31I7 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $543.56676 | $543.57 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
Drop-in alternatives for 5CSXFC6D6F31I7 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSXFC6D6F31C6N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →5CSXFC6D6F31A7N
✅ Drop-In✓ In Stock
$345.5 / Unit
View Datasheet →5CSXFC5D6F31I7N
✅ Drop-In✓ In Stock
$138.2 / Unit
View Datasheet →5CSTFD6D5F31I7N
✅ Drop-In✓ In Stock
$290 / Unit
View Datasheet →5CSXFC6D6F31C7N
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$360 / Unit
View Datasheet →5CSXFC6D6F31I7 Maximum Ratings & Electrical Characteristics
| Product Type | System on Chip FPGA |
| Product Line | Cyclone V SX |
| Device Family | 5CSXC6 |
| Package | 896-FBGA |
| Package Dimensions | 31 mm x 31 mm |
| Logic Elements | 110,000 |
| Operating Frequency | 800 MHz |
| Processor Core | Dual ARM Cortex-A9 MPCore |
| CoreSight Technology | Integrated |
| I/O Count | 288 |
| Mounting Type | Surface Mount |
| Package Code | BGA |
| Package Shape | Square |
| Terminal Count | 896 |
5CSXFC6D6F31I7 square Pin Configuration Guide
Complete pinout information for 5CSXFC6D6F31I7 (square package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC6D6F31I7.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC6D6F31I7 is suitable for 6 applications: Industrial Control and Automation, Communications Infrastructure, Video and Imaging Equipment, Test and Measurement Instruments, Embedded Networking Gateways, Software-Defined Embedded Platforms.
Industrial Control and Automation
5CSXFC6D6F31I7 fits industrial control systems that need both deterministic FPGA hardware and ARM-based supervisory processing. Its confirmed 110,000 logic elements support parallel control, interface conversion, filtering, protocol handling, and timing-sensitive state machines. The dual ARM Cortex-A9 MPCore can run control software, diagnostics, communications stacks, and data-management functions while the FPGA fabric handles high-speed or repetitive operations. The 288 I/O count provides a substantial connection budget for sensors, actuators, field buses, and local control modules. The 896-FBGA package, however, requires disciplined power integrity, thermal analysis, and signal-integrity layout. The supplied data does not confirm industrial temperature grading, so qualification must be checked in the manufacturer documentation before deployment.
Recommended
Communications Infrastructure
5CSXFC6D6F31I7 can serve communications equipment requiring packet processing, protocol conversion, traffic management, and hardware-assisted control. The 110,000 logic elements are appropriate for configurable datapaths, framing, scrambling, filtering, and interface adaptation, while the dual ARM Cortex-A9 MPCore supports network management, software configuration, and control-plane tasks. The confirmed 800 MHz operating frequency and 288 I/O provide a useful starting point for line cards, gateway platforms, and embedded communications controllers. Designers should still validate transceiver availability, I/O standards, memory interfaces, and timing closure from the official datasheet; those details are not established by the search excerpts. The 896-FBGA package also demands controlled impedance and careful power distribution for reliable high-speed operation.
Recommended
Video and Imaging Equipment
5CSXFC6D6F31I7 is relevant to video and imaging products that combine sensor acquisition, image processing, buffering, and embedded control. The FPGA fabric can implement pixel processing, synchronization, filtering, format conversion, and camera-interface functions in parallel. The dual ARM Cortex-A9 MPCore can manage configuration, user interfaces, compression workflows, metadata, and network transmission. The confirmed 110,000 logic elements, 800 MHz frequency, and 288 I/O support a broad range of compact imaging designs, but actual performance depends on memory bandwidth, clock resources, selected IP, and timing closure. The supplied excerpts do not confirm video interfaces, memory capacity, or power limits, so those items require datasheet verification. Proper decoupling and controlled-impedance routing are essential for the 896-FBGA device.
Recommended
Test and Measurement Instruments
5CSXFC6D6F31I7 can provide the processing and control foundation for test and measurement instruments that need simultaneous acquisition, digital signal processing, stimulus generation, and user-interface control. The FPGA fabric is well suited to deterministic filtering, trigger logic, protocol analysis, waveform generation, and real-time data reduction. The dual ARM Cortex-A9 MPCore can run calibration, display, communications, storage, and instrument-management software. With 110,000 logic elements, 800 MHz operation, and 288 I/O, the platform offers substantial integration for compact equipment, although analog front ends, converters, memory architecture, and timing requirements remain board-level design decisions. The verified snippets do not specify conversion performance, on-chip memory, or power dissipation, so those values must be taken from the manufacturer datasheet before design sign-off.
Recommended
Embedded Networking Gateways
5CSXFC6D6F31I7 is a plausible platform for embedded gateways that bridge industrial, service-provider, or local-area networks while providing hardware acceleration. The dual ARM Cortex-A9 MPCore can handle protocol stacks, security services, management, and application software, while the 110,000 logic elements can accelerate packet classification, encryption or decryption assistance, traffic shaping, and interface adaptation. The confirmed 800 MHz frequency and 288 I/O support multiple external interfaces, but packet throughput cannot be inferred from the headline parameters alone. Memory bandwidth, Ethernet MAC availability, transceivers, operating-system support, and board power design must be verified from official documentation. Because the package is 896-FBGA, the design should include robust decoupling, via-in-pad review, impedance control, and thermal validation.
Recommended
Software-Defined Embedded Platforms
5CSXFC6D6F31I7 supports software-defined embedded platforms by combining a programmable FPGA fabric with a dual ARM Cortex-A9 MPCore. Hardware functions can be reconfigured for interfaces, accelerators, signal processing, or control logic, while software handles operating-system services, application logic, configuration management, and external communication. The confirmed 110,000 logic elements and 800 MHz frequency make the device suitable for modular products that must support evolving protocols or processing requirements. The 288 I/O count offers flexibility for system integration. Designers should confirm the exact configuration interface, supported memory, available transceivers, power rails, and package thermal limits from the official data. The 896-FBGA package is large and integration-intensive, so a successful platform also depends on high-quality PCB stack-up, decoupling, clock distribution, and signal-integrity simulation.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC6D6F31I7 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC6D6F31C6N | 5CSXFC6D6F31A7N | 5CSXFC5D6F31I7N | 5CSTFD6D5F31I7N | 5CSXFC6D6F31C7N |
|---|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera | Altera |
| Package | 896-FBGA, 31 mm x 31 mm | 896-FBGA | 896-FBGA | 896-FBGA | 896-FBGA | 896-FBGA |
| Operating Frequency | 800 MHz | [DATA_NEEDED] | 700 MHz | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Logic Elements or Cells | 110,000 logic elements | 110,000 cells | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Processor Core | Dual ARM Cortex-A9 MPCore | [DATA_NEEDED] | ARM Cortex-A9 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| I/O Count | 288 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| CoreSight Technology | Integrated | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Voltage | [DATA_NEEDED] | 1.1 V | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Technology | [DATA_NEEDED: process technology] | 28 nm | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Confirmed 800 MHz operating frequency (vs 5CSXFC6D6F31A7N)
- Large 896-ball BGA integration (vs 5CSXFC6D6F31A7N)
- Dual ARM Cortex-A9 processing integration (vs [DATA_NEEDED: alternative processor])
- 288 I/O connections (vs [DATA_NEEDED: alternative I/O count])
Design Notes
Use a controlled PCB stack-up and verify the complete 896-FBGA ball map against the official 5CSXFC6D6F31I7 datasheet before routing. The 31 mm by 31 mm BGA package requires careful fan-out, via placement, and impedance control. Do not infer individual ball assignments from distributor snippets. Confirm whether any balls are power, ground, configuration, clock, or user I/O before schematic release.
Power integrity is critical for a high-pin-count SoC FPGA. Determine the required voltage rails, current budgets, sequencing, and tolerances from the manufacturer datasheet because those values are not included in the supplied search excerpts. Place decoupling capacitors close to the appropriate power and ground balls, use a continuous reference plane, and simulate voltage droop and rail noise under representative I/O and logic activity.
Perform thermal analysis after the electrical configuration and utilization are known. The supplied data does not provide power dissipation, junction-to-air thermal resistance, or junction-to-board thermal resistance for 5CSXFC6D6F31I7. Do not calculate reliability from an assumed power value. Validate the package thermal path, airflow, copper spreading, heat spreading, and allowable ambient range using the official thermal guidance before production release.
Route clocks and high-speed interfaces with controlled impedance and verified layer transitions. The 896-FBGA package and 288 I/O count increase the importance of return-path continuity, via stubs, crosstalk control, and simultaneous-switching-noise analysis. Establish timing budgets from the selected I/O standards and external memory or interface devices, then verify them with the FPGA design tool and post-route timing analysis.
The 896-FBGA package name alone does not prove electrical or pin-to-pin compatibility between ordering variants. The search data identifies 5CSXFC6D6F31A7N at 700 MHz and 5CSXFC6D6F31C6N with a 1.1 V description, but it does not establish full equivalence. Validate configuration mode, speed grade, voltage rails, temperature grade, I/O standards, and the complete ball map before approving any replacement.
Compliance Information
The supplied search results describe an Altera product page with trade-compliance and material-attribute information, but no explicit compliance values are provided. Verify RoHS, REACH, AEC-Q100, lead-free, halogen-free, and conflict-minerals status on the current manufacturer page or declaration.
