5CSXFC6D6F31C7N - Cyclone V SX SoC FPGA, 110K LE, 896-FBGA | Intel
부품 번호: 5CSXFC6D6F31C7N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $485 | $485.00 |
| 10 | $465 | $4,650.00 |
| 100 | $425 | $42,500.00 |
| 500 | $395 | $197,500.00 |
| 1,000 | $360 | $360,000.00 |
5CSXFC6D6F31C7N 개요
An SoC FPGA (System-on-Chip Field Programmable Gate Array) is a heterogeneous device that combines a general-purpose application processor subsystem with programmable logic on a single die, allowing hardware-accelerated peripherals, custom interfaces, and parallel DSP pipelines to be implemented alongside a Linux-capable host. Within Intel's portfolio, the Cyclone V SX family sits below the higher-end Cyclone V ST and above the SE family, targeting low-power, transceiver-equipped embedded systems where deterministic latency and processor integration matter more than maximum logic density.
Key differentiating features of the 5CSXFC6D6F31C7N include 110K logic elements, embedded hard memory blocks, fractional PLLs, 3.125 Gbps transceivers (channel count depends on package speed-grade), a 32-bit DDR3 controller in the HPS, and integrated PCIe Gen2 hard IP. The 896-FBGA (31x31) package exposes the maximum transceiver count and HPS peripheral set of the Cyclone V SX family, supporting industrial and commercial embedded applications requiring parallel I/O.
Architecturally, the FPGA fabric uses an 8-input adaptive logic module (ALM) feeding 110K logic elements, M20K (20 Kb) block memory, and variable-precision DSP blocks capable of 18x18 or 27x27 multiplication. The HPS includes dual ARM Cortex-A9 cores, 32 KB L1 per core, 512 KB shared L2, NEON media engine, and a hard SDRAM controller supporting DDR3 up to 1066 Mbps. Hard IP for PCIe Gen2 (x4/x8 lanes depending on variant) reduces logic utilization and power.
Typical applications include industrial motor control and factory automation gateways, video surveillance and image processing pipelines, military and aerospace signal processing, and embedded vision systems. The combination of an HPS running Linux and FPGA-accelerated image pipelines makes it well suited for smart-camera, machine-vision, and protocol-bridging designs. When designing with this device, allocate sufficient PCB area for decoupling and follow Intel's pinout guidelines for the 896-FBGA package. The C7 speed grade and 0C to +85C commercial temperature range suit general-purpose embedded products, while the I7N variant extends to industrial (-40C to +100C). This page synthesizes distributor pricing, same-family drop-in alternatives, and design notes drawn from the official Cyclone V datasheet.
드롭인 대체품: 5CSXFC6D6F31C7N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: 5CSXFC6D6F31C7N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Process Technology, Embedded Memory, Logic Elements, Mounting Type.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
5CSXFC6D6F31C6N
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →5CSXFC6D6F31A7N
✅ 드롭인✓ 재고 있음
$345.5 / 개
데이터시트 보기 →5CSXFC6D6F31I7N
✅ 드롭인✓ 재고 있음
$205.52 / 개
데이터시트 보기 →5CSXFC5D6F31C7N
✅ 드롭인✓ 재고 있음
$285 / 개
데이터시트 보기 →5CSXFC5C6U23C7N
✅ 드롭인✓ 재고 있음
$348 / 개
데이터시트 보기 →5CSXFC6D6F31C7N 최대 정격 & 전기적 특성
| Series | Cyclone V SX |
| Family | Cyclone V SoC FPGA |
| Logic Elements | 110K |
| Process Technology | 28 nm low-power |
| Core Voltage | 1.1 V |
| HPS Processor | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Max Frequency | 800 MHz |
| 패키지 | 896-FBGA (31 x 31 mm) |
| Temperature Grade | Commercial (0C to +85C) |
| Speed Grade | 7 |
| RoHS 상태 | Compliant |
| 실장 유형 | Surface Mount |
| MSL 레벨 | 3 |
| HPS DDR Controller | DDR3 up to 1066 Mbps, 32-bit |
| Transceivers | Up to 3.125 Gbps (channel count package-dependent) |
5CSXFC6D6F31C7N 896-fbga (31 x 31 mm) 핀 구성 가이드
5CSXFC6D6F31C7N(896-fbga (31 x 31 mm) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: 5CSXFC6D6F31C7N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
5CSXFC6D6F31C7N 적합 용도: 6 애플리케이션s: Industrial Motor Control and Drive, Machine Vision and Smart Camera, Video Surveillance and Analytics Gateway, Automotive Driver Assistance (ADAS) Prototyping, Military and Aerospace Signal Processing, Industrial IoT and Protocol-Bridging Gateways.
Industrial Motor Control and Drive
The 5CSXFC6D6F31C7N's 110K logic elements and dual ARM Cortex-A9 HPS running Linux make it ideal for industrial motor-control and servo-drive platforms. The HPS handles real-time Ethernet protocols (EtherCAT, PROFINET) and safety logic, while FPGA fabric accelerates field-oriented control loops at sub-microsecond PWM update rates. With up to 9 transceivers and PCIe Gen2 hard IP, the device can also aggregate feedback from multiple encoders, motor-position sensors, and adjacent drive axes in a multi-axis machine cabinet.
추천
Machine Vision and Smart Camera
The combination of dual ARM Cortex-A9 cores (800 MHz) plus 110K LE of variable-precision DSP fabric lets the 5CSXFC6D6F31C7N ingest MIPI or parallel image-sensor data, run edge-AI inference, and stream processed video over Gigabit Ethernet in a single chip. HPS runs the OS and TCP/IP stack while FPGA fabric performs Bayer demosaic, HDR merge, and CNN convolution at full sensor frame rate. The 32-bit DDR3 controller supports the bandwidth needs of 1080p60 and higher-resolution sensors without external memory.
추천
Video Surveillance and Analytics Gateway
The 5CSXFC6D6F31C7N's HPS can host an embedded Linux distribution running ONVIF / RTSP server stacks while the FPGA fabric handles H.264/H.265 encode acceleration and motion-detection pipelines for multiple IP-camera streams. With up to 9 transceiver channels, designers can route multiple GigE Vision streams into the device and use PCIe Gen2 hard IP to offload analytics to a host CPU or companion x86 module. The commercial 0C-85C grade suits indoor NVR and edge-aggregation chassis.
추천
Automotive Driver Assistance (ADAS) Prototyping
For ADAS prototyping and pre-production platforms, the 5CSXFC6D6F31C7N's SX SoC architecture allows fusion of camera, radar, and LiDAR sensor data with Linux running on the HPS and low-latency object-detection pipelines on FPGA fabric. Hard PCIe Gen2 IP enables pairing with a host vehicle computer, while 9 transceivers support automotive Ethernet (100BASE-T1 / 1000BASE-T1) and CAN-FD bridging. Designers should note that production automotive deployments should migrate to the 5CSXFC6D6F31A7N AEC-Q100 qualified variant for full automotive temperature and reliability compliance.
추천
Military and Aerospace Signal Processing
The 5CSXFC6D6F31C7N serves well in ruggedized signal-processing subsystems where an integrated ARM host simplifies system architecture and FPGA fabric handles high-rate ADC/DAC interfacing, FFTs, and digital down-conversion. Designers can pair the device with FPGAs in mezzanine cards using the transceiver channels for backplane fabrics, while the HPS runs VxWorks or a custom RTOS for control-plane tasks. For deployment in extreme environments, the 5CSXFC6D6F31I7N industrial variant extends the operating temperature range to -40C to +100C without PCB rework.
추천
Industrial IoT and Protocol-Bridging Gateways
The 5CSXFC6D6F31C7N is well suited to industrial IoT gateways that must bridge legacy fieldbus (Modbus, Profibus, CAN) to modern Ethernet-based protocols (OPC-UA, MQTT, TSN). The HPS handles encrypted cloud connectivity and TLS termination, while FPGA fabric implements the deterministic real-time side of the gateway with hard transceivers for industrial Ethernet and serial protocols. The 896-FBGA package exposes the full HPS peripheral set (USB, EMAC, SD/MMC, NAND) for direct connection to flash memory, Wi-Fi modules, and cellular modems.
추천
추천 제품 요약
엔지니어링 참조 데이터: 5CSXFC6D6F31C7N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | 5CSXFC6D6F31C6N | 5CSXFC6D6F31A7N | 5CSXFC6D6F31I7N | 5CSXFC5D6F31C7N |
|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel |
| Package | 896-FBGA (31x31) | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same | 896-FBGA (31x31) - same |
| Logic Elements | 110K LE | 110K LE | 110K LE | 110K LE | 85K LE |
| HPS | Dual Cortex-A9 800 MHz | Dual Cortex-A9 800 MHz | Dual Cortex-A9 800 MHz | Dual Cortex-A9 800 MHz | Dual Cortex-A9 800 MHz |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Automotive (-40C to +125C) | Industrial (-40C to +100C) | Commercial (0C to +85C) |
| Speed Grade | 7 | 6 | 7 | 7 | 7 |
| AEC-Q100 | No | No | Yes | No | No |
| Process | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power | 28 nm low-power |
주요 차별점
- Same-footprint speed-grade flexibility (vs 5CSXFC6D6F31C6N)
- Industrial temperature variant available (vs 5CSXFC6D6F31I7N)
- Automotive qualified option (vs 5CSXFC6D6F31A7N)
설계 노트
The 896-FBGA package has a relatively low thermal resistance, but high-utilization Cyclone V SX designs can still dissipate 5 to 10 W. Provide a thermal pad on the top-side PCB footprint if the package variant supports it, and use a 12-layer stack-up with internal ground/power planes spreading heat from the BGA footprint. Forced-air cooling is recommended for enclosed industrial chassis where ambient exceeds 50C. Estimate (not a datasheet figure): at full logic utilization with HPS active, junction-to-ambient thermal rise can exceed 35C without airflow.
Route the 896-FBGA at 0.8 mm pitch using a high-density interconnect stack-up with microvia and via-in-pad technology; a 1 oz copper outer layer is mandatory for adequate current handling on transceiver power rails. Match-length the DDR3 traces to within +/-25 ps and length-match the transceiver differential pairs per Intel's pinout guidelines. Keep decoupling capacitors within 100 mils of the relevant power pins and use a star-ground topology with the BGA thermal/ground balls stitched directly to an internal ground plane.
Transceiver channels on the 5CSXFC6D6F31C7N require controlled-impedance routing (typically 100 ohm differential) with reference planes continuous under the entire trace. AC-coupling capacitors should be placed as close to the receiver pins as possible, with biasing per the Cyclone V Transceiver User Guide. For HPS DDR3 interfaces, follow the read/write leveling and fly-by topology specified in the External Memory Interface Handbook - deviation can cause intermittent training failures at temperature extremes.
A common design pitfall is leaving the Cyclone V SX configuration pins (nCONFIG, nSTATUS, CONF_DONE) floating - always tie them through the recommended pull resistors as specified in the configuration chapter of the Cyclone V Device Handbook. Another frequent issue is forgetting to power-down unused transceiver channels in software, which can add several hundred milliwatts of unnecessary quiescent dissipation. Finally, validate that the Quartus Prime pin assignments match the final PCB schematic before tape-out - last-minute pin swaps on a 896-ball BGA require costly re-spin.
규정 준수 정보
RoHS and REACH compliant per Intel Cyclone V product family documentation. C7N commercial variant is NOT AEC-Q100 qualified - choose 5CSXFC6D6F31A7N for AEC-Q100 automotive designs. Conflict-mineral statement available from Intel product compliance page.
