EP3SL70F780I4L - Stratix III L FPGA 488 I/O 780-FBGA | Intel
부품 번호: EP3SL70F780I4L ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $1638.73 | $1,638.73 |
| 10 | $1550 | $15,500.00 |
| 100 | $1400 | $140,000.00 |
| 500 | $1280 | $640,000.00 |
| 1,000 | $1150 | $1,150,000.00 |
EP3SL70F780I4L 개요
A Field-Programmable Gate Array (FPGA) is a reconfigurable digital integrated circuit that combines programmable logic blocks, programmable interconnect, and on-die memory and DSP resources, allowing hardware designers to implement custom digital signal processing, bus interface, and control-plane functions after the silicon is fabricated. The Stratix III L family sits within Intel's (formerly Altera's) high-performance FPGA hierarchy: FPGA > programmable logic > Stratix series > Stratix III > Stratix III L, balancing logic density and I/O count against static power consumption.
Key features of the EP3SL70F780I4L include 2,700 LABs (Logic Array Blocks) with adaptive logic modules, embedded multiplier and DSP blocks for high-throughput signal processing, distributed and block RAM totalling roughly 2.7 Mbits, and 488 user I/O balls distributed across multiple I/O banks supporting LVDS, LVCMOS, SSTL, and HSTL standards. The device is built on a 40 nm process and integrates clock management tiles (PLLs) for multi-domain clocking.
The 780-ball FBGA package uses a 1.0 mm pitch that supports high-density board layouts with multiple signal layers. The I4 speed grade and -L power-optimized variant (denoted by the L suffix on the I4 part number position) targets applications that need Stratix III logic resources with lower static power than the standard EP3SL70F780I4, while retaining industrial-grade thermal operation.
Typical applications include telecom line-card packet processing, military/aerospace signal intelligence (SIGINT) and radar front-end pre-processing, industrial high-speed imaging, test and measurement instrumentation, and ASIC prototyping. The wide I/O count and DSP block density also make the part suitable for software-defined radio (SDR) baseband processing and high-speed serial protocol bridging.
When designing with the EP3SL70F780I4L, observe the Stratix III power-on and configuration sequence documented in the Altera/Intel Stratix III Device Handbook. Use the Quartus II design software (version 13.1 or earlier for final Stratix III support) to generate configuration bitstreams, and follow the recommended decoupling, PCB stack-up, and thermal management guidelines for fine-pitch BGA packages.
This page synthesizes distributor pricing, drop-in Stratix III alternatives, package-aware comparison data, and practical design considerations not consolidated in any single manufacturer document, helping engineers select between I3/I4 speed grades, C/I temperature variants, and L (low-power) parts.
드롭인 대체품: EP3SL70F780I4L — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EP3SL70F780I4L (동일 폼 팩터 및 풋프린트) — 차이점: Package, Family, Speed Grade, Process Technology, Core Voltage.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EP3SL70F780I4
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1850 / 개
데이터시트 보기 →EP3SL70F780I4G
✅ 드롭인✓ 재고 있음
$1455 / 개
데이터시트 보기 →EP3SL70F780I4N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$875.4 / 개
데이터시트 보기 →EP3SL70F780I3N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$1240 / 개
데이터시트 보기 →EP3SL50F780I4L
✅ 드롭인✓ 재고 있음
$695.09 / 개
데이터시트 보기 →EP3SE50F780I4L
✅ 드롭인✓ 재고 있음
$1198.5 / 개
데이터시트 보기 →EP3SL70F780I4L 최대 정격 & 전기적 특성
| Family | Stratix III L |
| Logic Elements | 67,500 |
| Logic Array Blocks (LABs) | 2,700 |
| Embedded Memory Bits | 2,699,264 |
| User I/O Pins | 488 |
| 패키지 | 780-ball FBGA (FineLine BGA) |
| 동작 온도 | -40C to +100C (industrial) |
| Speed Grade | I4 |
| Power Variant | L (low static power) |
| Process Node | 40 nm |
| Configuration Method | Serial / Parallel / JTAG via Quartus II |
| Transceivers | None (logic/transceiver-less L variant) |
| 실장 유형 | Surface Mount (BGA) |
| RoHS 상태 | Compliant |
EP3SL70F780I4L 780-ball fbga (fineline bga) 핀 구성 가이드
EP3SL70F780I4L(780-ball fbga (fineline bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EP3SL70F780I4L.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EP3SL70F780I4L 적합 용도: 6 애플리케이션s: Telecom Line-Card Packet Processing, Military/Aerospace Radar Signal Processing, Software-Defined Radio Baseband, Industrial High-Speed Imaging, Test and Measurement Instrumentation, ASIC Prototyping.
Telecom Line-Card Packet Processing
The EP3SL70F780I4L's 67,500 logic elements, 488 user I/O, and 2.7 Mbits of embedded memory make it well suited for telecom line-card packet processing, where it typically implements multi-gigabit Ethernet MACs, framer/MAC interfacing, and traffic-manager lookups. The L (low-power) variant reduces static dissipation - critical in dense multi-FPGA line cards where board-level thermal envelopes are tight. LVDS I/O support enables direct connection to SerDes PHYs and backplane transceivers, while the 780-FBGA package provides the high pin count required for parallel datapath interfaces without forcing designers to use stacked die.
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Military/Aerospace Radar Signal Processing
In radar and electronic-warfare front ends, the EP3SL70F780I4L handles pulse compression, Doppler filtering, and beamforming pre-processing at the FPGA level. The 67,500 LEs provide ample headroom for FFT pipelines, matched filters, and CFAR detectors, while the 488 user I/O support the wide LVDS data buses typical of high-speed ADC arrays feeding the FPGA. Industrial temperature grade (-40C to +100C) and the L low-power profile suit thermally constrained airborne and shipboard installations. The 780-FBGA package is also common in ruggedized VPX and VME boards used across defense platforms.
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Software-Defined Radio Baseband
The EP3SL70F780I4L is widely deployed in software-defined radio baseband designs where it implements channelizers, modulators, and protocol stacks in programmable logic. Its DSP blocks accelerate multiply-accumulate-heavy baseband processing, while the 488 user I/O connect to ADC/DAC data buses and digital up/down-converter chips. The L (low-static-power) variant helps in manpack and vehicular SDRs where battery and cooling budgets are limited. Quartus II DSP Builder flows support rapid migration between SDR waveforms, making this FPGA a workhorse for tactical-radio development programs.
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Industrial High-Speed Imaging
Industrial machine-vision and high-speed imaging systems leverage the EP3SL70F780I4L to handle multi-channel Camera Link, CoaXPress, or LVDS image sensor aggregation at line rates exceeding 1 Gbps. The 488 user I/O provide ample LVDS pairs for parallel image-data ingest, while the 2.7 Mbits of block RAM buffer line-scan bursts. The L low-power profile suits enclosed IP67 camera housings where fanless operation is required. Industrial temperature grade (-40C to +100C ambient) supports factory-floor deployments near heat-generating equipment without additional thermal mitigation.
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Test and Measurement Instrumentation
Test and measurement instruments - oscilloscopes, logic analyzers, protocol testers, and arbitrary waveform generators - use the EP3SL70F780I4L as the central DSP and timing engine. Its DSP blocks implement real-time FIR/IIR filters, FFT-based spectrum analysis, and trigger detection algorithms, while the 488 user I/O connect to high-speed ADCs, DACs, and probe-front-end ASICs. The I4 speed grade offers sufficient timing margin for multi-GS/s acquisition paths. The L low-power variant simplifies chassis thermal design by reducing static dissipation in air-cooled bench instruments.
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ASIC Prototyping
Prototyping complex ASICs - especially networking ASICs and SoCs - relies on the EP3SL70F780I4L's 67,500 logic elements to map multi-million-gate designs into one or a few FPGAs. The 488 user I/O enable full visibility to ASIC pin-level interfaces, and the L variant keeps multi-FPGA prototype boards thermally manageable. Quartus II's incremental compilation and Rapid Recompile features shorten bring-up cycles. Because the part shares its 780-FBGA pinout with several other Stratix III densities, prototype boards can be respun to higher- or lower-density parts (e.g., EP3SL150F780I3N) without changing the PCB.
추천
추천 제품 요약
엔지니어링 참조 데이터: EP3SL70F780I4L — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EP3SL70F780I4 | EP3SL70F780I4G | EP3SL70F780I3N | EP3SL50F780I4L | EP3SE50F780I4L |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-ball FBGA | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same | 780-ball FBGA - same |
| Logic Elements | 67,500 | 67,500 | 67,500 | 67,500 | 50,000 (-26%) | 50,000 (-26%) |
| Speed Grade | I4 | I4 (same) | I4 (same) | I3 (~15% faster Fmax) | I4 (same) | I4 (same) |
| Family / Variant | Stratix III L (low-power) | Stratix III (standard-power) | Stratix III L (same, Pb-free) | Stratix III L (low-power, I3) | Stratix III L (low-power, 50K) | Stratix III E (enhanced, 50K) |
| Operating Temperature | -40C to +100C (industrial) | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C | -40C to +100C |
| RoHS / Pb-Free | Yes (L variant Pb-free) | Yes | Yes (G suffix) | Yes (N suffix) | Yes | Yes |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- Low-static-power variant in same 780-FBGA footprint (vs EP3SL70F780I4)
- High logic density in 780-FBGA (vs 50K LEs parts) (vs EP3SL50F780I4L)
- I4 speed grade with industrial temperature range (vs EP3SL70F780I3N)
설계 노트
The 780-ball FBGA package of EP3SL70F780I4L dissipates static power proportional to logic utilization, toggle rate, and junction temperature. Estimated: at 50% utilization and 25C ambient, the L variant typically dissipates 3-5W, requiring at least 4-layer PCB construction with continuous ground/power planes for thermal spreading. Use the Stratix III PowerPlay Early Power Estimator (EPE) spreadsheet to model junction temperature before PCB layout, and consider a heatsink or top-side airflow for sustained >70% utilization designs.
Route all Stratix III FPGA BGA packages on a high-density PCB stack-up with microvia or laser-drilled vias. Use the manufacturer's BGA escape pattern guidelines: 1.0 mm pitch 780-FBGA requires via-in-pad or dog-bone fanout depending on board fabricator capability. Match trace impedance to 50 ohm single-ended / 100 ohm differential per the LVDS and SSTL standards in use. Provide reference-ground stitching vias adjacent to every high-speed signal via to control return-path discontinuities.
Common pitfalls on Stratix III designs include: (1) failing to follow the configuration sequencing (MSEL[3:0] pins must match the chosen configuration mode - check the Stratix III configuration handbook), (2) leaving JTAG TCK pulled low (causes boundary-scan failures), (3) ignoring I/O bank VCCIO voltage grouping (each bank has its own VCCIO rail and standards supported), and (4) using Quartus II versions newer than 13.1 (Stratix III device support was removed after that release).
For LVDS interfaces on the EP3SL70F780I4L, maintain 100 ohm differential impedance and intra-pair skew under 20 ps per the Stratix III device handbook. Source-synchronous interfaces (e.g., DDR3 external memory, LVDS parallel ADC) require matched trace lengths and a clean reference plane. Use the IBIS models available from the Altera/Intel website for board-level SI simulation; run Quartus II TimeQuest timing analysis with multi-corner sign-off (slow/typical/fast silicon corners).
규정 준수 정보
RoHS and REACH compliant per Altera/Intel material declarations. AEC-Q100 not applicable for FPGAs (qualification program targets ICs, not programmable logic).