K4B4G1646D-BYK00 - 4Gb DDR3L SDRAM 256Mx16 96FBGA | Samsung
부품 번호: K4B4G1646D-BYK00 ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $10.32 | $10.32 |
| 10 | $9.5 | $95.00 |
| 100 | $8.75 | $875.00 |
| 500 | $8 | $4,000.00 |
| 1,000 | $7.5 | $7,500.00 |
K4B4G1646D-BYK00 개요
DDR3L (Low Voltage DDR3) is a type of synchronous dynamic random-access memory that operates at 1.35V, reducing power consumption by up to 20% compared to standard 1.5V DDR3. It is part of the DDR3 SDRAM family, which uses double data rate architecture to transfer data on both edges of the clock, achieving high data rates up to 1600 Mbps per pin. DDR3L is widely used in mobile devices, laptops, and energy-efficient servers where power efficiency is critical.
Key features include a data rate of 1600 Mbps (PC3-12800), programmable CAS latency, and support for both 1.35V and 1.5V supplies, making it versatile for various system designs. The device also includes auto precharge, asynchronous reset, ZQ calibration, data mask, and dynamic on-chip termination (DTC), enhancing signal integrity and simplifying memory controller design.
Technically, the K4B4G1646D-BYK00 uses Samsung's D-die process technology, offering improved performance and power characteristics. The 96-ball TFBGA package provides a compact footprint with excellent thermal and electrical performance. The device supports a temperature range of 0°C to 85°C, suitable for commercial and industrial applications.
Typical applications include DDR3L memory modules for laptops, embedded systems, networking equipment, and industrial PCs. Its low voltage operation makes it ideal for battery-powered devices and energy-conscious designs.
When designing with this memory, ensure proper decoupling and signal integrity practices, including matched trace lengths and termination resistors, to achieve reliable operation at 1600 Mbps. The dual-voltage capability allows flexible power supply design, but careful attention to VDD and VDDQ levels is required.
드롭인 대체품: K4B4G1646D-BYK00 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: K4B4G1646D-BYK00 (동일 폼 팩터 및 풋프린트) — 차이점: Package, Data Rate, CAS Latency, Supply Voltage, Density.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
K4B4G1646D-BYK0
✅ 드롭인✓ 재고 있음
$2.9 / 개
데이터시트 보기 →K4B4G1646D-BCMA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
K4B4G1646E-BMMA
✅ 드롭인✓ 재고 있음
$16.0781 / 개
데이터시트 보기 →K4B4G1646D-BYMA
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
K4B4G1646D-BYK0000
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
K4A4G085WE-BCRC
⚡ 동일 패키지 ⚠️ 사양 미검증✓ 재고 있음
$1.36 / 개
데이터시트 보기 →K4B4G1646D-BYK00 최대 정격 & 전기적 특성
| 메모리 유형 | DDR3L SDRAM |
| Density | 4 Gb |
| 메모리 구성 | 256M x 16 |
| 데이터 속도 | 1600 Mbps |
| 공급 전압 | 1.35 V (also operates at 1.5 V) |
| 패키지 | 96-ball TFBGA |
| Number of Terminals | 96 |
| 동작 온도 | 0°C to 85°C |
| CAS 레이턴시 | Programmable |
| Additional Features | Auto precharge, asynchronous reset, ZQ calibration, data mask, dynamic on-chip termination |
| RoHS | Compliant |
| Lead-Free | Yes |
| 할로겐 프리 | Yes |
| Package Shape | RECTANGULAR |
| Temperature Grade | OTHER |
K4B4G1646D-BYK00 핀 구성
| 핀 A1 | VDD — Power supply |
| 핀 A2 | DQ0 — Data input/output 0 |
| 핀 A3 | DQ1 — Data input/output 1 |
| 핀 B1 | VSS — Ground |
| 핀 B2 | DQ2 — Data input/output 2 |
| 핀 B3 | DQ3 — Data input/output 3 |
| 핀 C1 | VDDQ — I/O power supply |
| 핀 C2 | DQ4 — Data input/output 4 |
| 핀 C3 | DQ5 — Data input/output 5 |
| 핀 D1 | VSSQ — I/O ground |
| 핀 D2 | DQ6 — Data input/output 6 |
| 핀 D3 | DQ7 — Data input/output 7 |
일반적인 애플리케이션
K4B4G1646D-BYK00 적합 용도: 6 애플리케이션s: Laptop Memory, Embedded Systems, Networking Equipment, Industrial PCs, Consumer Electronics, Servers and Data Centers.
Laptop Memory
The K4B4G1646D-BYK00 is ideal for laptop memory modules due to its low 1.35V operation, reducing power consumption and extending battery life. Its 1600 Mbps data rate provides sufficient bandwidth for everyday computing tasks. The 96-ball TFBGA package allows compact module designs, fitting into slim laptop form factors. With 4Gb density, it supports 4GB and 8GB SO-DIMM configurations, meeting the memory demands of modern operating systems and applications.
추천
Embedded Systems
In embedded systems, the K4B4G1646D-BYK00 provides high-density memory for applications like industrial controllers, networking equipment, and single-board computers. Its dual-voltage support (1.35V/1.5V) allows integration into existing 1.5V designs without level shifting. The programmable CAS latency and dynamic on-chip termination simplify timing configuration, while the 0°C to 85°C range suits most industrial environments. The 96FBGA package is suitable for space-constrained PCBs.
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Networking Equipment
The K4B4G1646D-BYK00 is well-suited for networking equipment such as routers, switches, and firewalls, where high bandwidth and low power are critical. Its 1600 Mbps data rate supports high-throughput packet processing, and the low 1.35V supply reduces heat generation in dense chassis. The 96FBGA package enables high-density memory arrays on line cards. The device's robust signal integrity features, including ZQ calibration and dynamic on-chip termination, ensure reliable operation in noisy environments.
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Industrial PCs
For industrial PCs, the K4B4G1646D-BYK00 offers reliable memory with a 0°C to 85°C operating range, suitable for factory automation and process control. Its low power consumption is beneficial for fanless designs, and the 4Gb density supports demanding applications like HMI and data logging. The dual-voltage capability allows use in legacy 1.5V systems, easing migration to DDR3L. The 96FBGA package provides robust solder joints for vibration-prone environments.
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Consumer Electronics
In consumer electronics like smart TVs, set-top boxes, and gaming consoles, the K4B4G1646D-BYK00 delivers the memory bandwidth needed for multimedia processing. Its low voltage operation reduces power consumption, important for energy-efficient devices. The 1600 Mbps data rate supports Full HD video streaming and gaming. The compact 96FBGA package allows slim device designs. The device's auto precharge and data mask features enhance memory efficiency.
추천
Servers and Data Centers
The K4B4G1646D-BYK00 is used in entry-level servers and data center equipment where power efficiency is paramount. Its 1.35V operation reduces energy costs in large-scale deployments. The 4Gb density allows cost-effective memory capacity, and the 1600 Mbps data rate meets the needs of cloud computing and virtualization. The 96FBGA package supports high-density DIMMs. The device's low power and thermal characteristics contribute to overall system reliability.
추천
추천 제품 요약
엔지니어링 참조 데이터: K4B4G1646D-BYK00 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | K4B4G1646D-BYK0 | K4B4G1646D-BCMA | K4B4G1646E-BMMA |
|---|---|---|---|---|
| Package | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA | 96-ball TFBGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Type | DDR3L SDRAM | DDR3L SDRAM | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4 Gb | 4 Gb | 4 Gb | 4 Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Supply Voltage | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V | 1.35V / 1.5V |
주요 차별점
- Dual-voltage support (1.35V/1.5V) (vs K4B4G1646D-BYK0)
- D-die process technology (vs K4B4G1646E-BMMA)
- 1600 Mbps data rate (vs K4B4G1646D-BCMA)
설계 노트
For reliable operation at 1600 Mbps, ensure controlled impedance traces for DQ, DQS, and address/command lines. Use 50-ohm single-ended and 100-ohm differential impedance. Keep trace lengths matched within 100 mils for data lines and 500 mils for address/command. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin to minimize power supply noise.
The K4B4G1646D-BYK00 supports both 1.35V and 1.5V supplies. When using 1.35V, ensure the power supply can provide sufficient current for the memory's peak current demands. Use a dedicated voltage regulator for VDD and VDDQ to avoid noise coupling. Monitor power sequencing: VDD and VDDQ should ramp up together, and VTT should follow after VDDQ is stable.
The 96-ball TFBGA package has a thermal resistance that depends on PCB layout. For high-density applications, ensure adequate thermal vias under the package to dissipate heat. The operating temperature range is 0°C to 85°C; keep the junction temperature below 85°C by providing proper airflow or heatsinking if necessary. In fanless designs, consider reducing data rate or using lower power modes.
규정 준수 정보
RoHS compliant and lead-free/halogen-free per datasheet. Not AEC-Q100 qualified.
