5CGXBC9D6F27C7N vs 5CGXBC5C7F27C8N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci 5CGXBC9D6F27C7N disebabkan oleh Intel dan 5CGXBC5C7F27C8N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr 5CGXBC9D6F27C7N 5CGXBC5C7F27C8N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family Cyclone V GX Cyclone® V GX
Logic Elements 301,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory 14,251,008 bits —
Memory Blocks (M20K) [DATA_NEEDED: M20K count] —
Embedded Multipliers (18x18) 336 —
Transceivers GX family transceivers (per package variant) 6 × 3.125 Gbps (GX)
Transceiver Data Rate Up to 3.125 Gbps —
PCIe Hard IP Yes, Gen1/Gen2 Yes (Gen1/Gen2)
Core Voltage 1.1 V 1.1 V
I/O Voltage Support 1.2 V to 3.3 V (bank-dependent) —
User I/O Pins [DATA_NEEDED: user I/O count for FBGA-672] —
Process Technology 28 nm TSMC low-power —
Kemasan 672-ball FBGA 672-pin FBGA (F27, 27 mm × 27 mm)
Speed/Grade C7 (commercial, speed grade 7) —
Jenis Pemasangan Surface Mount (BGA) Surface Mount (BGA)
Aras MSL [DATA_NEEDED: MSL rating] —
Status RoHS Compliant Compliant
Logic Elements (LE) — 77,000
Adaptive Logic Modules (ALM) — 29,080
Total Embedded Memory — 5,001,216 bits (4,884 Kbits usable)
Embedded Memory Blocks (M10K + MLAB) — 446 × M10K + 231 × MLAB (approx.)
18 × 18 Multipliers — 364
PLLs — 6
Global Clock Networks — 16
Maximum User I/O — [DATA_NEEDED: maximum user I/O count]
Process Node — 28 nm TSMC low-power
Suhu Operasi — 0 °C to +85 °C (commercial, C8)
Configuration — JTAG (IEEE 1149.1) + Active Serial

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