5CGXBC9D6F27C7N vs 5CGXBC5C7F27C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng 5CGXBC9D6F27C7N sa pamamagitan ng Intel at 5CGXBC5C7F27C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro 5CGXBC9D6F27C7N 5CGXBC5C7F27C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Cyclone V GX Cyclone® V GX
Logic Elements 301,000 —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Embedded Memory 14,251,008 bits —
Memory Blocks (M20K) [DATA_NEEDED: M20K count] —
Embedded Multipliers (18x18) 336 —
Transceivers GX family transceivers (per package variant) 6 × 3.125 Gbps (GX)
Transceiver Data Rate Up to 3.125 Gbps —
PCIe Hard IP Yes, Gen1/Gen2 Yes (Gen1/Gen2)
Core Voltage 1.1 V 1.1 V
I/O Voltage Support 1.2 V to 3.3 V (bank-dependent) —
User I/O Pins [DATA_NEEDED: user I/O count for FBGA-672] —
Process Technology 28 nm TSMC low-power —
Packhaging 672-ball FBGA 672-pin FBGA (F27, 27 mm × 27 mm)
Speed/Grade C7 (commercial, speed grade 7) —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS Compliant Compliant
Logic Elements (LE) — 77,000
Adaptive Logic Modules (ALM) — 29,080
Total Embedded Memory — 5,001,216 bits (4,884 Kbits usable)
Embedded Memory Blocks (M10K + MLAB) — 446 × M10K + 231 × MLAB (approx.)
18 × 18 Multipliers — 364
PLLs — 6
Global Clock Networks — 16
Maximum User I/O — [DATA_NEEDED: maximum user I/O count]
Process Node — 28 nm TSMC low-power
Temperature na Operasyon — 0 °C to +85 °C (commercial, C8)
Configuration — JTAG (IEEE 1149.1) + Active Serial

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