EP3SE110F780C4LN vs EP3SE50F780C4N Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE110F780C4LN disebabkan oleh Intel dan EP3SE50F780C4N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP3SE110F780C4LN | EP3SE50F780C4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | NRND |
| Family | Stratix III E | Stratix III E |
| Logic Elements (LE) | 107,500 | 47,500 |
| Logic Array Blocks (LABs) | 4,300 | — |
| Embedded Memory | 8,936,448 bits | — |
| User I/O Pins | 488 | — |
| Kemasan | 780-BBGA, FCBGA (Fine-pitch) | 780-Ball FBGA, 29 mm x 29 mm, 1.0 mm pitch |
| Supply Voltage Core | 0.9 V (typical) | — |
| Suhu Operasi | 0C to +85C (Commercial) | 0C to +85C (C4 commercial grade) |
| Speed Grade | C4 | — |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Jenis Pemasangan | Surface Mount (SMT) | Surface Mount (BGA) |
| Process Technology | 40 nm TSMC | — |
| DSP Blocks | Yes (18x18 multipliers) | — |
| Aras MSL | 3 (per JEDEC J-STD-020) | 3 (per JEDEC J-STD-020, FBGA package) |
| Tray Packaging | Yes (per distributor listings) | — |
| Embedded Memory Bits | — | 5,760,000 |
| Embedded Memory (M9K/M144K blocks) | — | 488 (per family datasheet) |
| Number of LABs | — | 1900 |
| Maximum User I/Os | — | 488 |
| DSP Blocks (18x18 multipliers) | — | 432 |
| PLLs | — | 12 (per family datasheet) |
| Maximum Operating Frequency | — | 717 MHz |
| Transceiver Channels | — | Up to 12 (per family, model-dependent) |
| Transceiver Data Rate | — | Up to 6.375 Gbps (per Stratix III E family) |
| Process Node | — | 40 nm |
| Tegangan Pemberi Arus | — | Core 0.9 V, I/O 1.2 V-3.3 V (multi-rail) |
| Configuration Modes | — | JTAG, Passive Serial, Fast Passive Parallel |
| Status RoHS | — | Lead-free / RoHS compliant |
| Hard Memory Controller | — | DDR2/DDR3 SDRAM (per Stratix III E family) |