EP3SL70F780I4LN vs EP3SL70F780I3N Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL70F780I4LN disebabkan oleh Intel dan EP3SL70F780I3N disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL70F780I4LN EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780

EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780

EP3SL70F780I4LN ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL70F780I4LN EP3SL70F780I3N
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Family Stratix III L (logic-optimized) Stratix III L
Logic Elements 67,500 67,500
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Logic Array Blocks (LABs) 2,700 2,700
Embedded Memory 2,699,264 bits —
User I/Os 488 488
Operating Frequency (max) 375 MHz —
Process Node 65 nm —
Core Voltage 0.9 V 1.1 V (1.05 V to 1.15 V)
Kemasan 780-ball FC-FBGA —
Jenis Pemasangan Surface Mount Surface Mount
Tingkat sensitiviti Air Nama (MSL) 3 (168 hours) —
Suhu Operasi -40C to +100C (industrial, I suffix) —
Speed Grade I4 I3 (industrial)
Lead-Free / RoHS Yes (compliant per datasheet) —
Transceivers (Gbps) [DATA_NEEDED: transceiver count] —
DSP Blocks [DATA_NEEDED: DSP block count] —
Embedded Memory (bits) — 2,699,264
Process Technology — 65 nm CMOS
Operating Frequency — 500 MHz
Package Type — 780-BBGA, FCBGA (Flip-Chip FineLine BGA)
Ball Pitch — 1.0 mm
Suhu Hubungan Operasi — -40 C to +100 C
Configuration — SRAM-based, volatile
Status RoHS — Compliant (per distributor listings)

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