EP3SL70F780I4LN vs EP3SL70F780I3N 比較

詳細並排比較 EP3SL70F780I4LN 由 Intel 與 EP3SL70F780I3N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP3SL70F780I4LN EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780

EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780

EP3SL70F780I4LN ⚠ 最後購買機會

規格比較

參數 EP3SL70F780I4LN EP3SL70F780I3N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 啟用中
Family Stratix III L (logic-optimized) Stratix III L
Logic Elements 67,500 67,500
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Logic Array Blocks (LABs) 2,700 2,700
Embedded Memory 2,699,264 bits —
User I/Os 488 488
Operating Frequency (max) 375 MHz —
Process Node 65 nm —
Core Voltage 0.9 V 1.1 V (1.05 V to 1.15 V)
封裝 780-ball FC-FBGA —
安裝類型 Surface Mount Surface Mount
濕度敏感等級 (MSL) 3 (168 hours) —
工作溫度 -40C to +100C (industrial, I suffix) —
Speed Grade I4 I3 (industrial)
Lead-Free / RoHS Yes (compliant per datasheet) —
Transceivers (Gbps) [DATA_NEEDED: transceiver count] —
DSP Blocks [DATA_NEEDED: DSP block count] —
Embedded Memory (bits) — 2,699,264
Process Technology — 65 nm CMOS
Operating Frequency — 500 MHz
Package Type — 780-BBGA, FCBGA (Flip-Chip FineLine BGA)
Ball Pitch — 1.0 mm
工作接面溫度 — -40 C to +100 C
Configuration — SRAM-based, volatile
RoHS 狀態 — Compliant (per distributor listings)

資料表與資源

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