EP3SL70F780I4LN vs EP3SL70F780I3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL70F780I4LN sa pamamagitan ng Intel at EP3SL70F780I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Intel
EP3SL70F780I4LN EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780

EP3SL70F780I4LN - Stratix III L FPGA 67.5K LE, 488 I/O, FBGA-780

EP3SL70F780I4LN ⚠ Huling Pagbili

Pagsanggunian na paghahambing

Parametro EP3SL70F780I4LN EP3SL70F780I3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Aktibo
Family Stratix III L (logic-optimized) Stratix III L
Logic Elements 67,500 67,500
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count] —
Logic Array Blocks (LABs) 2,700 2,700
Embedded Memory 2,699,264 bits —
User I/Os 488 488
Operating Frequency (max) 375 MHz —
Process Node 65 nm —
Core Voltage 0.9 V 1.1 V (1.05 V to 1.15 V)
Packhaging 780-ball FC-FBGA —
Uri ng Pagpapasok Surface Mount Surface Mount
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 hours) —
Temperature na Operasyon -40C to +100C (industrial, I suffix) —
Speed Grade I4 I3 (industrial)
Lead-Free / RoHS Yes (compliant per datasheet) —
Transceivers (Gbps) [DATA_NEEDED: transceiver count] —
DSP Blocks [DATA_NEEDED: DSP block count] —
Embedded Memory (bits) — 2,699,264
Process Technology — 65 nm CMOS
Operating Frequency — 500 MHz
Package Type — 780-BBGA, FCBGA (Flip-Chip FineLine BGA)
Ball Pitch — 1.0 mm
Temperature ng Junction na Operasyon — -40 C to +100 C
Configuration — SRAM-based, volatile
Tindminan RoHS — Compliant (per distributor listings)

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