EPM570GF256C3 vs EPM570GF256C4 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM570GF256C3 disebabkan oleh Altera dan EPM570GF256C4 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM570GF256C3 | EPM570GF256C4 |
|---|---|---|
| Merek | Altera | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II |
| Device Model | EPM570 | — |
| Logic Elements (LE) | 570 | — |
| Equivalent Macrocells | 440 | — |
| User I/Os (max, FBGA-256) | 212 | — |
| User Flash Memory (UFM) | 8 Kbit | — |
| Propagation Delay tPD1 | 8.7 ns (C3 speed grade) | — |
| Internal Performance fMAX | 300 MHz | — |
| Process Technology | 0.18 um 6-layer-metal flash | 0.18 µm CMOS, flash-based configuration |
| Supply Voltage VCCINT | 1.8 V (core, MultiVolt) | 1.71 V to 1.89 V (core, derived from 2.5/3.3 V) |
| I/O Bank Voltage VCCIO | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL) |
| Kemasan | FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free | 256-ball FBGA (FineLine BGA) |
| Operating Temperature (commercial) | -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) | — |
| Programming Interface | JTAG (IEEE 1149.1) / ISP | — |
| Status RoHS | Compliant (lead-free) | Lead-free, RoHS compliant |
| Aras MSL | 3 (per JEDEC J-STD-020, typical for FBGA) | — |
| Vertical Migration Within FBGA-256 | Supported across EPM570 / EPM1270 / EPM2210 | — |
| Logic Elements (LEs) | — | 570 |
| Macrocells | — | 440 |
| Maximum User I/Os | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 5.4 ns |
| Suhu Operasi | — | 0 °C to +85 °C (commercial) |
| Ball Pitch | — | 1.0 mm |
| Jenis Pemasangan | — | Surface Mount |
| JTAG Support | — | IEEE 1149.1 boundary-scan + ISP |
| Configuration Memory | — | Non-volatile flash (instant-on, no boot PROM) |