EPM570GF256C3 vs EPM570GF256C4 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPM570GF256C3 sa pamamagitan ng Altera at EPM570GF256C4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPM570GF256C3 EPM570GF256C4
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family MAX II MAX II
Device Model EPM570 —
Logic Elements (LE) 570 —
Equivalent Macrocells 440 —
User I/Os (max, FBGA-256) 212 —
User Flash Memory (UFM) 8 Kbit —
Propagation Delay tPD1 8.7 ns (C3 speed grade) —
Internal Performance fMAX 300 MHz —
Process Technology 0.18 um 6-layer-metal flash 0.18 µm CMOS, flash-based configuration
Supply Voltage VCCINT 1.8 V (core, MultiVolt) 1.71 V to 1.89 V (core, derived from 2.5/3.3 V)
I/O Bank Voltage VCCIO 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-voltage LVCMOS/LVTTL)
Packhaging FBGA-256 (FineLine BGA), 17 x 17 mm, 1.0 mm pitch, lead-free 256-ball FBGA (FineLine BGA)
Operating Temperature (commercial) -40 C to +125 C per 3rd-party spec (Altera commercial: 0 C to +85 C) —
Programming Interface JTAG (IEEE 1149.1) / ISP —
Tindminan RoHS Compliant (lead-free) Lead-free, RoHS compliant
Level ng MSL 3 (per JEDEC J-STD-020, typical for FBGA) —
Vertical Migration Within FBGA-256 Supported across EPM570 / EPM1270 / EPM2210 —
Logic Elements (LEs) — 570
Macrocells — 440
Maximum User I/Os — 212
Pin-to-Pin Delay (tPD) — 5.4 ns
Temperature na Operasyon — 0 °C to +85 °C (commercial)
Ball Pitch — 1.0 mm
Uri ng Pagpapasok — Surface Mount
JTAG Support — IEEE 1149.1 boundary-scan + ISP
Configuration Memory — Non-volatile flash (instant-on, no boot PROM)

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