K4AAG165WA-BCWE vs K4AAG165WA-BCPB Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4AAG165WA-BCWE disebabkan oleh Samsung Electronics dan K4AAG165WA-BCPB disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Samsung Electronics
K4AAG165WA-BCPB - 16Gb DDR4 SDRAM 3200Mbps 1.2V | Samsung
K4AAG165WA-BCPB ✓ AktifPengandingan Spesifikasi
| Parametr | K4AAG165WA-BCWE | K4AAG165WA-BCPB |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR4 SDRAM | Volatile DRAM (DDR4 SDRAM) |
| Saiz Ingatan | 16 Gb (2 GB) | — |
| Memory Organization | 1G x 16 | — |
| Kadar Data | 3200 Mbps (DDR4-3200) | 3200 Mbps |
| Tegangan Pemberi Arus | 1.2 V | — |
| Kemasan | 96-ball FBGA | FBGA-96 |
| Package Dimensions | 13 x 9 mm | — |
| Ball Pitch | 0.8 mm | — |
| Suhu Operasi | -40C to +95C | [DATA_NEEDED: operating temperature for BCPB grade] |
| Jenis Antaramuka | Parallel, DDR4 | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Memory Format | DRAM (Volatile) | DRAM |
| Technology | DDR4 SDRAM, 8n prefetch, bank group architecture | DDR4 |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | Tray |
| Product Status | Active | Active |
| Density | — | 16 Gb |
| Organisasi | — | 1G x 16 |
| Supply Voltage (VDD) | — | 1.2 V |
| Interface Voltage (VDDQ) | — | 1.2 V |
| Power Consumption | — | 25% lower than DDR3 (per Samsung DDR4 family) |
| Bank Group Architecture | — | Yes (DDR4 internal bank groups) |
| On-Die Termination (ODT) | — | Yes |
| Max Capacity Family | — | Up to 32GB component (Samsung DDR4 family) |