K4B4G1646D-BMH9 vs K4B4G1646D-BYK0 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci K4B4G1646D-BMH9 disebabkan oleh Samsung Electronics dan K4B4G1646D-BYK0 disebabkan oleh Samsung Electronics. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | K4B4G1646D-BMH9 | K4B4G1646D-BYK0 |
|---|---|---|
| Merek | Samsung Electronics | Samsung Electronics |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4Gb | 4 Gbit |
| Organisasi | 256M x 16 | 256M x 16 |
| Number of Banks | 8 | — |
| Kadar Data | 2133 Mb/s per pin | 1600 Mbps (PC3-12800) |
| Supply Voltage (VDD) | 1.35V | — |
| Supply Voltage (VDDQ) | 1.35V | — |
| Kemasan | 96-ball FBGA (9x13mm) | 96-ball FBGA |
| Ball Pitch | 0.8mm | — |
| Suhu Operasi | [DATA_NEEDED: operating temperature range] | 0°C to 85°C |
| Latensi CAS | Programmable | Programmable (e.g., 11, 10, 9) |
| Burst Length | 8 and 4 | 8 (with burst chop 4) |
| Status RoHS | Compliant | — |
| Lead-Free | Yes | Yes |
| Boson Bebas | Yes | Yes |
| Tegangan Pemberi Arus | — | 1.35 V (1.5 V compatible) |
| On-Die Termination | — | Yes |
| RoHS Compliant | — | Yes |
| Bilangan Pin | — | 96 |
| Die Revision | — | D-die |