M29F400FB55N3F2 vs M29F800FB55N3F2 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci M29F400FB55N3F2 disebabkan oleh Micron Technology dan M29F800FB55N3F2 disebabkan oleh Micron Technology. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Micron Technology
M29F800FB55N3F2 - 8Mbit 5V Parallel NOR Flash 55ns | Micron
M29F800FB55N3F2 ✓ AktifPengandingan Spesifikasi
| Parametr | M29F400FB55N3F2 | M29F800FB55N3F2 |
|---|---|---|
| Merek | Micron Technology | Micron Technology |
| Kategori | Memory ICs | Memory ICs |
| Status Lingkungan Hidup | Aktif | Aktif |
| Jenis Ingatan | NOR Flash | — |
| Density | 4 Mbit (4194 kbit) | — |
| Organisasi | 256K x 16 / 512K x 8 | 1M x 8 / 512K x 16 |
| Access Time | 55 ns | 55 ns |
| Tegangan Pemberi Arus | 5 V | 5 V |
| Antaramuka | Parallel | — |
| Boot Block | Bottom boot block | — |
| Suhu Operasi | -40C to +125C | -40C to +125C |
| Program/Erase Controller | Embedded byte/word program algorithms | Embedded byte/word program algorithms |
| Kemasan | 48-TSOP I | — |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Standard Package Quantity | 1500 units (Tape & Reel) | — |
| Active/Standby Current | [DATA_NEEDED: active and standby current] | — |
| Erase/Program Endurance | [DATA_NEEDED: endurance cycles] | — |
| Data Retention | [DATA_NEEDED: retention years] | — |
| VIO Range | [DATA_NEEDED: I/O voltage range] | — |
| Status RoHS | Compliant (lead-free build per F2 suffix) | Compliant (lead-free terminations) |
| Memory Density | — | 8389 kbits (8 Mbit) |
| Jenis Antaramuka | — | Parallel NOR |
| Boot Block Architecture | — | Bottom Boot Block |
| Temperature Grade | — | Automotive (AEC-Q100) |
| Package Type | — | 48-pin TSOP1 |
| Package Shape | — | Rectangular (JESD designation TSOP1) |
| Terminal Count | — | 48 |
| JESD-609 Termination Code | — | e3 (lead-free) |
| Packaging | — | Tape & Reel (T/R) |