MC9S08DZ128CLF vs MC9S08DN32AMLC Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci MC9S08DZ128CLF disebabkan oleh NXP Semiconductors dan MC9S08DN32AMLC disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | MC9S08DZ128CLF | MC9S08DN32AMLC |
|---|---|---|
| Merek | NXP Semiconductors | NXP Semiconductors |
| Kategori | Microcontrollers | Microcontrollers |
| Status Lingkungan Hidup | NRND | NRND |
| Core | HCS08 (8-bit) | HCS08 (S08) |
| CPU Frequency | 40 MHz | 40 MHz |
| Bus Speed | 20 MHz | — |
| Flash Memory | 128 KB (128K x 8) | — |
| EEPROM | 2 KB | Embedded |
| RAM | 8 KB | 1.5 KB (1.5K x 8) |
| Tegangan Pemberi Arus | 2.7 V to 5.5 V | [DATA_NEEDED: VDD range] |
| Suhu Operasi | -40C to +85C (industrial) | -40 C to +125 C |
| I/O Pins | 40 | — |
| ADC | 12-bit, 24-channel, 2.5 us conversion | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN | MSCAN (CAN 2.0A/B), 1 module | — |
| Communication Interfaces | 1x SCI (UART), 1x SPI, 1x I2C, 1x MSCAN | — |
| Timers/PWM | 6-channel PWM timer module | — |
| Kemasan | 48-LQFP (7x7 mm), 0.5 mm pitch | 32-LQFP (7x7 mm) |
| Jenis Pemasangan | Surface Mount | Surface Mount |
| Debug Interface | On-chip BDM (single-wire background debug) | Background Debug Mode (BDM) |
| Aras MSL | 3 (per JEDEC J-STD-020) | — |
| Status RoHS | Compliant | Compliant |
| Instruction Set | — | HC08 with BGND |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| Number of I/O | — | 25 |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Packaging | — | Tray |
| Oscillator Type | — | External |