MC9S08DZ128CLF vs MC9S08DN32AMLC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08DZ128CLF sa pamamagitan ng NXP Semiconductors at MC9S08DN32AMLC sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MC9S08DZ128CLF | MC9S08DN32AMLC |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | NRND |
| Core | HCS08 (8-bit) | HCS08 (S08) |
| CPU Frequency | 40 MHz | 40 MHz |
| Bus Speed | 20 MHz | — |
| Flash Memory | 128 KB (128K x 8) | — |
| EEPROM | 2 KB | Embedded |
| RAM | 8 KB | 1.5 KB (1.5K x 8) |
| Volte ng Pagbibigay | 2.7 V to 5.5 V | [DATA_NEEDED: VDD range] |
| Temperature na Operasyon | -40C to +85C (industrial) | -40 C to +125 C |
| I/O Pins | 40 | — |
| ADC | 12-bit, 24-channel, 2.5 us conversion | 12-bit, up to 16 channels, 2.5 us conversion |
| CAN | MSCAN (CAN 2.0A/B), 1 module | — |
| Communication Interfaces | 1x SCI (UART), 1x SPI, 1x I2C, 1x MSCAN | — |
| Timers/PWM | 6-channel PWM timer module | — |
| Packhaging | 48-LQFP (7x7 mm), 0.5 mm pitch | 32-LQFP (7x7 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Debug Interface | On-chip BDM (single-wire background debug) | Background Debug Mode (BDM) |
| Level ng MSL | 3 (per JEDEC J-STD-020) | — |
| Tindminan RoHS | Compliant | Compliant |
| Instruction Set | — | HC08 with BGND |
| Bus Frequency | — | 20 MHz |
| Program Memory (Flash) | — | 32 KB (32K x 8) |
| Number of I/O | — | 25 |
| CAN (MSCAN) | — | CAN 2.0 A/B |
| Serial Interfaces | — | SCI (UART), SPI, I2C |
| Packaging | — | Tray |
| Oscillator Type | — | External |