MPC870VR66 vs MPC875VR66 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci MPC870VR66 disebabkan oleh NXP Semiconductors dan MPC875VR66 disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
MPC870VR66 MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 ✓ Aktif
NXP Semiconductors
MPC875VR66 MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP

MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP

MPC875VR66 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr MPC870VR66 MPC875VR66
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Masa Terakhir Dibeli
Manufacturer NXP Semiconductors —
Series PowerQUICC, MPC8xx PowerQUICC MPC8xx
Core Processor MPC8xx Power Architecture —
Core Count 1 —
Lebar Bus Data 32-bit —
Speed 66 MHz —
Performance 87 MIPS 87 MIPS
Tegangan Pemberi Arus Operasi 3.3 V —
Gambaran Suhu Operasi 0C to +95C —
Kemasan / Case 256-BGA (PBGA), 23x23 mm —
Jenis Pemasangan Surface Mount Surface Mount
Packaging Tray —
Lead Free Status Lead Free —
Status RoHS RoHS Compliant [DATA_NEEDED: RoHS status]
Processor Type MPC8xx PowerQUICC Communications Processor —
Product Type — Microprocessor (MPU)
Core Architecture — MPC8xx (PowerPC) - 32-bit
Core Clock Frequency — 66 MHz
Number of Cores — 1
Process Technology — 0.18 µm CMOS
Tegangan Pemberi Arus — 3.3 V
Suhu Operasi — 0 °C to +95 °C
Kemasan — 256-PBGA (23 x 23 mm)
Ball Pitch — 1.27 mm
Operating Mounting Type — Tray
Integrated Peripherals — CPM (Communications Processor Module), SCC, HDLC, UART, SPI
External Memory Interface — Yes - SDRAM / Flash / ROM (32-bit address bus)

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