MPC870VR66 vs MPC875VR66 比較
詳細並排比較 MPC870VR66 由 NXP Semiconductors 與 MPC875VR66 由 NXP Semiconductors. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | MPC870VR66 | MPC875VR66 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 類別 | Microcontrollers | Microcontrollers |
| 生命週期狀態 | 啟用中 | 最後購買 |
| Manufacturer | NXP Semiconductors | — |
| Series | PowerQUICC, MPC8xx | PowerQUICC MPC8xx |
| Core Processor | MPC8xx Power Architecture | — |
| Core Count | 1 | — |
| 資料匯流排寬度 | 32-bit | — |
| Speed | 66 MHz | — |
| Performance | 87 MIPS | 87 MIPS |
| 工作電源電壓 | 3.3 V | — |
| 工作溫度範圍 | 0C to +95C | — |
| 封裝 / 外殼 | 256-BGA (PBGA), 23x23 mm | — |
| 安裝類型 | Surface Mount | Surface Mount |
| Packaging | Tray | — |
| Lead Free Status | Lead Free | — |
| RoHS 狀態 | RoHS Compliant | [DATA_NEEDED: RoHS status] |
| Processor Type | MPC8xx PowerQUICC Communications Processor | — |
| Product Type | — | Microprocessor (MPU) |
| Core Architecture | — | MPC8xx (PowerPC) - 32-bit |
| Core Clock Frequency | — | 66 MHz |
| Number of Cores | — | 1 |
| Process Technology | — | 0.18 µm CMOS |
| 供應電壓 | — | 3.3 V |
| 工作溫度 | — | 0 °C to +95 °C |
| 封裝 | — | 256-PBGA (23 x 23 mm) |
| Ball Pitch | — | 1.27 mm |
| Operating Mounting Type | — | Tray |
| Integrated Peripherals | — | CPM (Communications Processor Module), SCC, HDLC, UART, SPI |
| External Memory Interface | — | Yes - SDRAM / Flash / ROM (32-bit address bus) |