MPC870VR66 vs MPC875VR66 对比

详细并排对比 MPC870VR66 出自 NXP Semiconductors 和 MPC875VR66 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

NXP Semiconductors
MPC870VR66 MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 - PowerQUICC 32-Bit MPU, 66MHz, 256-PBGA | NXP

MPC870VR66 ✓ 量产中
NXP Semiconductors
MPC875VR66 MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP

MPC875VR66 - 66MHz PowerQUICC MPC8xx 32-Bit MPU | NXP

MPC875VR66 ⚠ 最后一次采购

规格对比

参数 MPC870VR66 MPC875VR66
品牌 NXP Semiconductors NXP Semiconductors
分类 Microcontrollers Microcontrollers
生命周期状态 有效 最后采购期
库存状态 有库存 有库存
单价(USD) $25.90 $17.95
Manufacturer NXP Semiconductors —
Series PowerQUICC, MPC8xx PowerQUICC MPC8xx
Core Processor MPC8xx Power Architecture —
Core Count 1 —
数据总线宽度 32-bit —
Speed 66 MHz —
Performance 87 MIPS 87 MIPS
工作电源电压 3.3 V —
工作温度范围 0C to +95C —
封装 / 外壳 256-BGA (PBGA), 23x23 mm —
安装类型 Surface Mount Surface Mount
Packaging Tray —
Lead Free Status Lead Free —
RoHS 状态 RoHS Compliant [DATA_NEEDED: RoHS status]
Processor Type MPC8xx PowerQUICC Communications Processor —
Product Type — Microprocessor (MPU)
Core Architecture — MPC8xx (PowerPC) - 32-bit
Core Clock Frequency — 66 MHz
Number of Cores — 1
Process Technology — 0.18 µm CMOS
电源电压 — 3.3 V
工作温度 — 0 °C to +95 °C
封装 — 256-PBGA (23 x 23 mm)
Ball Pitch — 1.27 mm
Operating Mounting Type — Tray
Integrated Peripherals — CPM (Communications Processor Module), SCC, HDLC, UART, SPI
External Memory Interface — Yes - SDRAM / Flash / ROM (32-bit address bus)

数据手册与资源

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