SPC5643LFF2MMM1R vs SPC5645SF1VVU Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci SPC5643LFF2MMM1R disebabkan oleh NXP Semiconductors dan SPC5645SF1VVU disebabkan oleh NXP Semiconductors. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

NXP Semiconductors
SPC5643LFF2MMM1R SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R - 120MHz Dual-Core MCU 1MB Flash | NXP

SPC5643LFF2MMM1R ✓ Aktif
NXP Semiconductors
SPC5645SF1VVU SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP

SPC5645SF1VVU - 32-bit MCU, 2MB Flash, 125MHz, 416-PBGA | NXP

SPC5645SF1VVU ✓ Aktif

Pengandingan Spesifikasi

Parametr SPC5643LFF2MMM1R SPC5645SF1VVU
Merek NXP Semiconductors NXP Semiconductors
Kategori Microcontrollers Microcontrollers
Status Lingkungan Hidup Aktif Aktif
Manufacturer NXP Semiconductors (formerly Freescale) —
Series MPC5643L (MPC56xx Qorivva family) —
Core Architecture Power Architecture® e200z4 (dual-core with delayed lockstep) Power Architecture e200z4d (dual-core lockstep option)
Core Count 2 (1 main + 1 lockstep checker) —
Maximum CPU Clock 120 MHz —
Program Memory (Flash) 1 MB (1M x 8) —
Data Memory (SRAM) [DATA_NEEDED: SRAM size] —
Operating Voltage Range [DATA_NEEDED: VDD range, typ. 3.3 V or 5 V I/O] —
Gambaran Suhu Operasi -40 °C to +125 °C (automotive grade) -40 C to +105 C
Kemasan 257-LFBGA / MAPBGA 14x14 mm —
Jenis Pemasangan Surface Mount (BGA) Surface Mount
AEC-Q100 Qualification Yes (Automotive qualified per NXP product page) Yes (Automotive Grade)
Functional Safety Target ISO 26262 ASIL-D capable (via lockstep + ECC + FCU) —
Communication Interfaces FlexCAN, SPI, I²C, UART (LIN-capable via SCI) —
Debug Interface Nexus (JTAG, auxiliary) JTAG / Nexus 5001 (Level 3 trace)
Lead-Free / RoHS Compliant (lead-free BGA) —
Lebar Bus Data — 32-bit
Frekuensi Klock Maksimum — 125 MHz
Program Memory Size — 2 MB Flash
Program Memory Type — Flash with ECC
SRAM Size — [DATA_NEEDED: SRAM size in KB]
Tegangan Pemberi Arus — 3.3 V / 5 V tolerant I/O
Kemasan / Case — 416-PBGA (27x27 mm, 1.0 mm pitch)
Functional Safety — Targeting ASIL-D (dual-core lockstep)
CAN Controllers — Dual CAN 2.0B (FlexCAN)
FlexRay — Yes, dual-channel FlexRay module
Ethernet — [DATA_NEEDED: Ethernet MAC availability]
Graphics Accelerator — Yes, integrated GFXPU for TFT cluster
ADC — 12-bit ADC, multi-channel
Timers — eMIOS unified channels
Status RoHS — Compliant
Process Technology — 90 nm CMOS
JEDEC MSL — MSL3 (per PBGA JEDEC J-STD-020)

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