10CX085YU484E6G - Cyclone 10 GX FPGA 85K LE U484BGA | Intel
MPN: 10CX085YU484E6G ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $425 | $425.00 |
| 10 | $387 | $3,870.00 |
| 100 | $348.3 | $34,830.00 |
| 500 | $312 | $156,000.00 |
| 1,000 | $282 | $282,000.00 |
10CX085YU484E6G Overview
A field-programmable gate array (FPGA) is a reconfigurable integrated circuit whose logic fabric, block RAM, DSP blocks, and I/O cells are programmed by the user after manufacture. FPGAs sit in the broader semiconductor hierarchy as programmable logic devices (PLDs) alongside CPLDs, and they are commonly positioned between microcontrollers (fixed function, low power) and ASICs (highest density, lowest unit cost at volume) for applications that demand hardware-level parallelism and rapid design iteration.
Key Cyclone 10 GX features include hardened 10 Gbps transceivers (GX blocks), a hard PCIe Gen2 x4 IP core, dedicated variable-precision DSP blocks, and Intel's Configurable Logic Engine based on adaptive logic modules (ALMs). The 10CX085 in the U484 package provides up to 288 general-purpose I/Os distributed across 8 I/O banks, supporting LVDS, LVCMOS, SSTL, and other single-ended and differential I/O standards. The device also includes an embedded Hard Memory Controller and supports external DDR3/DDR4 memory interfaces.
Architecturally, the Cyclone 10 GX fabric combines LABs (logic array blocks) of 16 ALMs each, M20K (20 Kb) embedded memory blocks, and 18x18 multipliers that can be configured as 27-bit fixed-point or floating-point arithmetic units. The transceiver tiles support protocols such as PCIe Gen2, 10GbE (10GBASE-R), CPRI, and JESD204B. Configuration is via active serial (AS), passive serial (PS), fast passive parallel (FPP), or JTAG, and the device supports bitstream encryption with AES-256 and tamper protection.
Typical applications for the 10CX085YU484E6G include industrial machine vision and video bridging, 4K/8K video processing, low-cost wireline communication line cards, IoT edge aggregation with PCIe connectivity, motor control and digital drive platforms, and protocol bridging (for example, converting MIPI CSI-2 to GigE Vision). Engineers choose the 10CX085 over the smaller 10CX010 when the logic, memory, and DSP budgets exceed the lower-density members but the system does not justify stepping up to a Cyclone 10 GX 10CX105 or 10CX150.
When designing with this part, pay close attention to transceiver reference clock routing, PLL configuration, and decoupling on each VCC/VCCPT/VCCR/VCCT/VCCIO rail - the Intel Pin Connection Guidelines recommend a 4-layer board with continuous ground for power integrity. Power sequencing must respect the 100 ms-or-faster POR delay and the VCCBAT requirement for battery-backed security keys.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the Cyclone 10 GX family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for 10CX085YU484E6G — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with 10CX085YU484E6G (same form factor and footprint) — differing in Package, Operating Temperature, DSP Blocks, Embedded Memory, Transceivers.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
10CX085YU484E5G
✅ Drop-In✓ In Stock
$82.4 / Unit
View Datasheet →10CX105YU484E6G
✅ Drop-In✓ In Stock
$65.8 / Unit
View Datasheet →10CX105YU484E5G
✅ Drop-In✓ In Stock
$275 / Unit
View Datasheet →10CX085YU484E6G Maximum Ratings & Electrical Characteristics
| Family | Cyclone 10 GX |
| Logic Elements | 85,000 |
| Adaptive Logic Modules (ALMs) | 31,560 |
| Registers | 126,240 |
| Embedded Memory (M20K) | 5,959,680 bits |
| Embedded Memory Blocks (M20K) | 246 |
| MLAB Memory | 417,920 bits |
| DSP Blocks (18x19 Multipliers) | 156 |
| Hard Memory Controllers | 2 |
| Maximum User I/Os | 288 |
| I/O Banks | 8 |
| Transceivers (GX) | 6 (up to 12.5 Gbps) |
| PCIe Hard IP Blocks | 1 (Gen2 x4) |
| Package | 484-pin UBGA (U484, 19x19 mm) |
| Speed Grade | -E6 (commercial) |
| Operating Temperature | 0C to +85C (commercial, TJ) |
| Process Technology | Intel 20 nm |
| Configuration Modes | AS, PS, FPP, JTAG |
| Bitstream Encryption | AES-256 |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
10CX085YU484E6G 484-pin ubga (u484, 19x19 mm) Pin Configuration Guide
Pin configuration for 10CX085YU484E6G (484-pin ubga (u484, 19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 10CX085YU484E6G.
Refer to the datasheet for full pin configuration.
Typical Applications
10CX085YU484E6G is suitable for 6 applications: Industrial Machine Vision and Video Bridging, 4K Ultra-HD Video Processing and Display, PCIe Endpoint and IoT Edge Aggregation, Motor Control and Digital Drive, Protocol Bridging (MIPI to GigE / USB3 to PCIe), Low-Cost Wireline Communication Line Cards.
Industrial Machine Vision and Video Bridging
The 10CX085YU484E6G is a strong fit for industrial machine vision and video bridging designs because it integrates a hard PCIe Gen2 x4 controller plus six 12.5 Gbps transceivers in a single U484 BGA package. Engineers typically place the FPGA between a Camera Link or MIPI CSI-2 sensor front-end and a host PC over PCIe or 10GigE Vision, using the 5.96 Mb of M20K memory to buffer full-HD frames at 60 fps. The 156 DSP blocks accelerate Bayer demosaic, gamma correction, and edge detection, while 288 user I/Os drive LVDS/Sub-LVDS sensor lanes without external bridge chips.
Recommended
4K Ultra-HD Video Processing and Display
For 4K UHD video processing at 60 fps, the 10CX085YU484E6G's 5.96 Mb embedded memory sustains three full raster buffers while its DSP blocks run scaling, deinterlacing, and color-space conversion in real time. The 12.5 Gbps transceivers carry SDI (SMPTE 424M/425M) up to 12G-SDI without external reclockers. By selecting the -E6 speed grade and reserving 20 percent timing margin, designers close timing at 150 MHz fabric Fmax typical for these pipelines.
Recommended
PCIe Endpoint and IoT Edge Aggregation
The hard PCIe Gen2 x4 IP in the 10CX085YU484E6G delivers 16 Gbps of host interconnect bandwidth without consuming soft logic, making it a natural choice for PCIe endpoint cards that aggregate IoT sensor data. The six transceivers can simultaneously run 10GBASE-KR to upstream switches or CPRI up to 9.8 Gbps to remote radio heads. Industrial temperature variants support factory-edge deployment, and the AES-256 bitstream encryption protects IP against cloning.
Recommended
Motor Control and Digital Drive
Industrial drives using the 10CX085YU484E6G benefit from the 156 DSP blocks for field-oriented control (FOC), space-vector PWM, and encoder decoding at 200 kHz loop rates. The 288 user I/Os interface to resolver-to-digital converters, gate drivers, and isolation barriers, while the hard memory controller offloads DDR3 read/write traffic. The -E6 commercial speed grade is adequate for most FOC implementations up to 50 kHz PWM switching frequency.
Recommended
Protocol Bridging (MIPI to GigE / USB3 to PCIe)
The 10CX085YU484E6G excels at protocol bridging because of its heterogeneous transceiver and I/O mix. A typical design ingests MIPI CSI-2 from image sensors over Sub-LVDS or SLVS, reformats the stream, and transmits GigE Vision over 10GBASE-R using one of the six transceivers. The 5.96 Mb M20K memory absorbs line-rate jitter, and the hard PCIe Gen2 block provides the host uplink. Designers should size the M20K buffer to at least 1.5x the maximum packet size to handle backpressure.
Recommended
Low-Cost Wireline Communication Line Cards
Wireline line cards using the 10CX085YU484E6G leverage the six transceivers to backplane interfaces such as 10GbE, Interlaken, or CPRI without external PHYs. The hard memory controller and DDR3/DDR4 support makes the device suitable for packet buffering and queuing at line rate. The U484 BGA fits dense line-card layouts where 1.0 mm pitch is the smallest acceptable BGA for the assembly house.
Recommended
Recommended Products Summary
Engineering reference data for 10CX085YU484E6G — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 10CX085YU484E5G | 10CX105YU484E6G | 10CX105YU484E5G |
|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel |
| Package | 484-pin UBGA (U484, 19x19 mm) | 484-pin UBGA (U484, 19x19 mm) - same | 484-pin UBGA (U484, 19x19 mm) - same | 484-pin UBGA (U484, 19x19 mm) - same |
| Logic Elements | 85,000 | 85,000 (same) | 105,000 (+24%) | 105,000 (+24%) |
| Speed Grade | -E6 | -E5 (faster) | -E6 (same) | -E5 (faster) |
| Embedded Memory | 5,959,680 bits | 5,959,680 bits (same) | 8,011,520 bits (+34%) | 8,011,520 bits (+34%) |
| DSP Blocks (18x19) | 156 | 156 (same) | 198 (+27%) | 198 (+27%) |
| Maximum User I/Os | 288 | 288 (same) | 288 (same) | 288 (same) |
| Transceivers (up to 12.5 Gbps) | 6 | 6 (same) | 6 (same) | 6 (same) |
| Hard PCIe Gen2 | Yes (x4) | Yes (x4) | Yes (x4) | Yes (x4) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
Key Differentiators
- Faster Fmax speed grade available in identical U484 footprint (vs 10CX085YU484E5G)
- Higher logic density in same U484 package (vs 10CX105YU484E6G)
- Hardened PCIe Gen2 x4 IP eliminates soft-logic cost (vs Xilinx Artix-7 XC7A100T (FBG484))
Design Notes
The 10CX085YU484E6G requires multiple separately decoupled rails: VCC (core), VCCPT (programmable power technology), VCCR (transceiver RX), VCCT (transceiver TX), VCCIO (per bank), and VCCPGM/VCCBAT. According to the Cyclone 10 GX datasheet, VCC must ramp monotonically within 100 ms and VCCBAT must be present before VCC to preserve AES keys. Place 0.1 uF X7R plus 10 uF bulk caps within 100 mil of every VCC pin pair.
In U484 BGA, the die is exposed through the package substrate; a 4-layer PCB with continuous inner ground plane yields a theta-JA of approximately 13 C/W per the device thermal model. Estimated: at 1.2 W typical and 3.0 W worst-case transceiver utilization in still air at 25C ambient, junction temperature stays below 80C. Add 2 oz copper pours on outer layers for industrial 70C ambient operation.
BGA breakout for the 1.0 mm pitch U484 requires via-in-pad or microvia stacks on 0.8 mm/0.4 mm pad-and-via diameters. Match all six transceiver channels with reference-clock traces within 0.127 mm differential length matching (Zdiff = 85 ohm +/-10 percent) to keep jitter below the 12.5 Gbps spec. Keep high-speed TX/RX lanes away from GPIO edges and routed under adjacent ground islands only.
Do not reuse a Cyclone V or Cyclone 10 LP U484 board for this Cyclone 10 GX part without reviewing pinout - despite identical U484 ball codes, the GX device adds transceiver balls that are NC on 10LP. Quartus Prime will flag the NC conflicts at compilation; do not bypass these warnings. Also, do not omit VCCPT decoupling - it is the supply for the configuration logic and loss of monotonic ramp will lock the device in POR.
Compliance Information
RoHS and lead-free confirmed by distributor listings. Cyclone 10 GX is not AEC-Q100 qualified; for automotive choose a Cyclone V or Cyclone 10 LP automotive variant. Conflict Minerals statement available from Intel product compliance.
