5CSEBA2U19C6N - Cyclone V SE SoC FPGA, 25K LE, ARM Cortex-A9 | Intel
MPN: 5CSEBA2U19C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $102.49 | $102.49 |
| 10 | $96.5 | $965.00 |
| 100 | $88.75 | $8,875.00 |
| 500 | $81.2 | $40,600.00 |
| 1,000 | $74.6 | $74,600.00 |
Drop-in alternatives for 5CSEBA2U19C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA2U19C7N
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$16.9 / Unit
View Datasheet →5CSEBA2U19C8N
✅ Drop-In✓ In Stock
$40.48 / Unit
View Datasheet →5CSEBA2U19A7N
✅ Drop-In✓ In Stock
$92.1 / Unit
View Datasheet →5CSEBA2U19C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE SoC FPGA |
| Logic Elements | 25 K |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| HPS Maximum Clock Frequency | 925 MHz |
| DSP Blocks | Variable-precision DSP |
| Package | 484-pin UBGA (19x19 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature Grade | Commercial (other) |
| Memory Interfaces | DDR2, DDR3, LPDDR2 with ECC |
| HPS Peripherals | GbE, USB 2.0 OTG, SATA, CAN, UART, SPI, I2C, SD/SDIO/MMC |
| L2 Cache | 512 KB shared |
| L1 Cache per Core | 32 KB I-cache + 32 KB D-cache |
| FPGA-to-HPS Bridges | AXI-32/AXI-64, FPGA-to-SDRAM ports |
| Process Technology | TSMC 28 nm low-power |
| RoHS Status | Compliant |
5CSEBA2U19C6N 484-pin ubga (19x19 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA2U19C6N (484-pin ubga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA2U19C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA2U19C6N is suitable for 7 applications: Industrial Motor Control and Drive, Machine Vision and Industrial Imaging, Software-Defined Radio (SDR) Baseband, Automotive Driver-Assistance (ADAS) Sensor Fusion, Medical Imaging and Diagnostics, Broadcast Video Processing and Pro A/V, Smart IoT Gateway and Edge Compute.
Industrial Motor Control and Drive
The 5CSEBA2U19C6N is well matched to multi-axis industrial motor-control drives because the FPGA fabric runs deterministic field-oriented control loops and high-resolution PWM generation, while the dual ARM Cortex-A9 MPCore HPS executes EtherCAT/CANopen stacks and the HMI. With 25K logic elements the fabric can host 2–3-axis FOC plus safety logic; the HPS clock of 925 MHz and integrated GbE provide the throughput needed for real-time industrial Ethernet. The 28 nm low-power process keeps junction temperatures manageable in sealed drive enclosures, and the integrated DDR3 controller with ECC delivers reliable data logging.
Recommended
Machine Vision and Industrial Imaging
The 5CSEBA2U19C6N fits machine-vision pipelines because the FPGA fabric implements Bayer demosaic, exposure correction, edge detection, and frame-buffer management at line rate, while the ARM Cortex-A9 HPS runs the inference engine and GigE Vision / USB3 Vision protocol stacks. The HPS clock of 925 MHz plus dedicated FPGA-to-HPS AXI bridges sustain multi-megapixel throughput, and the variable-precision DSP blocks accelerate convolution kernels without off-chip logic. The integrated SATA and SD/SDIO/MMC peripherals support local SSD logging for inspection evidence.
Recommended
Software-Defined Radio (SDR) Baseband
The 5CSEBA2U19C6N is a strong fit for SDR baseband processing because the FPGA fabric implements physical-layer modulation, channelization, and forward error correction, while the ARM Cortex-A9 HPS runs the protocol stack, TCP/IP networking, and management plane. The HPS GbE MAC delivers 1 Gbps backhaul throughput with hardware offload, and the 925 MHz HPS clock is sufficient for LTE small-cell upper-layer timing. Variable-precision DSP blocks accelerate FFTs and turbo decoders; transceivers can be added by choosing a Cyclone V SX/ST/GT variant when RF I/O is needed at the same footprint family.
Recommended
Automotive Driver-Assistance (ADAS) Sensor Fusion
The 5CSEBA2U19C6N is well suited to ADAS sensor-fusion nodes because the FPGA fabric merges radar/lidar/ultrasonic data streams with deterministic latency, while the ARM Cortex-A9 HPS runs perception and vehicle-network stacks (CAN, Ethernet AVB). For automotive temperature requirements choose the AEC-Q100-qualified 5CSEBA2U19A7N, which is pin-compatible with the 5CSEBA2U19C6N on the same 484-pin UBGA footprint. The 28 nm process and integrated ECC memory controller improve functional-safety margin, and the SoC EDS toolchain supports AUTOSAR integration for production ECU deployment.
Recommended
Medical Imaging and Diagnostics
The 5CSEBA2U19C6N fits medical-imaging systems such as portable ultrasound and endoscopy because the FPGA fabric performs beamforming, digital down-conversion, and image reconstruction in real time, while the ARM Cortex-A9 HPS handles the user interface, patient-data encryption, and DICOM networking. The 925 MHz HPS clock and L2 cache of 512 KB keep the operator UI responsive while the FPGA pipeline runs at full sensor frame rate. The integrated DDR3 controller with ECC protects diagnostic data integrity, and low-power 28 nm operation suits battery-powered cart designs.
Recommended
Broadcast Video Processing and Pro A/V
The 5CSEBA2U19C6N is appropriate for broadcast video processing because the FPGA fabric implements SDI/HDMI bridge logic, color-space conversion, and frame-rate conversion, while the ARM Cortex-A9 HPS runs the control plane, IP streaming, and management UI. Variable-precision DSP blocks accelerate motion-adaptive deinterlacing and scaling kernels; the integrated SATA and GbE peripherals enable direct-to-network ingest. The SoC architecture lets a single device replace the traditional MCU-plus-FGA pair, shrinking BOM and reducing board area in broadcast studio gear.
Recommended
Smart IoT Gateway and Edge Compute
The 5CSEBA2U19C6N fits industrial IoT gateways because the dual ARM Cortex-A9 MPCore HPS runs a hardened Linux stack with containers, TLS/DTLS security, and protocol adapters (MQTT, OPC UA, Modbus/TCP), while the FPGA fabric accelerates crypto, packet filtering, and custom industrial peripherals. The HPS clock of 925 MHz supports full TLS 1.3 handshakes on Cortex-A9 without stalling data-plane traffic. The integrated GbE plus USB 2.0 plus CAN peripherals cover most industrial uplink and field-bus needs, and the 28 nm low-power process supports fanless enclosure designs at the edge.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA2U19C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA2U19C7N | 5CSEBA2U19C8N | 5CSEBA2U19A7N |
|---|---|---|---|---|
| Package | 484-pin UBGA (19x19 mm) | 484-pin UBGA (19x19 mm) | 484-pin UBGA (19x19 mm) | 484-pin UBGA (19x19 mm) |
| Brand | Intel | Intel | Intel | Intel |
| Family | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC | Cyclone V SE SoC |
| Logic Elements | 25 K | 25 K | 25 K | 25 K |
| HPS Processor | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz | Dual ARM Cortex-A9 925 MHz |
| Speed Grade | 6 | 7 | 8 | 7 |
| Temperature Grade | Commercial (other) | Commercial (other) | Commercial (other) | Automotive (AEC-Q100) |
| Pin Count | 484 | 484 | 484 | 484 |
| Unit Price (qty-1, USD) | 102.49 | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Same-die speed-grade flexibility in identical footprint (vs 5CSEBA2U19C8N)
- Commercial-grade at lowest cost versus automotive-grade pin-compatible variant (vs 5CSEBA2U19A7N)
- SoC integration replaces MCU+FPGA pair in same package (vs 5CEFA9F27C7N (FPGA-only Cyclone V E))
Design Notes
Estimated: with VIN rails at 0.9 V (core), 1.1 V (HPS core), 1.5 V (DDR3), 1.8 V (transceivers/aux), 2.5 V, and 3.3 V (HPS I/O), the 5CSEBA2U19C6N draws roughly 1.5–3 W typical depending on logic utilization and HPS activity. Decouple each rail close to the package with at least one 4.7 µF bulk and one 0.1 µF/0402 per pin group. Use a power-tree manager such as the LTC3676 / LM3880 / EM11x to enable sequencing; HPS must boot only after core and DDR rails are stable. Place a 10 µF bulk at the regulator output and a ferrite bead in series where the supply enters the BGA keep-out zone.
Estimated: at full HPS utilization (~1 W) plus ~70% logic utilization (~2 W), total power is roughly 3 W. With a 484-pin UBGA package on a 4-layer JEDEC board, theta_JA is in the 12–18 °C/W range, implying a 36–54 °C junction temperature rise above ambient at 3 W. For sealed industrial enclosures place at least 4 thermal vias in a 3×3 array under the exposed center pads and provide a copper pour on inner layers; add a small heatsink for environments above 60 °C ambient. Monitor on-die temperature via the HPS TMU and the FPGA Temperature-Sensing ADC, and throttle the HPS clock or fabric utilization if Tj exceeds 100 °C.
Route all DDR3 signals on the inner layers below the BGA with matched trace lengths; for DDR3-1600 use the Cyclone V External Memory Interface Pin Tables from Intel. The 484-pin UBGA has a 1.0 mm ball pitch; use 0.6 mm laser-drilled micro-vias on a 1-2-N-2-1 stack-up to fan-out from inner balls. Keep HPS MII/RGMII, USB, and SATA differential pairs length-matched within 150 mil, and route the GbE differential pairs over a continuous reference plane. Separate noisy digital return paths from analog PLL supplies to keep jitter within HPS jitter budget.
Do not assume all 484 balls are usable as user I/O; the Cyclone V SE SoC has dedicated HPS balls, configuration balls, supply balls, and JTAG balls that are not freely assignable in Quartus. Use the Quartus Pin Planner rather than the datasheet pinout table alone, because Intel deprecates and reassigns balls between device revisions. The SoC EDS preloader must match the FPGA configuration bitstream; if you regenerate the .sof without rebuilding the preloader, the HPS will fail to bring DDR3 up. Enable MSEL pin settings correctly for AS, PS, JTAG, or FPP configuration modes — incorrect MSEL is the most common 'dead board' symptom in new prototypes.
Estimated: at 925 MHz HPS clock and DDR3-1600 (800 MHz clock) with 1.0 V swings, edge rates are ~200 ps. Route clocks over a continuous ground reference; avoid splitting the ground plane between analog PLL supply and the digital HPS core. Series-terminate HPS clocks close to the driver with a 33 Ω resistor if you observe over-/undershoot above 200 mV on the 50 Ω transmission line. For USB 2.0, keep the 90 Ω differential pair within 5 mm length mismatch and add a common-mode choke near the connector. Hold the FPGA-to-HPS AXI bridges below 200 MHz to keep timing closure tractable across process-voltage-temperature corners.
Compliance Information
RoHS and REACH compliance confirmed on the Intel Cyclone V device family product page. AEC-Q100 qualified variants are available in the same die/package under 5CSEBA2U19A7N; this part is commercial grade and not automotive qualified.
