5CSEBA4U19I7S-N - Cyclone V SE SoC FPGA, 40K LE, ARM Cortex-A9 | Intel
MPN: 5CSEBA4U19I7S-N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $385 | $385.00 |
| 10 | $365.5 | $3,655.00 |
| 100 | $342 | $34,200.00 |
| 500 | $318.75 | $159,375.00 |
| 1,000 | $295.4 | $295,400.00 |
Drop-in alternatives for 5CSEBA4U19I7S-N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
5CSEBA4U19I7N
✅ Drop-In✓ In Stock
$72 / Unit
View Datasheet →5CSEBA4U19I7LN
✅ Drop-In✓ In Stock
$168 / Unit
View Datasheet →5CSEBA4U19I7
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →5CSEBA4U19A7N
✅ Drop-In✓ In Stock
$99.9 / Unit
View Datasheet →5CSEBA4U19C7N
✅ Drop-In✓ In Stock
$36.92 / Unit
View Datasheet →5CSEBA4U19C8SN
✅ Drop-In✓ In Stock
$44.1 / Unit
View Datasheet →5CSEBA2U19I7SN
✅ Drop-In✓ In Stock
$65.96 / Unit
View Datasheet →5CSEBA4U19I7S-N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SE |
| Device Type | SoC FPGA with ARM Cortex-A9 MPCore + CoreSight |
| Logic Elements | 40,000 |
| Process Technology | 28 nm TSMC low-power |
| Core Voltage | 1.1 V |
| Hard Processor System Cores | 1 x ARM Cortex-A9 MPCore |
| Maximum HPS Clock Frequency | 800 MHz |
| Package | 484-ball UFBGA (19x19 mm) |
| Mounting Type | Surface Mount |
| Maximum Seated Height | 1.9 mm |
| Operating Temperature Grade | Industrial (-40C to +100C Tj) |
| Speed Grade | 7 |
| Supply Type | Tray |
| RoHS Status | Compliant |
| Lead-Free | Yes |
5CSEBA4U19I7S-N 484-ball ufbga (19x19 mm) Pin Configuration Guide
Complete pinout information for 5CSEBA4U19I7S-N (484-ball ufbga (19x19 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSEBA4U19I7S-N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSEBA4U19I7S-N is suitable for 6 applications: Industrial Motor Control, Machine Vision Pre-Processing, Industrial Protocol Bridging Gateway, Medical Imaging Front-End, Smart Grid Sensor Aggregation Node, Ruggedized Aerospace Subsystem.
Industrial Motor Control
The 5CSEBA4U19I7S-N's integrated ARM Cortex-A9 MPCore at 800 MHz runs real-time motor control loops (FOC, field-oriented control) while the 40K logic elements implement high-speed PWM generation, encoder decoding, and safety logic. The industrial temperature grade (-40C to +100C Tj) suits factory-floor cabinets and outdoor drive enclosures. Hardware parallelism in the FPGA fabric delivers deterministic sub-microsecond response that software-only MCUs cannot match, while the Cortex-A9 handles motion profiling, communication stacks (EtherCAT, PROFINET), and HMI rendering. Reference Cyclone V SoC EDS motor-control examples for validated PID + space-vector PWM implementations.
Recommended
Machine Vision Pre-Processing
In machine vision front-ends, the 5CSEBA4U19I7S-N's variable-precision DSP blocks accelerate image filtering, edge detection, and histogram equalization at line-rate, offloading the Cortex-A9 for higher-level inspection algorithms. The hard memory controller supports DDR3/LPDDR2 buffers for high-bandwidth frame capture from parallel image sensors. Industrial temperature operation suits factory vision cells with ambient thermal swings. Reference Intel's Cyclone V video reference designs and the SoC EDS bare-metal driver examples for Camera Link or MIPI CSI-2 ingestion. The 40K LE budget is sufficient for mid-resolution grayscale pipelines up to 1080p at reduced frame rates.
Recommended
Industrial Protocol Bridging Gateway
The 5CSEBA4U19I7S-N bridges legacy industrial protocols (Modbus RTU, CAN, RS-485) to modern Ethernet-based protocols (EtherCAT, PROFINET, OPC-UA) using the Cortex-A9 for protocol stacks and the FPGA fabric for deterministic timing and timestamping. The 28nm low-power process keeps thermal envelope manageable in DIN-rail mounted gateways. Industrial temperature operation supports outdoor and cabinet-mounted deployments. The 40K LE budget accommodates soft IP cores for multiple concurrent serial protocols with hardware FIFO buffering. SoC EDS provides validated Linux BSPs with PREEMPT-RT patches for deterministic Ethernet latencies.
Recommended
Medical Imaging Front-End
The 5CSEBA4U19I7S-N serves as the processing heart of ultrasound, endoscopy, or patient-monitoring front-ends where the ARM Cortex-A9 runs the application stack while FPGA fabric performs real-time beamforming, signal conditioning, or sensor fusion. The 28nm process keeps power consumption within portable medical device thermal budgets, and the integrated HPS eliminates a discrete processor reducing BOM and board area. Industrial temperature grade accommodates clinical and field-deployment environments. Reference IEC 60601-1 compliance considerations in your safety architecture; the FPGA itself is not a medical-grade qualified component and requires system-level validation.
Recommended
Smart Grid Sensor Aggregation Node
In substation automation and smart-grid sensor hubs, the 5CSEBA4U19I7S-N aggregates data from multiple current/voltage sensors via the FPGA fabric's parallel I/O and DSP blocks, with the Cortex-A9 running IEC 61850, DNP3, or MQTT protocols for upstream SCADA communication. Hardened cryptography accelerators in the HPS enable secure authentication and TLS 1.2/1.3 links. Industrial temperature operation matches outdoor substation enclosures. The 40K LE budget handles simultaneous multi-channel FFTs for power-quality analysis alongside the HPS workload, eliminating the need for a separate DSP processor.
Recommended
Ruggedized Aerospace Subsystem
The 5CSEBA4U19I7S-N's industrial temperature grade and radiation-tolerant design margins make it suitable for ruggedized avionics subsystems where the integrated HPS runs flight control software and the FPGA fabric implements deterministic I/O handling, ARINC 429 channels, or MIL-STD-1553 bridges. The 28nm process and BGA package withstand vibration and thermal cycling per DO-160 testing when properly qualified at the system level. Reference Intel's industrial Cyclone V qualification reports for vibration, shock, and thermal-cycling data. Designers should apply additional component-level screening beyond standard datasheet specs for flight-critical deployments.
Recommended
Recommended Products Summary
Engineering reference data for 5CSEBA4U19I7S-N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSEBA4U19I7N | 5CSEBA4U19I7LN | 5CSEBA4U19A7N | 5CSEBA4U19C7N | 5CSEBA2U19I7SN |
|---|---|---|---|---|---|---|
| Package | 484-ball UFBGA (19x19 mm) | 484-ball UFBGA (19x19 mm) - same | 484-ball UFBGA (19x19 mm) - same | 484-ball UFBGA (19x19 mm) - same | 484-ball UFBGA (19x19 mm) - same | 484-ball UFBGA (19x19 mm) - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 40,000 | 40,000 | 40,000 | 40,000 | 40,000 | 25,000 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Automotive (-40C to +125C) | Commercial (0C to +85C) | Industrial (-40C to +100C) |
| Speed Grade | 7 | 7 | 7 | 7 | 7 | 7 |
| HPS Clock Max | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| Process Technology | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm | 28 nm |
| Core Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
| RoHS / Lead-Free | Yes / Yes | Yes / Yes | Yes / Yes (matte tin) | Yes / Yes | Yes / Yes | Yes / Yes |
Key Differentiators
- Industrial temperature grade with same die as commercial variant (vs 5CSEBA4U19C7N)
- Highest-density 19x19 mm UFBGA option at industrial grade (vs 5CSEBA2U19I7SN)
- Integrated ARM Cortex-A9 eliminates external processor (vs 5CGXBC5C7U19C8N)
Design Notes
Estimated: At full FPGA fabric utilization (typical 60-80% logic switching) plus the Cortex-A9 HPS at 800 MHz, total power dissipation is approximately 4-6 W. With UFBGA-484 thermal resistance theta_JA of approximately 15-20 C/W (4-layer JEDEC test board with minimal copper), junction temperature rise above ambient is 60-120 C - adequate for industrial-grade operation but requires thermal vias under the BGA and a 4-layer PCB with continuous ground/power planes. Always run Intel's PowerPlay early-power estimator before final layout to validate thermal headroom.
The 484-ball UFBGA package at 0.8 mm ball pitch requires ENIG surface finish and via-in-pad or microvia technology for reliable assembly. Reference the Cyclone V device datasheet for the recommended land pattern and the Intel package file for ball-map coordinates. DDR3 traces must be length-matched within 25 mils and routed on inner layers with reference planes; reference Intel's DDR3 topology guidelines for the SoC EDS validated byte-lane routing. Decoupling: place 0.1 uF X7R capacitors within 100 mils of every power pin pair, plus bulk 22 uF tantalum or polymer on each supply rail.
Do not apply power to the HPS rails before the FPGA fabric rails are stable - this causes HPS reset lockup requiring full power-cycle recovery. Reference Intel's AN 692 reference design for validated power-sequencing using a supervisory TPS3808 or equivalent. The SoC EDS boot-from-QSPI workflow requires the FPGA bitstream to be present at HPS reset release; mis-ordered boot modes are the most common first-prototype failure. Always implement the watchdog timer in both HPS software and FPGA fabric for failsafe recovery.
Differential pairs (DDR3, transceivers on GX variants, LVDS) require 100 ohm differential impedance with intra-pair skew under 5 mils and pair-to-pair skew under 50 mils. The SoC HPS routes its DDR3 controller on dedicated I/O banks (typically 3V/4V); isolate these from FPGA fabric LVDS on adjacent banks to avoid coupling noise. Use guard traces or ground-fill between HPS and FPGA high-speed regions. The 19x19 mm BGA break-out requires buried vias or microvias under the package to fan out the inner ball rows - work with your PCB fab to confirm their via-in-pad capability before layout freeze.
Compliance Information
RoHS compliant and lead-free per Intel Cyclone V device datasheet ordering information. Halogen-free per Intel declaration. Not AEC-Q100 qualified - select 5CSEBA4U19A7N for automotive applications requiring AEC-Q100.
