5CSXFC5D6F31C6N - 85K LE Cyclone V SX SoC FPGA 896-FBGA | Intel
MPN: 5CSXFC5D6F31C6N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $276.22 | $276.22 |
| 10 | $262.41 | $2,624.10 |
| 100 | $235.5 | $23,550.00 |
| 500 | $207.5 | $103,750.00 |
| 1,000 | $184.85 | $184,850.00 |
Drop-in alternatives for 5CSXFC5D6F31C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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5CSXFC6D6F31C6N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →5CSXFC5D6F31C7N
✅ Drop-In✓ In Stock
$285 / Unit
View Datasheet →5CSXFC5D6F31I7N
✅ Drop-In✓ In Stock
$138.2 / Unit
View Datasheet →5CSTFD6D5F31I7N
✅ Drop-In✓ In Stock
$290 / Unit
View Datasheet →5CSXFC5D6F31C6N Maximum Ratings & Electrical Characteristics
| Family | Cyclone V SX (SoC FPGA) |
| Logic Elements | 85,000 |
| Hard Processor System | Dual ARM Cortex-A9 MPCore with CoreSight |
| Maximum HPS Frequency | 925 MHz |
| Process Technology | TSMC 28 nm low-power |
| Package | 896-ball FBGA (31x31 mm) |
| User I/O Count | 288 |
| Embedded Memory | Approx. 4,450 Kbits (per device family) |
| 18x18 Multipliers | 224 |
| Fractional PLLs | 6 |
| Hard Memory Controllers | 2 |
| Transceivers | Not integrated on SX (see ST family) |
| Speed Grade | C6 (commercial) |
| Operating Temperature | 0C to +85C (commercial, per speed-grade convention) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | Compliant |
5CSXFC5D6F31C6N 896-ball fbga (31x31 mm) Pin Configuration Guide
Complete pinout information for 5CSXFC5D6F31C6N (896-ball fbga (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for 5CSXFC5D6F31C6N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
5CSXFC5D6F31C6N is suitable for 7 applications: Industrial Motor and Motion Control, Factory Automation PLC and Edge Controller, Video Surveillance and Machine Vision, Automotive Driver Assistance (ADAS) Prototyping, Software-Defined Radio (SDR) Baseband, ASIC Prototyping and Emulation, Military and Aerospace Signal Processing.
Industrial Motor and Motion Control
The 5CSXFC5D6F31C6N is a strong fit for industrial multi-axis motion controllers because the FPGA fabric runs parallel current-loop and field-oriented-control algorithms in deterministic nanosecond-scale latency while the dual ARM Cortex-A9 MPCore HPS hosts the motion sequencer, trajectory planner, and industrial Ethernet stack (EtherCAT / PROFINET). With 85K logic elements and 224 18x18 multipliers, one SX SoC can replace a discrete DSP plus microcontroller pair. Designers place the device between the 24V industrial bus and the gate-driver stage, leveraging the 288 user I/Os for encoder, Hall-sensor, and PWM channels. Compared with a software-only solution on a microcontroller, this architecture shrinks the control loop period by roughly 5-10x and reduces PCB area.
Recommended
Factory Automation PLC and Edge Controller
For PLCs and edge controllers, the 5CSXFC5D6F31C6N consolidates deterministic logic for IEC 61131-3 ladder execution, high-speed counters, and PWM with a Linux-capable Cortex-A9 HPS running containerized analytics on the same die. The 6 fractional PLLs drive precise timing for industrial Ethernet PHYs while the 2 hard memory controllers attach directly to DDR3 with ECC. With the 896-FBGA (31x31) package delivering 288 user I/Os, the device can fan out to dozens of isolated digital I/O channels. The result is a single-chip PLC with deterministic 100 us scan times and onboard edge analytics - replacing separate MCU + ASIC architectures.
Recommended
Video Surveillance and Machine Vision
The 5CSXFC5D6F31C6N accelerates MIPI CSI-2 or parallel-camera image pipelines by running Bayer demosaic, HDR fusion, and motion detection in the FPGA fabric, while the dual ARM Cortex-A9 HPS runs ONNX-based object-detection inference. The 288 user I/Os expose multiple camera interfaces plus gigabit Ethernet for streaming, and the hard memory controllers feed DDR3 bandwidth to the video pipeline. Compared with a CPU-only solution, this SoC FPGA typically delivers 4-8x more frames per second per watt. Engineers place the device adjacent to the camera sensor array, using the 31x31 mm FBGA footprint to fit compact PoE-powered camera enclosures.
Recommended
Automotive Driver Assistance (ADAS) Prototyping
The 5CSXFC5D6F31C6N serves as an ADAS prototyping platform where the FPGA fabric implements sensor-fusion pre-processing (radar FFT, lidar point-cloud clustering) while the Cortex-A9 HPS runs the perception stack. The 85K logic elements and 224 multipliers are sufficient to process 2-3 radar or lidar channels in parallel. Although the SX family is commercial-grade, the same die is available as 5CSXFC5D6F31I7N for industrial-grade in-cabin systems. Designers benefit from a software-defined path to automotive-qualified Cyclone V variants (5CGTFD9A5U19A7N automotive line). Compared with discrete DSP + MCU pairs, the SoC FPGA integration cuts sensor latency by 30-50%.
Recommended
Software-Defined Radio (SDR) Baseband
In SDR baseband applications, the 5CSXFC5D6F31C6N handles real-time digital down-conversion, channelization, and demodulation in the FPGA fabric, while the HPS runs the protocol stack and network interface. The 224 18x18 multipliers and ~4,450 Kbits of embedded RAM support multiple narrowband channels simultaneously. For applications that need 6.144 Gbps transceivers, designers migrate to the pin-compatible 5CSTFD6D5F31I7N in the same F31 package. Compared with a pure-software SDR on a high-end CPU, the SoC FPGA delivers roughly 10-20x improvement in channels-per-watt at the cost of higher engineering complexity.
Recommended
ASIC Prototyping and Emulation
Designers use the 5CSXFC5D6F31C6N as a building block in ASIC prototyping farms because the 85K logic elements and hard memory controllers deliver deterministic timing for verifying register-transfer-level designs. Multiple SX SoCs can be cascaded via high-speed LVDS or transceivers (on ST variants) for multi-million-gate emulations. The Cortex-A9 HPS handles test-vector injection and result logging. Compared with expensive emulation platforms, this approach scales linearly and uses Quartus Prime's incremental compile flow. Engineers typically combine 3-4 SX F31 packages on a single daughter card to emulate 300K-500K gate ASICs.
Recommended
Military and Aerospace Signal Processing
For ruggedized signal processing in military and aerospace applications, the 5CSXFC5D6F31C6N delivers deterministic latency for sensor signal conditioning, encryption acceleration, and protocol bridging, while the Cortex-A9 HPS runs a secure Linux or VxWorks stack. The FPGA fabric can host customer crypto IPs and the HPS handles key management. Designers pair the device with ruggedized DDR3L and conformal-coated PCB assemblies. Industrial-temperature variants (5CSXFC5D6F31I7N) and Intel's broader military-grade program provide screening options. Compared with discrete DSP + processor solutions, the SoC FPGA reduces SWaP-C (size, weight, power, cost) by 40-60% in many line-replaceable units.
Recommended
Recommended Products Summary
Engineering reference data for 5CSXFC5D6F31C6N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | 5CSXFC6D6F31C6N | 5CSXFC5D6F31C7N | 5CSXFC5D6F31I7N | 5CSTFD6D5F31I7N |
|---|---|---|---|---|---|
| Package | 896-FBGA (31x31) | 896-FBGA (31x31) | 896-FBGA (31x31) | 896-FBGA (31x31) | 896-FBGA (31x31) |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Family | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V SX | Cyclone V ST (with transceivers) |
| Logic Elements | 85,000 | 110,000 | 85,000 | 85,000 | 110,000 |
| HPS | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz | Dual ARM Cortex-A9 up to 925 MHz |
| Transceivers | None (SX family) | None (SX family) | None (SX family) | None (SX family) | 6.144 Gbps transceivers |
| Speed Grade | C6 (commercial) | C6 (commercial) | C7 (commercial, faster) | I7 (industrial -40C to +100C) | I7 (industrial) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | -40C to +100C (industrial) | -40C to +100C (industrial) |
| User I/O Count | 288 | 288 | 288 | 288 | 288 |
Key Differentiators
- Higher logic capacity in identical F31 896-FBGA package (vs 5CSXFC5D6F31C7N)
- Industrial temperature range with identical silicon (vs 5CSXFC5D6F31C7N)
- Integrated transceivers in pin-compatible F31 package (vs 5CSXFC5D6F31I7N)
- Single-chip CPU + FPGA integration reduces BOM and latency (vs Discrete MCU + Cyclone FPGA)
Design Notes
Power the 5CSXFC5D6F31C6N from a multi-rail supply delivering VCCINT (typically 1.1 V core), VCCA (analog 2.5 V), VCCD_PLL (PLL digital 1.1 V), and the HPS-specific VCC_HPS rails per Intel's Cyclone V Power Management user guide. Apply power-sequencing constraints: VCCA must not exceed VCCINT by more than 0.3 V during ramp, and the HPS core rail should be among the last to come up to prevent POR glitches. Bulk-decouple each supply domain with at least 22 uF of polymer tantalum plus 0.1 uF and 1 nF ceramic capacitors placed within 5 mm of every supply ball group. Without proper sequencing the HPS Cortex-A9 boot ROM may enter an unrecoverable state on cold start.
Estimated: at typical utilization (~70% LE, 50% DSP, 925 MHz HPS, DDR3 active) the 5CSXFC5D6F31C6N dissipates roughly 4-6 W. The 31x31 mm FBGA requires a thermal via array under the central ground balls per the Cyclone V package guidelines to keep theta_J-A near 12 C/W on a 6-layer 1-oz PCB. Without adequate vias the junction temperature can exceed 100C in enclosed enclosures, especially at the C6 commercial-grade 85C limit. Always validate with Quartus PowerPlay early in the design cycle and iterate on the thermal via pattern before committing PCB to fabrication.
Place all decoupling capacitors on the same PCB side as the FBGA, using short 12-20 mil-wide traces to minimize inductance. Route DDR3 signals to the HPS hard memory controller with length-matched 50-ohm impedance and 100-ohm differential pairs for the DDR3 differential clocks; cross-validation with Quartus Prime External Memory Interface Toolkit is mandatory before tape-out. Provide at least 6 PCB layers with dedicated ground and power planes adjacent to the FPGA side. Common pitfalls include routing the HPS JTAG and FPGA JTAG chains together without buffering (which prevents independent debug), and forgetting to add pull-ups on the HPS I2C lines.
Three recurring board bring-up pitfalls for the 5CSXFC5D6F31C6N: (1) failing to configure the MSEL pins correctly for the chosen configuration mode (AS, PS, FPP, JTAG) - leaving them floating can prevent configuration entirely; (2) not connecting the HPS_COLD_nRESET signal to the FPGA reset network, which causes the HPS to lock up when the FPGA fabric reconfigures; (3) underestimating the HPS clock jitter requirement - a noisy 25 MHz reference translates directly into Cortex-A9 jitter and Ethernet PHY errors. Always follow Intel's Cyclone V Pin Connection Guidelines document and validate clock trees with the Quartus TimeQuest timing analyzer before board bring-up.
Compliance Information
RoHS and lead-free per Intel Cyclone V product family documentation. Commercial temperature grade (C6) - not AEC-Q100 qualified; for AEC-Q100 select the 5CGTFD9A5U19A7N automotive line. Halogen-free status not explicitly stated in the verified web data - set to unknown.
