A3PE3000-FG324 - ProASIC3E FPGA 3M Gates 324-BGA | Microchip
MPN: A3PE3000-FG324 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $155 | $155.00 |
| 10 | $143.6 | $1,436.00 |
| 100 | $132.2 | $13,220.00 |
| 500 | $121.5 | $60,750.00 |
| 1,000 | $112.3 | $112,300.00 |
Drop-in alternatives for A3PE3000-FG324 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000-FGG324
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000-FG324I
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$1 / Unit
View Datasheet βA3PE3000-1FG324I
β Drop-Inπ Reference alternative (not in catalog)
M1A3PE3000-1FGG324
β Drop-Inπ Reference alternative (not in catalog)
M1A3PE3000-2FGG324I
β Drop-Inπ Reference alternative (not in catalog)
A3PE3000L-FG324
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View Datasheet βA3PE3000-FG324 Maximum Ratings & Electrical Characteristics
| Family | ProASIC3E Flash Family |
| System Gates | 3,000,000 |
| Logic Elements / CLBs | 75,264 |
| Maximum System Frequency | 231 MHz |
| Process Technology | 130 nm CMOS |
| Core Supply Voltage | 1.5 V |
| User I/Os | 221 |
| Configuration Technology | Flash (non-volatile, single-chip) |
| In-System Programming | Yes (JTAG, IEEE 1532-compliant) |
| Security | 128-bit AES decryption via JTAG; FlashLock |
| Package | 324-ball FBGA (FG324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| RoHS Status | RoHS Non-Compliant (contains lead, per digichip listing) |
| Lead Free Status | Contains Lead (per digichip listing) |
A3PE3000-FG324 324-ball fbga (fg324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch Pin Configuration Guide
Complete pinout information for A3PE3000-FG324 (324-ball fbga (fg324), 19 x 19 mm, 1.63 mm height, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000-FG324.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000-FG324 is suitable for 6 applications: ASIC Replacement and Prototyping, Networking and Communications Equipment, Avionics and Defense Subsystems, Industrial Control and Automation, Test and Measurement Instrumentation, Consumer and Display Electronics.
ASIC Replacement and Prototyping
The ProASIC3E family is explicitly positioned by Microchip as a cost-effective ASIC replacement solution. With 3 million system gates and 75,264 CLBs, the A3PE3000-FG324 can host multi-million-gate ASIC netlists for prototyping or low-volume production, avoiding mask charges and NRE costs. The flash fabric boots as a single chip without a configuration PROM, simplifying the BOM versus SRAM FPGAs. Designers iterate RTL in Libero and reprogram in-system via JTAG, cutting respin cycles from months to days. For ASIC-like I/O flexibility, the 221 user I/Os support common single-ended and differential standards, letting the prototype match the target ASIC's interface plan with minimal glue logic.
Recommended
Networking and Communications Equipment
Microchip targets ProASIC3E at networking/communications markets, where the A3PE3000-FG324 serves as glue logic, interface bridging, and line-card control fabric. The 231 MHz system performance supports timing closure for typical PHY-to-MAC bridging at rates up to Gigabit-class serial via external transceivers, while 75,264 CLBs implement packet framing, buffering control, and board management state machines. Non-volatile flash configuration means line cards power up functional without a host CPU loading a bitstream - a meaningful reliability benefit in telecom racks. The 324-ball FBGA at 1.0 mm pitch fits standard telecom PCB stackups, and the RoHS-compliant FGG324 variant keeps designs compliant with EU requirements.
Recommended
Avionics and Defense Subsystems
Flash-based FPGAs are preferred in avionics because their configuration cells are inherently immune to configuration upset from radiation and vibration, unlike SRAM fabrics that require scrubbing. The A3PE3000-FG324 provides 3M gates of non-volatile programmable logic for sensor interface, ARINC-style bus bridging, and built-in-test controllers. The IEEE 1532-compliant JTAG path with 128-bit AES decryption and FlashLock protects proprietary bitstreams in the field, a defense-program requirement. Industrial-grade variants (A3PE3000-FG324I, A3PE3000-1FG324I) are pin-compatible in the same FBGA-324 footprint, allowing a single PCB layout to span commercial and extended-temperature builds during qualification.
Recommended
Industrial Control and Automation
In factory automation, the A3PE3000-FG324 implements deterministic control sequencers, multi-axis PWM generation, and machine-vision pre-processing where a hard CPU is unnecessary but custom logic is essential. The 1.5V flash core keeps static power modest, and the non-volatile fabric lets machinery restart instantly after power loss without reconfiguration latency - critical for production-line uptime. With 221 user I/Os in a 19 x 19 mm FBGA, one device can aggregate encoders, sensors, and fieldbus transceivers on a single compact control card. Designs needing an embedded processor can drop in the pin-compatible M1A3PE3000 variant and instantiate an ARM Cortex-M1 without PCB change.
Recommended
Test and Measurement Instrumentation
Bench and automated test equipment uses the A3PE3000-FG324 as reconfigurable timing generators, pattern generators, and acquisition logic. The 231 MHz fabric performance and 75,264 CLBs cover trigger engines, counters, and protocol analysis state machines, while field reprogrammability lets one hardware platform serve multiple instrument personalities via JTAG firmware updates - reducing SKU count. Flash configuration means instruments are ready at power-on without a boot controller. The 128-bit AES decryption protects proprietary instrument firmware when units are serviced in the field. Low gate utilization headroom concerns are minimal at 3M gates, leaving room for feature expansion across product revisions.
Recommended
Consumer and Display Electronics
Microchip lists consumer markets among ProASIC3E targets: the A3PE3000-FG324 acts as display timing controllers, interface converters, and system glue in consumer products where ASIC volume never materialized. Its single-chip flash boot removes the configuration flash cost and board area that SRAM FPGAs require - significant at consumer BOM levels - and the 130nm process delivers low unit cost versus newer FPGA families. Note the standard FG324 contains lead; consumer products shipping to RoHS jurisdictions must specify the FGG324 lead-free variant, which is drop-in identical. The 19 x 19 mm FBGA suits the dense two- and four-layer boards typical of consumer display hardware.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000-FG324 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000-FGG324 | A3PE3000-FG324I | A3PE3000-1FG324I | M1A3PE3000-2FGG324I |
|---|---|---|---|---|---|
| Brand | Microchip Technology (Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 324-ball FBGA (FG324) | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same | 324-ball FBGA - same |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/Os | 221 | 221 | 221 | 221 | 221 |
| Speed Grade | Standard | Standard | Standard | -1 (faster) | -2 |
| Temperature Grade | Commercial | [DATA_NEEDED] | Industrial | Industrial | Industrial |
| RoHS Compliance | Non-compliant (contains lead) | Compliant (lead-free) | [DATA_NEEDED] | [DATA_NEEDED] | Compliant (G suffix, lead-free) |
| Embedded CPU Support | Soft cores (no Cortex-M1) | Soft cores | Soft cores | Soft cores | ARM Cortex-M1 supported |
| Core Voltage / Performance | 1.5 V / 231 MHz | 1.5 V / 231 MHz | 1.5 V / 231 MHz | 1.5 V / 231 MHz family | 1.5 V / 231 MHz family |
Key Differentiators
- Non-volatile single-chip flash configuration (vs A3PE3000-FGG324)
- ARM Cortex-M1 upgrade path on same footprint (vs M1A3PE3000-2FGG324I)
- Industrial temperature availability (vs A3PE3000-FG324I / A3PE3000-1FG324I)
- Speed-grade timing headroom (vs A3PE3000-1FG324I)
Design Notes
The A3PE3000-FG324 runs a 1.5V core; ProASIC3E devices also require auxiliary and I/O supply rails per the datasheet power section. Estimate static and dynamic power with Microchip's power calculator in Libero before finalizing regulators - 130nm flash fabric has low static power, but dynamic power scales with clock frequency toward the 231 MHz maximum and I/O toggle rates. Provide decoupling per the datasheet power distribution network guidance, with bulk capacitance near each supply ball group of the FBGA-324 and local 0.1uF ceramics distributed across the 19 x 19 mm package.
The FG324 FBGA uses a 1.0 mm ball pitch on a 19 x 19 mm body - plan fanout with via-in-pad or dogbone escape on outer layers, and verify your PCB fabricator supports the 0.5 mm via finished diameter typical for 1.0 mm pitch BGA escape. Because all same-family variants (FG, FGG, I, M1) share the ball map, allocate any I/O you might later reassign so a future speed-grade or lead-free migration needs no layout change. Follow ball-map tables in the ProASIC3E datasheet (50003270B) exactly; do not copy FG484 assignments.
The most common sourcing pitfall is RoHS: the standard FG324 is listed as containing lead (RoHS non-compliant), so EU-market production should order A3PE3000-FGG324 instead - same die, same footprint. Second, do not confuse speed grades: a bitstream meeting timing on a -1 part may fail on the standard grade; constrain timing in Libero against the ordered speed grade. Third, JTAG programming requires the IEEE 1532-compliant chain configuration; keep the TMS pull-up and proper TRST handling per the datasheet JTAG chapter to avoid ISP failures in production programming.
With 221 user I/Os on a 1.0 mm pitch BGA, manage simultaneous switching noise by distributing ground return balls among high-toggle banks and following the datasheet I/O bank current limits. Series-terminate single-ended outputs (22-33 ohm) when driving long traces, and use differential standards for clocks. The flash fabric's lack of configuration readback during operation helps EMI-sensitive designs since no configuration bus activity occurs after boot.
Compliance Information
Per digichip datasheet listing, A3PE3000-FG324 contains lead and is RoHS non-compliant; the A3PE3000-FGG324 is the lead-free variant. FindIC lists a GREEN package description for family parts, but verify the compliance letter for your date code. Not an automotive AEC-Q100 part.
