A3PE3000L-1FG484M - 3M-Gate Low-Power Flash FPGA | Microchip
MPN: A3PE3000L-1FG484M ✓ Active| Qty | Unit Price | Extended |
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| 500 | $0 | $0.00 |
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Drop-in alternatives for A3PE3000L-1FG484M — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A3PE3000L-FG484M
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$129 / Unit
View Datasheet →A3PE3000L-1FG484I
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View Datasheet →A3PE3000L-1FGG484M
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$117.6 / Unit
View Datasheet →A3PE3000L-FG484I
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View Datasheet →A3PE3000L-1FG484
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View Datasheet →A3PE3000L-FG484
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View Datasheet →A3PE3000L-1FG484M Maximum Ratings & Electrical Characteristics
| Family | ProASIC3L (Low Power Flash FPGA) |
| System Gates | 3000000 |
| Number of I/O | 341 |
| Maximum Frequency | 250 MHz |
| Core Voltage | 1.2 V to 1.5 V |
| Technology | 130 nm flash process |
| Configuration Memory | On-chip Flash (instant-on, reprogrammable) |
| Low Power Feature | Flash*Freeze technology |
| Package | 484-ball FBGA (FG484) |
| Mounting Type | Surface Mount |
| Speed Grade | -1 (standard) |
| JTAG Boundary Scan | IEEE 1149.1 supported |
| Input Options | Schmitt trigger option on single-ended inputs (A3PE3000L) |
| Pull Options | Weak pull-up / pull-down |
A3PE3000L-1FG484M 484-ball fbga (fg484) Pin Configuration Guide
Complete pinout information for A3PE3000L-1FG484M (484-ball fbga (fg484) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A3PE3000L-1FG484M.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A3PE3000L-1FG484M is suitable for 6 applications: Battery-Powered Portable Instrumentation, Aerospace and Defense Subsystems, Industrial Automation and Motor Control, Communications Line Cards, Test and Measurement Equipment, Secure Single-Chip Embedded Control.
Battery-Powered Portable Instrumentation
The A3PE3000L-1FG484M fits portable and battery-powered instruments because its flash fabric draws very low static current and Flash*Freeze technology drops the device into an ultra-low-power retention state between measurements. The instant-on flash configuration means the instrument is operational within microseconds of power-up with no boot PROM, saving board space and energy. Designers typically run the core at 1.2 V for minimum dynamic power and place the 341 user I/Os into banks at the lowest VCCI the sensor and display interfaces allow. Unlike SRAM FPGAs, no configuration energy is spent on every wake-up, quantifiably extending battery life in duty-cycled acquisition systems.
Recommended
Aerospace and Defense Subsystems
The M suffix of A3PE3000L-1FG484M places it in Actel/Microchip's military ProASIC3/EL low-power flash FPGA line, historically used in avionics, telemetry, and secure communications hardware. Flash-based configuration eliminates the external bitstream storage that can be an attack or single-point-failure surface in SRAM FPGAs, and the device is live within microseconds of power application - important for power-cycled flight payloads. The 3M-gate fabric and 341 I/Os handle glue logic, bus interfaces, and sensor aggregation, while IEEE 1149.1 JTAG boundary scan supports board-level production test. Verify the exact screening flow with Microchip before program commitment.
Recommended
Industrial Automation and Motor Control
In factory automation, the A3PE3000L-1FG484M implements deterministic I/O expansion, encoder interfacing, and safety-related glue logic with Schmitt-trigger inputs that tolerate noisy single-ended signals. The 250 MHz speed grade easily covers PWM generation and quadrature decoding, while the 341 user I/Os connect limit switches, drives, and fieldbus transceivers across multiple voltage banks. Flash*Freeze permits near-zero idle power in intermittently operated machinery, and weak pull-up/pull-down options reduce external resistor count on unused or switch inputs. Instant-on operation means the controller is ready before the industrial 24 V bus has fully sequenced, simplifying power-rail bring-up design.
Recommended
Communications Line Cards
Telecom and datacom line cards use the A3PE3000L-1FG484M as a low-static-power fabric for framing, multiplexing, and backplane interface logic between processors and PHY devices. ProASIC3L static power is substantially lower than equivalent SRAM FPGAs, which matters when dozens of cards share a chassis power budget, and Flash*Freeze can near-idle unused cards. The 130 nm fabric at a 250 MHz grade handles 100-200 MHz pipe-lined framing logic comfortably, and the 484-ball FBGA provides 341 I/Os for TDM and parallel backplane buses. Instant-on flash configuration lets cards participate in ring initialization immediately after hot-swap insertion.
Recommended
Test and Measurement Equipment
Bench and modular instruments leverage the A3PE3000L-1FG484M for timing generation, trigger logic, and acquisition front-end sequencing. The -1 speed grade supports 250 MHz-class counters and state machines, Schmitt-trigger inputs clean up slow analog-derived edges, and the flash fabric configures instantly so the instrument is ready the moment the power switch closes - no configuration loading delay visible to the operator. With 341 I/Os in a 484-ball FBGA, one device can bind analog multiplexers, relays, display, and host interfaces. IEEE 1149.1 boundary scan simplifies production test of densely packed measurement boards.
Recommended
Secure Single-Chip Embedded Control
Applications requiring no external configuration image - secure keys, licensed function blocks, or anti-tamper logic - map well to the A3PE3000L-1FG484M because the bitstream lives in on-chip flash and is never exposed on a bus at power-up, unlike SRAM FPGAs that stream configuration from an external PROM. The 3M-gate capacity hosts substantial control and cryptography-lite logic, while Flash*Freeze supports low-average-power secure sleep. Designers combine weak pull-up/pull-down settings and Schmitt inputs for robust board-level signal hygiene. Single-chip operation also improves reliability metrics by removing the configuration device from the failure-rate budget.
Recommended
Recommended Products Summary
Engineering reference data for A3PE3000L-1FG484M — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A3PE3000L-FG484M | A3PE3000L-1FG484I | A3PE3000L-1FGG484M |
|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA (FG484) - same | 484-ball FBGA (FG484) - same | 484-ball FBGA fine-pitch (FGG484) |
| Brand | Microchip Technology (Actel/Microsemi lineage) | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 3,000,000 | 3,000,000 | 3,000,000 | 3,000,000 |
| User I/O | 341 | 341 | 341 | 341 |
| Speed Grade | -1 | standard (non -1 designation) | -1 | -1 |
| Core Voltage | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V | 1.2 V to 1.5 V |
| Low Power Feature | Flash*Freeze technology | Flash*Freeze technology | Flash*Freeze technology | Flash*Freeze technology |
| Temperature/Grade Suffix | M (military line ordering) | M (military line ordering) | I (industrial) | M (military line ordering) |
| Configuration | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on | On-chip flash, instant-on |
Key Differentiators
- Flash configuration removes external boot device (vs SRAM-based mid-range FPGAs (e.g., Artix-7 class))
- Flash*Freeze ultra-low standby (vs A3PE3000 (non-L ProASIC3E))
- Trade-off: no hard processor or transceivers (vs M1A3PE3000L-1FGG484M)
Design Notes
Run the VCC core rail at 1.2 V for minimum dynamic and static power; the 1.5 V option is available per the ProASIC3L datasheet but increases consumption. Use the Flash*Freeze pin to gate the fabric during idle intervals while retaining state. Budget the 341 user I/Os across banks early: each bank takes its own VCCI, and assigning 3.3 V standards unnecessarily raises I/O power. Estimated: I/O power scales roughly linearly with VCCI, so migrating a bank from 3.3 V to 1.8 V can cut that bank's switching power by nearly half for the same toggle rate.
The FG484 package uses a 1.0 mm ball pitch; the FGG484 variant uses 0.8 mm - they are NOT footprint interchangeable, so lock the correct land pattern before layout. Follow the Microchip ProASIC3L datasheet power-supply decoupling guidance with bulk plus local ceramic capacitors at each VCC/VCCI bank. Ball-out reference planes under the BGA should be continuous; voids under the 484-ball array degrade signal integrity and rework-ability. Route JTAG (IEEE 1149.1) as a short, daisy-chainable segment to retain boundary-scan access in production test fixtures.
Do not confuse ordering codes: FG (1.0 mm pitch) vs FGG (0.8 mm pitch) and -1 speed grade vs non -1 designations are commonly mixed up during BOM substitution, causing non-fitting parts or timing failures. Also, pin-compatible packages across the ProASIC3L family exclude PQ208, so migration plans must be validated package by package. Finally, because this is a flash FPGA, no external configuration PROM is needed - adding one is wasted BOM cost, but designers migrating from SRAM FPGAs routinely forget to remove it.
Compliance Information
Compliance status not stated in the provided web data; Microchip's product page and distributor listings should be consulted for RoHS/REACH declarations for this exact ordering code.
