M7AFS600-FG484 - Fusion FPGA 600K Gates, ARM CoreMP7 | Microchip
MPN: M7AFS600-FG484 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $273.98 | $273.98 |
| 10 | $268.5 | $2,685.00 |
| 100 | $259 | $25,900.00 |
| 500 | $248 | $124,000.00 |
| 1,000 | $236 | $236,000.00 |
Drop-in alternatives for M7AFS600-FG484 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M7AFS600-FGG484
✅ Drop-In✓ In Stock
$232.9 / Unit
View Datasheet →M7AFS600-FG484I
✅ Drop-In✓ In Stock
$273.98 / Unit
View Datasheet →M7AFS600-FGG484I
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$219.2 / Unit
View Datasheet →M7AFS600-1FG484I
✅ Drop-In✓ In Stock
$198 / Unit
View Datasheet →M7AFS600-2FG484
✅ Drop-In✓ In Stock
$276.95 / Unit
View Datasheet →M1AFS600-FG484
✅ Drop-In✓ In Stock
$185 / Unit
View Datasheet →M1AFS600-1FG484I
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$425 / Unit
View Datasheet →M7AFS600-2FGG484I
✅ Drop-In✓ In Stock
$243.75 / Unit
View Datasheet →M7AFS600-FG484 Maximum Ratings & Electrical Characteristics
| Manufacturer Part Number | M7AFS600-FG484 |
| Series | M7AFS600 (Fusion) |
| System Gates | 600K |
| Logic Elements (VersaTiles) | 110592 |
| Number of I/Os | 172 |
| Embedded Processor | ARM CoreMP7 |
| Operating Supply Voltage | 1.5 V |
| Technology | 130 nm Flash |
| Maximum Operating Frequency | 1098.9 MHz |
| Package / Case | 484-ball FBGA (FG484) |
| Package Dimensions | 23 x 23 x 2.44 mm |
| Minimum Operating Temperature | 0 C |
| Maximum Operating Temperature | +70 C |
| Mounting Style | SMD/SMT |
| Packaging | Tray |
| RoHS Compliant | Yes |
| Programmability Type | In-System Programmable (flash-based, non-volatile) |
M7AFS600-FG484 23 x 23 x 2.44 mm Pin Configuration Guide
Complete pinout information for M7AFS600-FG484 (23 x 23 x 2.44 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M7AFS600-FG484.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M7AFS600-FG484 is suitable for 6 applications: Embedded System Control, Industrial Automation and Monitoring, Power and Thermal Management, Portable and Battery-Powered Instrumentation, Board-Level System Telemetry, Mixed-Signal ASIC Prototyping.
Embedded System Control
The M7AFS600-FG484 fits embedded controller designs that need both programmable logic and a processor core in one non-volatile device. Its ARM CoreMP7 soft core handles firmware execution while 110592 VersaTiles implement custom peripherals, glue logic, and interfaces around the 172 user I/Os. Because the 130nm flash fabric is instant-on, the system boots with no external configuration device and no boot latency, a key advantage over SRAM-based FPGAs in control applications. Designers typically allocate the fabric to state machines and bus bridging while the processor runs protocol stacks, trading fabric capacity for integration density. The 1.5V core keeps power manageable in always-on controllers.
Recommended
Industrial Automation and Monitoring
In industrial automation, the M7AFS600-FG484 provides sensor interfacing, deterministic control sequencing, and system health supervision on a single chip. The Fusion family's mixed-signal capability allows monitoring of board-level voltages and temperatures through its analog peripherals, while the flash fabric implements motor control timing, I/O expansion, and communication bridging across the 172 I/Os. The commercial 0C to +70C rating suits enclosed cabinet environments; for floor-level installations with wider ambient swings, the pin-compatible M7AFS600-FG484I industrial variant is recommended. Instant-on flash configuration ensures the controller is live within microseconds of power application, which matters for safety interlock logic that must be valid at power-up.
Recommended
Power and Thermal Management
Fusion FPGAs were architected specifically for power and thermal management, and the M7AFS600-FG484 excels in fan control, supply sequencing, and board telemetry roles. The on-chip Analog Compute Engine (ACE) plus RTC offloads routine monitoring tasks from the logic fabric, while the ARM CoreMP7 runs management policies such as PID fan curves and alert handling. The 484-ball FBGA provides enough I/O to drive multiple PWM fans, read tachometer signals, and communicate over I2C/SMBus to host systems. Because configuration is non-volatile, management logic is active immediately at power-on - critical for supervising the main FPGA or CPU rails during brownout and startup sequences.
Recommended
Portable and Battery-Powered Instrumentation
The M7AFS600-FG484 suits portable instrumentation where a single mixed-signal FPGA replaces an MCU plus discrete analog front end. The 1.5V core supply and flash fabric's low static power profile help extend battery life, while the instant-on property lets the instrument take measurements immediately when activated - no configuration load time. The 172 user I/Os connect display, keypad, sensor, and communication interfaces without additional glue logic. Handheld meters, environmental loggers, and portable test gear benefit from integrating the ARM CoreMP7 for UI firmware with VersaTile fabric for measurement timing and trigger logic. Designers should budget the commercial temperature rating against the instrument's specified operating envelope.
Recommended
Board-Level System Telemetry
The M7AFS600-FG484 is well suited to telemetry and health-monitoring subsystems in servers, network equipment, and test systems. Its analog monitoring inputs track multiple supply rails, and the RTC supports timestamped event logging even when main logic is idle. The fabric aggregates I2C/PMBus sensor data, applies alarm thresholds, and reports to a host via UART, SPI, or I2C using the 172 I/Os. Flash-based non-volatile operation means telemetry coverage begins the instant power is applied, capturing faults during power sequencing that SRAM FPGAs miss while loading configuration. The 23x23mm FBGA footprint conserves board area in dense server or blade environments.
Recommended
Mixed-Signal ASIC Prototyping
According to the Fusion family datasheet, Fusion devices provide an excellent alternative to costly and time-consuming mixed-signal ASIC designs, making the M7AFS600-FG484 a strong prototyping and low-volume production platform. Designers implement custom digital logic in 110592 VersaTiles, verify analog monitoring behavior with the ACE block, and iterate in hours instead of the weeks an ASIC mask spin requires. The 484-ball FBGA offers sufficient I/O to emulate realistic ASIC pin counts. When volume scales, the validated design can migrate to an ASIC with confidence, or remain on the FPGA for flexibility. Using the ARM Cortex-M1/CoreMP7 within the fabric also de-risks embedded software before silicon commit.
Recommended
Recommended Products Summary
Engineering reference data for M7AFS600-FG484 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M7AFS600-FGG484 | M7AFS600-FG484I | M7AFS600-2FG484 | M1AFS600-FG484 |
|---|---|---|---|---|---|
| Package | 484-ball FBGA (FG484) | 484-ball FBGA (FGG484) - same footprint | 484-ball FBGA (FG484) - same footprint | 484-ball FBGA (FG484) - same footprint | 484-ball FBGA (FG484) - same footprint |
| Brand | Microchip Technology (Microsemi Fusion) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 600K | 600K | 600K | 600K | 600K |
| I/O Count | 172 | 172 | 172 | 172 | 172 |
| Operating Temperature | 0 C to +70 C | [DATA_NEEDED] | -40 C to +100 C | 0 C to +70 C | 0 C to +70 C |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded Processor | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 | ARM CoreMP7 |
| Packaging | Tray | Tray | [DATA_NEEDED] | Tray | [DATA_NEEDED] |
Key Differentiators
- Fastest standard speed grade of AFS600 in FG484 (vs M7AFS600-2FG484)
- Non-volatile flash fabric eliminates configuration device (vs SRAM-based FPGAs (Xilinx Artix-7 class))
- Mixed-signal integration on-chip (vs M1AFS600-FG484)
Design Notes
The M7AFS600-FG484 runs from a 1.5V core supply with additional I/O bank rails per the Fusion datasheet. Plan a clean 1.5V rail with local bulk and 0.1uF ceramic decoupling at each VCC ball group, and sequence rails per the datasheet power-up requirements. Flash-based fabric draws near-zero configuration current at power-up, so total inrush is dominated by decoupling capacitor charging rather than bitstream loading - useful for battery-powered designs.
The 484-ball FBGA (23x23x2.44 mm, ~1.0 mm ball pitch class) requires a fine-pitch BGA footprint with via-in-pad or dogbone fanout. Follow the Microsemi Fusion PCB layout guidelines for ball map escape routing; inner layers should carry the 1.5V core plane to minimize IR drop across the die. Ensure reflow profiles match lead-free SAC alloy requirements for the RoHS-compliant FG build.
The most common selection error is temperature grade confusion: the FG484 suffix without 'I' is commercial only (0C to +70C). Systems operating below 0C or above 70C must use the pin-compatible -FG484I variants. Also note the datasheet states all devices in the same package are pin compatible EXCEPT the PQ208 package used by AFS250/AFS600 - do not assume PQ208 designs migrate to FG484 without PCB rework.
Compliance Information
Newark listing states 'RoHS Compliant: Yes'. FGG-suffix variants denote lead-free/green packaging per Microsemi naming conventions. REACH, halogen-free, and conflict-minerals status not stated in provided data.
