A54SX16-1PQ208I - 24K-Gate Anti-fuse FPGA 208-PQFP | Microsemi
MPN: A54SX16-1PQ208I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $68.5 | $68.50 |
| 10 | $63.2 | $632.00 |
| 100 | $57.8 | $5,780.00 |
| 500 | $52.4 | $26,200.00 |
| 1,000 | $47.9 | $47,900.00 |
Drop-in alternatives for A54SX16-1PQ208I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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A54SX16-1PQ208
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A54SX16P-1PQ208I
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$44.2 / Unit
View Datasheet →A54SX16P-PQ208I
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View Datasheet →A54SX16P-1PQG208I
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View Datasheet →A54SX16P-1PQG208M
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$28.5 / Unit
View Datasheet →A54SX16P-PQG208M
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$66.4 / Unit
View Datasheet →A54SX16-1PQ208I Maximum Ratings & Electrical Characteristics
| Family | SX (Actel/Microsemi 54SX) |
| Programmable Logic Type | Anti-fuse FPGA |
| System Gates | 24000 gates |
| Logic Cells | 924 cells |
| Logic Array Blocks (LABs) | 1452 |
| User I/O | 175 |
| Maximum Internal Performance | 280 MHz (320 MHz family max) |
| Clock-to-Out (Pin-to-Pin) | 3.7 ns |
| Input Set-Up Time | 0.1 ns |
| Clock Skew | 0.25 ns |
| Supply Voltage (Core) | 3 V to 3.6 V |
| Supply Voltage (I/O) | 4.75 V to 5.25 V |
| Process Technology | 0.35 um CMOS |
| Speed Grade | -1 |
| Operating Temperature | -40C to +85C (Industrial) |
| Package | 208-BFQFP (28x28 mm, 0.5 mm pitch) |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| PCI Support | 66 MHz PCI compliant |
| Configuration | Nonvolatile anti-fuse, single chip |
A54SX16-1PQ208I 208-bfqfp (28x28 mm, 0.5 mm pitch) Pin Configuration Guide
Complete pinout information for A54SX16-1PQ208I (208-bfqfp (28x28 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for A54SX16-1PQ208I.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
A54SX16-1PQ208I is suitable for 6 applications: Industrial Control and Automation, 66 MHz PCI Interface Designs, Aerospace and Defense Logic Integration, Communications Line Cards, Legacy 5V System Migration, Secure Embedded Controllers.
Industrial Control and Automation
In factory automation and PLC backplanes, the A54SX16-1PQ208I integrates glue logic, address decoding, and state machines that were previously multiple 5V TTL devices, cutting board area and BOM count. Its 4.75V to 5.25V I/O rail interfaces directly with legacy industrial 5V sensors and actuators, while the 3V-3.6V core keeps dynamic power manageable. The industrial -40C to +85C rating covers unconditioned cabinet environments, and anti-fuse nonvolatility means control logic is operational within nanoseconds of power-up - critical for machines with fail-safe interlocks. Because the configuration cannot be read back, proprietary control algorithms in the fabric resist extraction on the factory floor.
Recommended
66 MHz PCI Interface Designs
The 54SX family is explicitly characterized for 66 MHz PCI compliance as a single-chip solution, and the A54SX16-1PQ208I's -1 speed grade supports this with 3.7 ns pin-to-pin clock-to-out, 0.1 ns input setup, and 0.25 ns clock skew - timing that fits the 66 MHz PCI (66.6 MHz, 15 ns cycle) budget when 5V-tolerant I/O drive the bus. The dual-rail scheme (3.3V core, 5V I/O) matches the classic PCI signaling environment, eliminating level-shifters between the fabric and the backplane. Anti-fuse pin locking allows board routing to be completed before design finalization, with 100% pin-locked routing guaranteed even at high utilization.
Recommended
Aerospace and Defense Logic Integration
Anti-fuse FPGAs are a traditional choice in aerospace and defense payloads because the configuration is inherently immune to configuration-memory upsets and cannot be interrogated from the device. The A54SX16-1PQ208I's 24,000 gates integrate telemetry formatting, discrete I/O processing, and bus-interface glue logic in one 208-pin package, and the industrial-grade I variant is commonly used in non-radiation-hardened but environmentally demanding subsystems. Where full military screening or radiation tolerance is required, the same SX architecture scales up through the SX-A family and the RTAX radiation-taxed line (e.g., RTAX250SL) available on XAIPART, allowing design methodology reuse across program phases.
Recommended
Communications Line Cards
Telecom and datacom line cards use the A54SX16-1PQ208I for framing logic, alarm aggregation, and backplane interfacing between PHY devices and system controllers. With 175 user I/O, the device connects multiple serial framers and crosspoint signals simultaneously, and the 280 MHz internal fabric comfortably handles parallel data-path retiming at line-card clock rates. Instant-on operation means line cards enumerate on the management bus immediately at shelf power-up, simplifying hot-swap sequencing relative to SRAM FPGAs that must load configuration first. The 208-BFQFP's 0.5 mm pitch supports standard SMT assembly on high-layer-count line-card PCBs.
Recommended
Legacy 5V System Migration
Many brownfield systems still carry 5V TTL buses; replacing aging bipolar and PLD components with the A54SX16-1PQ208I lets designers consolidate that logic while retaining 5V signaling compatibility, since its I/O rail operates from 4.75V to 5.25V. A single device can absorb dozens of 74-series functions, reducing power (0.35 um CMOS static draw), inventory line items, and failure points. Anti-fuse configuration also removes the configuration-flash obsolescence risk that plagues SRAM FPGA retrofits. For boards where the 5V rail is being retired, the pin-compatible SX16P variants allow a same-footprint migration to 3.3V I/O in a future spin.
Recommended
Secure Embedded Controllers
Security-conscious embedded systems - payment terminals, access-control panels, encrypted radio auxiliaries - benefit from the A54SX16-1PQ208I's read-back-proof anti-fuse fabric: unlike SRAM FPGAs whose bitstream can be intercepted at boot, there is no configuration image to steal, and no external configuration device to probe. The 24,000-gate capacity hosts custom bus encryption glue, key-muxing control, and tamper-response state machines, while instant-on behavior closes the boot-time attack window entirely. The industrial temperature range and tray packaging suit both indoor and outdoor cabinet deployments, and XAIPART stocks pin-compatible SX16P alternates for second-sourcing secure designs.
Recommended
Recommended Products Summary
Engineering reference data for A54SX16-1PQ208I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | A54SX16-1PQ208 | A54SX16P-1PQ208I | A54SX16P-1PQG208I | A54SX16P-PQG208M |
|---|---|---|---|---|---|
| Package | 208-BFQFP (28x28 mm) | 208-BFQFP - same | 208-PQFP - same footprint | 208-PQFP (green) - same footprint | 208-PQFP (green, M-screen) - same footprint |
| Brand | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) | Microsemi (Microchip) |
| System Gates | 24,000 gates | 24,000 gates | 24,000 gates (SX16P) | 24,000 gates (SX16P) | 24,000 gates (SX16P) |
| User I/O | 175 | 175 | 175 | 175 | 175 |
| Speed Grade | -1 | -1 | -1 | -1 | Standard |
| Temperature Range | -40C to +85C (Industrial) | 0C to +70C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | Extended/M-screening |
| Configuration Technology | Anti-fuse OTP, nonvolatile | Anti-fuse OTP | Anti-fuse OTP | Anti-fuse OTP | Anti-fuse OTP |
| Package Finish / Power | Standard PQFP finish, SX16 static power | Standard finish, SX16 static power | Standard finish, lower SX16P static power | RoHS green finish, lower SX16P static power | RoHS green finish, M-screened |
Key Differentiators
- Industrial temperature grade in the original SX16 fabric (vs A54SX16-1PQ208)
- Lower static power via SX16P process (vs A54SX16P-1PQ208I)
- RoHS green package availability (vs A54SX16P-1PQG208I)
Design Notes
The A54SX16-1PQ208I requires two rails: VCCA/VCI core supply at 3.3V (3V-3.6V) and 5V (4.75V-5.25V) for the I/O ring. Decouple each rail with at least 0.1 uF ceramic per supply pin plus bulk capacitance near the package; anti-fuse FPGAs draw static current in every powered anti-fuse junction, so estimate static power from the SX family current tables at your temperature rather than assuming zero. Sequence rails per the family datasheet power-up specification to avoid latch-up - typically 5V-tolerant I/O requires VCI present before input drivers are driven.
Anti-fuse devices are one-time programmable: a design change after programming cannot be re-flashed, and each debug iteration consumes a new device. Budget prototype devices explicitly, exhaustively simulate pre-program, and use the Designer software timing reports to close timing before burning. Reserve the 100% pin-locking workflow: fix your pinout in the constraint file before final board routing so the burned device matches the PCB. Also remember unused user I/O should be tied per the datasheet recommendations - floating 5V-tolerant inputs increase susceptibility and static current.
With 175 I/O in a 28x28 mm 0.5 mm-pitch PQFP, simultaneous switching output (SSO) noise is the main signal-integrity risk on wide 5V buses. Limit the number of outputs switching in the same bank per SSO guidance in the SX family datasheet, assign ground return pins adjacent to high-drive I/O groups, and keep trace stubs short on 66 MHz PCI nets. Series termination (22-33 ohm) on fast edge-rate outputs is a low-cost improvement; verify against the IBIS models available from Microchip for the SX family.
The 208-BFQFP 0.5 mm pitch requires controlled solder-paste stencil design (typically 0.1-0.12 mm laser-cut apertures) to avoid bridging on the fine-pitch leads. Provide an escape fan-out of at least one via per signal on inner layers, and surround the package with a ground ring stitching to the internal ground plane. Since this is a tray-packaged part, confirm moisture sensitivity level handling with your assembler and bake per JEDEC/J-STD-033 guidance if floor-life is exceeded.
Compliance Information
Compliance data not present in the verified web data for this MPN. Green (PQG208) package variants are Microsemi's lead-free/RoHS option family; confirm this standard BFQFP part's finish from the Microchip product page before lead-free assembly.
