CXDB4ABAM - 2GB LPDDR4X SDRAM 3733Mbps | CXMT
MPN： CXDB4ABAM ✓ 啟用中CXDB4ABAM 概覽
LPDDR4X is a type of synchronous dynamic random-access memory (SDRAM) that is part of the LPDDR (Low Power Double Data Rate) family, which is optimized for battery-powered devices. It is a successor to LPDDR4 and offers reduced I/O voltage (0.6V) compared to LPDDR4 (1.1V), resulting in lower power consumption while maintaining similar performance. LPDDR4X is widely used in smartphones, tablets, ultra-thin laptops, and embedded systems where power efficiency is critical.
Key features of the CXDB4ABAM include a 2GB density, 3733 Mbps data rate, and support for dual-channel operation. The device uses a 200-ball FBGA package with a 0.8mm ball pitch, enabling compact PCB designs. It is RoHS compliant and supports industrial temperature ranges, making it suitable for a variety of applications.
The CXDB4ABAM utilizes advanced DRAM process technology to achieve high speed and low power. It supports various power-saving modes, including idle, self-refresh, and deep power-down, which are essential for extending battery life in portable devices. The memory interface is compatible with standard LPDDR4X controllers, simplifying integration into SoC designs.
Typical applications include smartphones, tablets, embedded computing, AI edge devices, and automotive infotainment systems. The high bandwidth and low power make it ideal for applications requiring fast data processing and long battery life.
When designing with the CXDB4ABAM, ensure proper decoupling and signal integrity practices are followed. The 0.6V I/O voltage requires careful PCB layout to minimize noise and maintain signal integrity at high data rates.
直接替換替代品，適用於 CXDB4ABAM — 相同封裝，腳位對腳位相容。需重新設計 PCB 的不同封裝零件不列入。
CXDB4ABAM-MK
聯絡詢價
查看資料表 →CXDB5CCAM-MK
聯絡詢價
查看資料表 →MT53B256M32D1NP-062
聯絡詢價
查看資料表 →CXDB4ABAM-MJ
📋 參考替代品（不在目錄中）
K4U6E3S4AM-MGCL
📋 參考替代品（不在目錄中）
H9HCNNNBKMMLXR-NEM
📋 參考替代品（不在目錄中）
CXDB4ABAM 最大額定值與電氣特性
| 記憶體類型 | LPDDR4X SDRAM |
| Density | 2GB |
| 資料速率 | 3733 Mbps |
| 封裝 | FBGA-200 (15x10x0.8mm) |
| Ball Pitch | 0.8 mm |
| I/O Voltage | 0.6 V |
| RoHS | Compliant |
| 安裝類型 | Surface Mount |
| Lead-Free | Yes |
CXDB4ABAM fbga-200 (15x10x0.8mm) 腳位配置指南
CXDB4ABAM（fbga-200 (15x10x0.8mm) 封裝）的腳位配置。 此數位 IC 包含 GPIO、通訊介面（UART、SPI、I2C）與電源腳位。替代腳位功能與配置選項請參閱製造商資料表。對嵌入式系統設計與 PCB 佈局至關重要。
無詳細腳位定義資料： CXDB4ABAM.
請參閱 資料表 以查看完整腳位配置。
典型應用
CXDB4ABAM 適用於 6 應用s: Smartphones, Tablets, Embedded Computing, AI Edge Devices, Automotive Infotainment, Consumer Electronics.
Smartphones
The CXDB4ABAM provides 2GB LPDDR4X memory at 3733 Mbps, ideal for smartphones requiring high bandwidth for multitasking and AI processing. Its low 0.6V I/O voltage reduces power consumption, extending battery life. The 200-ball FBGA package enables compact PCB designs in slim phone form factors. With support for low-power modes, it helps meet stringent power budgets in mobile devices.
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Tablets
Tablets require a balance of performance and power efficiency. The CXDB4ABAM's 3733 Mbps data rate supports smooth video playback and gaming, while its low-power LPDDR4X architecture extends battery life. The 2GB density is suitable for entry-level to mid-range tablets. Its compact FBGA-200 package allows for thin and light designs, and the industrial temperature range option supports various environments.
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Embedded Computing
In embedded systems, the CXDB4ABAM offers high-bandwidth memory for real-time data processing in industrial automation, robotics, and edge computing. Its low power consumption is critical for fanless designs. The 200-ball FBGA package is suitable for compact embedded boards. With support for wide temperature ranges (if specified), it can operate in harsh environments. The 3733 Mbps speed enables fast data throughput for sensor fusion and control loops.
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AI Edge Devices
AI edge devices require high memory bandwidth for neural network inference. The CXDB4ABAM's 3733 Mbps data rate provides fast access to model weights and activations. Its low power consumption is essential for battery-powered edge devices. The 2GB capacity supports moderate-sized models. The compact FBGA-200 package fits into small form factors like smart cameras and drones. Low-power modes help extend operational time.
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Automotive Infotainment
Automotive infotainment systems demand high reliability and performance. The CXDB4ABAM offers 3733 Mbps bandwidth for smooth navigation and multimedia. Its low power consumption reduces heat generation in the cabin. The 200-ball FBGA package is suitable for automotive PCBs. If AEC-Q100 qualified (verify), it meets automotive standards. The 2GB density supports multiple displays and audio streams.
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Consumer Electronics
In consumer electronics like smart TVs and streaming devices, the CXDB4ABAM provides high-speed memory for 4K video decoding and responsive user interfaces. Its low power consumption is beneficial for energy-efficient designs. The 2GB capacity is adequate for modern applications. The compact FBGA-200 package enables slim product designs. The 3733 Mbps data rate ensures smooth performance in multimedia applications.
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推薦產品摘要
工程參考資料，適用於 CXDB4ABAM — 比較、設計指引及合規資訊。
選型指南
與替代品比較
| 參數 | 本產品 | CXDB4ABAM-MK | CXDB4ABAM-MJ | CXDB5CCAM-MK | K4U6E3S4AM-MGCL | MT53B256M32D1NP-062 | H9HCNNNBKMMLXR-NEM |
|---|---|---|---|---|---|---|---|
| Package | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) | FBGA-200 (15x10x0.8mm) |
| Brand | CXMT | CXMT | CXMT | CXMT | Samsung | Micron | SK Hynix |
| Memory Type | LPDDR4X | LPDDR4X | LPDDR4X | LPDDR5 | LPDDR4X | LPDDR4X | LPDDR4X |
| Source | web_data | web_data | web_data | llm_knowledge | llm_knowledge | llm_knowledge | llm_knowledge |
主要差異化特點
- Native CXMT part with -MK suffix (對比CXDB4ABAM-MK)
- Lower power than LPDDR5 (對比CXDB5CCAM-MK)
- Cost-effective alternative to Samsung/Micron (對比K4U6E3S4AM-MGCL)
設計說明
For the CXDB4ABAM, ensure proper decoupling capacitors (0.1uF and 1uF) are placed close to each power pin. The 0.6V I/O voltage requires careful signal integrity; keep trace lengths matched and use impedance-controlled routing for high-speed data lines. Refer to the LPDDR4X PCB design guidelines from JEDEC.
Although LPDDR4X is low-power, the CXDB4ABAM can dissipate heat during heavy operation. Ensure adequate thermal vias under the FBGA package and consider airflow in the system design. The operating temperature range should be verified from the datasheet to ensure it meets your application's requirements.
Do not exceed the maximum data rate of 3733 Mbps. Ensure the memory controller is configured for LPDDR4X with correct timing parameters. Verify the power supply voltages (VDD1, VDD2) from the datasheet; incorrect voltages can cause malfunction. Also, follow the recommended power-up sequence to avoid latch-up.
合規資訊
RoHS compliant per JLCPCB listing. Other compliance data not available in provided sources.
