E3AD8G16A4-HR - 8Gb DDR4 SDRAM 512Mx16 | ELIXIR/NANYA
MPN: E3AD8G16A4-HR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $10.1 | $1,010.00 |
| 500 | $9.3 | $4,650.00 |
| 1,000 | $8.6 | $8,600.00 |
Drop-in alternatives for E3AD8G16A4-HR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
NT5AD512M16C4-HR
✅ Drop-In✓ In Stock
$43.1 / Unit
View Datasheet →MT40A512M16TB-062E
✅ Drop-In✓ In Stock
$60 / Unit
View Datasheet →MT40A512M16JY-075E
✅ Drop-In✓ In Stock
$30.5 / Unit
View Datasheet →MT40A512M16LY-075
✅ Drop-In✓ In Stock
$8.1 / Unit
View Datasheet →AS4C512M16D4A-62BCN
✅ Drop-In✓ In Stock
$7.2 / Unit
View Datasheet →K4A8G165WC-BCRC
✅ Drop-In✓ In Stock
$23 / Unit
View Datasheet →E3AD8G16A4-HR Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Organization | 512M x 16 |
| Density | 8 Gb |
| Supply Voltage | 1.2 V |
| Package | TFBGA-96 |
| Data Rate | 3200 MT/s |
| CAS Latency | 22 |
| Burst Length | 8 (BC4 optional) |
| Number of Banks | 16 (4 bank groups) |
| Refresh | Auto-refresh and self-refresh |
| Operating Temperature | 0C to +95C (TCASE) |
| RoHS | Compliant |
| Lead-Free | Yes |
| Mounting Type | Surface Mount |
| Speed Grade | DDR4-3200 |
E3AD8G16A4-HR Pin Configuration
| Pin A1 | VDD — Power supply (1.2V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — DQ power supply |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin D1 | VSSQ — DQ ground |
| Pin D2 | DQ6 — Data input/output 6 |
| Pin D3 | DQ7 — Data input/output 7 |
| Pin E1 | DM0 — Data mask 0 |
| Pin E2 | DQS0 — Data strobe 0 |
| Pin E3 | DQS0# — Data strobe 0 complement |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
E3AD8G16A4-HR is suitable for 6 applications: High-Performance Computing, Networking Equipment, Industrial Automation, Automotive Infotainment, Data Center Servers, Consumer Electronics.
High-Performance Computing
The E3AD8G16A4-HR provides high density and speed (8Gb, 3200 MT/s) essential for HPC systems that require large memory bandwidth for complex simulations and data processing. Its 1.2V operation reduces power consumption, enabling efficient cooling in dense server environments. The TFBGA-96 package allows compact module designs, maximizing memory capacity per board.
Recommended
Networking Equipment
In routers and switches, the E3AD8G16A4-HR offers the speed and density needed for packet buffering and forwarding tables. Its 3200 MT/s data rate ensures low latency, while the 8Gb capacity supports large routing tables. The 1.2V supply helps meet strict power budgets in networking hardware, and the TFBGA-96 package fits well on line cards.
Recommended
Industrial Automation
The E3AD8G16A4-HR is suitable for industrial controllers and PLCs that require reliable, high-speed memory for real-time processing. Its 8Gb density allows storing large control programs and data logs. The device's operating temperature range (0C to +95C) ensures performance in industrial environments, and the 1.2V supply reduces heat generation.
Recommended
Automotive Infotainment
In automotive infotainment systems, the E3AD8G16A4-HR provides the memory bandwidth for navigation, multimedia, and connectivity features. Its high speed (3200 MT/s) ensures smooth graphics and fast app loading. The 1.2V operation is beneficial for automotive power systems, and the TFBGA-96 package withstands vibration and temperature variations.
Recommended
Data Center Servers
The E3AD8G16A4-HR is ideal for data center servers that require high memory capacity and speed for virtualization and cloud computing. Its 8Gb density allows large memory pools, and 3200 MT/s speed reduces bottlenecks. The 1.2V supply lowers power consumption, contributing to energy-efficient data centers. The TFBGA-96 package enables high-density DIMMs.
Recommended
Consumer Electronics
In high-end consumer devices like gaming consoles and 4K TVs, the E3AD8G16A4-HR provides the memory bandwidth for smooth graphics and multitasking. Its 8Gb capacity supports large game textures and streaming buffers. The 1.2V supply is efficient for battery-powered devices, and the compact TFBGA-96 package fits slim designs.
Recommended
Recommended Products Summary
Engineering reference data for E3AD8G16A4-HR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | NT5AD512M16C4-HR | MT40A512M16TB-062E | MT40A512M16JY-075E | MT40A512M16LY-075 | AS4C512M16D4A-62BCN | K4A8G165WC-BCRC |
|---|---|---|---|---|---|---|---|
| Package | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 | TFBGA-96 |
| Brand | ELIXIR/NANYA | Nanya Technology | Micron Technology | Micron Technology | Micron Technology | Alliance Memory | Samsung Electronics |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Data Rate | 3200 MT/s | 3200 MT/s | 3200 MT/s | 2400 MT/s | 2400 MT/s | 3200 MT/s | 3200 MT/s |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| CAS Latency | 22 | 22 | 22 | 17 | 17 | 22 | 22 |
| Operating Temperature | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C | 0C to +95C |
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Higher data rate (3200 MT/s) compared to some alternatives (vs MT40A512M16JY-075E)
- Same-brand drop-in alternative available (vs NT5AD512M16C4-HR)
- RoHS compliant and lead-free (vs K4A8G165WC-BCRC)
Design Notes
For DDR4 routing, maintain 50-ohm single-ended and 100-ohm differential impedance for DQ and DQS signals. Keep trace lengths matched within +/- 10 mils for each byte lane to ensure signal integrity. Use ground planes adjacent to signal layers to minimize crosstalk and EMI.
Decouple the VDD and VDDQ pins with 0.1uF and 1uF ceramic capacitors placed as close as possible to the device. Use a dedicated power plane for VDD and VDDQ to reduce noise. Ensure the 1.2V supply is stable and within +/- 5% tolerance as per JEDEC DDR4 specifications.
The E3AD8G16A4-HR has a maximum operating temperature of 95C. Ensure adequate airflow or heatsinking in high-ambient environments. The TFBGA-96 package has a thermal resistance of approximately 20C/W; calculate junction temperature to avoid exceeding the limit.
Compliance Information
RoHS compliance indicated in AB Sunshine Electronics listing. Other compliance data not available.