MT40A512M16LY-075 - 8Gb DDR4 SDRAM 512Mx16 | Micron
MPN: MT40A512M16LY-075 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.2 | $112.00 |
| 100 | $9.8 | $980.00 |
| 500 | $8.9 | $4,450.00 |
| 1,000 | $8.1 | $8,100.00 |
Drop-in alternatives for MT40A512M16LY-075 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MT40A512M16LY-075:E
✅ Drop-In📋 Reference alternative (not in catalog)
MT40A512M16TB-062E:R
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View Datasheet →NT5AD512M16C4-JR
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View Datasheet →MT40A512M16LY-075 Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM |
| Density | 8 Gbit |
| Organization | 512M x 16 |
| Clock Speed | 1.33 GHz |
| Data Rate | DDR4-2666 |
| Supply Voltage (VDD/VDDQ) | 1.2V ±60mV |
| VPP Supply | 2.5V (-125mV, +250mV) |
| I/O Type | 1.2V pseudo open-drain |
| Internal Banks (x16) | 8 (2 groups of 4 banks) |
| Refresh Time at TC -40°C to 85°C | 64ms |
| Refresh Time at TC >85°C to 95°C | 32ms |
| Refresh Time at TC >95°C to 105°C | 16ms |
| Package | 96-FBGA (7.5x13.5 mm) |
| Operating Temperature Range | 0°C to +95°C |
| Mounting Type | Surface Mount |
MT40A512M16LY-075 Pin Configuration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDDQ — I/O power supply |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
| Pin B1 | VPP — Programming power supply |
| Pin B2 | DQS0 — Data strobe 0 |
| Pin B3 | DQS0# — Data strobe 0 complement |
| Pin B4 | VSS — Ground |
| Pin B5 | DM0 — Data mask 0 |
| Pin B6 | VDDQ — I/O power supply |
| Pin B7 | DQS1 — Data strobe 1 |
| Pin B8 | DQS1# — Data strobe 1 complement |
| Pin B9 | VSS — Ground |
| Pin B10 | DM1 — Data mask 1 |
| Pin B11 | VDDQ — I/O power supply |
| Pin B12 | NC — No connect |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
MT40A512M16LY-075 is suitable for 6 applications: Server Memory, Networking Equipment, Industrial Computing, Automotive Infotainment, Consumer Electronics, Data Center Storage.
Server Memory
The MT40A512M16LY-075 provides high-density, high-bandwidth memory for servers, supporting virtualization, cloud computing, and big data analytics. Its 8Gb density and DDR4-2666 speed enable efficient multitasking and fast data processing. The low 1.2V operation reduces power consumption in data centers, lowering cooling costs. With 16 internal banks, it offers high concurrency for multi-threaded workloads. When used in server DIMMs, it pairs with DDR4 controllers and ECC logic to ensure data integrity. The 96-FBGA package allows for compact module designs, maximizing memory capacity per server.
Recommended
Networking Equipment
In networking equipment such as routers, switches, and firewalls, the MT40A512M16LY-075 provides fast packet buffering and routing table storage. Its DDR4-2666 speed ensures low latency for high-throughput data forwarding. The 8Gb density supports large routing tables and connection tracking. The 1.2V operation is ideal for power-sensitive networking devices. The device's on-die termination and programmable preambles enhance signal integrity in high-speed backplanes. It is commonly used alongside network processors and ASICs, with companion parts like the MT40A512M16TB-062E:R for higher speed requirements.
Recommended
Industrial Computing
The MT40A512M16LY-075 is suitable for industrial PCs, PLCs, and embedded systems that require reliable memory in harsh environments. Its operating temperature range of 0°C to +95°C covers most industrial applications. The high density and speed support real-time data acquisition and control algorithms. The low power consumption is beneficial for fanless designs. The device's robust design ensures long-term reliability. It is often paired with industrial-grade processors and storage, such as the STM32H747BGT6 for control applications, and the MT41K256M16HA-125 for legacy DDR3 systems.
Recommended
Automotive Infotainment
In automotive infotainment systems, the MT40A512M16LY-075 provides memory for navigation, multimedia, and connectivity features. Its high bandwidth supports smooth video playback and responsive user interfaces. The 8Gb density allows for large map databases and media storage. The device's low power consumption is critical for automotive battery life. It operates reliably in the temperature range typical of cabin environments. It is used alongside automotive-grade processors and memory controllers, such as the STM32F746BET6 for display control, and the MT40A512M16JY-07EAIT:B for extended temperature requirements.
Recommended
Consumer Electronics
The MT40A512M16LY-075 is used in high-end consumer electronics such as gaming consoles, smart TVs, and set-top boxes. Its DDR4-2666 speed provides fast data access for gaming and streaming applications. The 8Gb density supports large game assets and 4K video buffering. The low 1.2V operation reduces heat generation, enabling slim designs. The device's high reliability ensures long product life. It is typically paired with application processors and graphics chips, such as the XC7Z020 for FPGA-based acceleration, and the K4A8G165WB-BCTD as a cross-brand alternative.
Recommended
Data Center Storage
In data center storage systems, the MT40A512M16LY-075 is used in NVMe SSDs and storage controllers for caching and metadata management. Its high speed and density enable fast data access and improved IOPS. The low power consumption is critical for large-scale storage arrays. The device's reliability ensures data integrity in 24/7 operation. It is often paired with storage controllers and FPGAs, such as the XCKU5P-2FFVB676I for high-performance processing, and the MT40A512M16TB-062E:R for higher speed caching.
Recommended
Recommended Products Summary
Engineering reference data for MT40A512M16LY-075 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MT40A512M16LY-075:E | MT40A512M16TB-062E:R | MT40A512M16JY-07EAIT:B | H5AN8G6NDJR-XNC | K4A8G165WB-BCTD | NT5AD512M16C4-JR |
|---|---|---|---|---|---|---|---|
| Package | 96-FBGA (7.5x13.5 mm) | 96-FBGA (7.5x13.5 mm) | 96-FBGA (7.5x13.5 mm) | 96-FBGA (7.5x13.5 mm) | 96-FBGA (7.5x13.5 mm) | 96-FBGA (7.5x13.5 mm) | 96-FBGA (7.5x13.5 mm) |
| Brand | Micron Technology | Micron Technology | Micron Technology | Micron Technology | SK Hynix | Samsung Electronics | Nanya Technology |
| Density | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit | 8 Gbit |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | DDR4-2666 | DDR4-2666 | DDR4-3200 | DDR4-3200 | DDR4-3200 | DDR4-2666 | DDR4-2666 |
| Supply Voltage | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V | 1.2V |
| Operating Temperature | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| Internal Banks | 8 (x16) | 8 (x16) | 8 (x16) | 8 (x16) | 8 (x16) | 8 (x16) | 8 (x16) |
Key Differentiators
- High density 8Gb in x16 organization (vs MT41K256M16HA-125 (DDR3))
- DDR4-2666 speed with 1.33 GHz clock (vs MT40A512M16TB-062E:R (DDR4-3200))
- Commercial temperature range 0°C to +95°C (vs MT40A512M16JY-07EAIT:B (industrial))
Design Notes
For DDR4-2666 operation, maintain controlled impedance of 40-50 ohms for DQ, DQS, and address/command traces. Use a 4-layer or more PCB with solid ground and power planes. Keep trace lengths matched within +/- 10 mils for data groups. Place decoupling capacitors (0.1uF and 1uF) close to each VDD and VDDQ pin. Follow Micron's layout guidelines in the datasheet for optimal signal integrity.
The MT40A512M16LY-075 has a maximum operating temperature of +95°C. Ensure adequate airflow or heatsinking in high-ambient environments. The power dissipation depends on activity and temperature; typical DDR4 modules dissipate 2-4W. Use thermal vias under the FBGA package to improve heat transfer to the PCB. Monitor the case temperature during operation to stay within the specified range.
Do not mix DDR4 with DDR3 in the same design; they are not pin-compatible. Ensure the memory controller supports DDR4-2666 speed grade. Verify the VPP supply (2.5V) is within the specified tolerance (-125mV, +250mV). Incorrect VREFDQ calibration can cause data errors; use the on-die adjustable VREFDQ feature. Also, ensure proper termination on DQS and address lines to avoid signal reflections.
Compliance Information
Micron products are generally RoHS compliant. Specific compliance details are available in the datasheet.
