EP1M350F780C7ES - 486-I/O Mercury FPGA | Intel
MPN: EP1M350F780C7ES ✓ Active| Qty | Unit Price | Extended |
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Drop-in alternatives for EP1M350F780C7ES — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M350F780C7
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View Datasheet →EP1M350F780C7ES Maximum Ratings & Electrical Characteristics
| Product Type | Field Programmable Gate Array (FPGA) |
| Logic Family | CMOS |
| User I/O Count | 486 pins |
| Total Package Pins | 780 pins |
| Package Type | FINE LINE BGA-780 |
| Package Category | 780-BBGA |
| Supply Voltage | 1.8 V |
| Maximum Stated Transceiver Data Rate | 1.25 Gbps |
| Channels Supported at 1.25 Gbps | 8 channels |
| Remaining Channel Limit | 10 channels at 1.0 Gbps or less |
| Operating Temperature | 0 C to 85 C |
| Clock Data Recovery | Supported |
| High-Speed Transceivers | Integrated |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| REACH Status | unknown |
EP1M350F780C7ES [data_needed: package dimensions] Pin Configuration Guide
Complete pinout information for EP1M350F780C7ES ([data_needed: package dimensions] package) with 780 pins pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: package dimensions] package pinout diagram for EP1M350F780C7ES](/assets/package-diagrams/default.svg?v=1788622528)
No detailed pinout data available for EP1M350F780C7ES.
Refer to the datasheet for full pin configuration.
Estimated pin count: 780 pins pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M350F780C7ES is suitable for 6 applications: High-Speed Communication Interface, Digital Signal Processing Platform, Embedded Protocol Bridge, Test and Measurement Instrument, Industrial Control and Automation, High-Density Data Aggregation.
High-Speed Communication Interface
EP1M350F780C7ES fits communication-interface equipment that needs programmable logic alongside high-speed serial channels. The verified device data identifies integrated high-speed transceivers, clock-data recovery, 486 user I/O, and support for 1.25 Gbps on any 8 channels. A designer can use the FPGA to implement protocol framing, channel aggregation, buffering, error monitoring, and control while preserving a large general-purpose I/O budget. The 780-pin FINE LINE BGA package supports dense board integration, but exact lane placement, reference-clock requirements, and transceiver electrical limits must be taken from the manufacturer datasheet. Because the verified data does not state the total transceiver count or full timing numbers, the part is best selected after confirming those resources against the intended link topology.
Recommended
Digital Signal Processing Platform
EP1M350F780C7ES can serve as the programmable processing and I/O hub in a digital signal processing platform. Its 486 user I/O pins allow sensor, converter, memory, and control interfaces to be consolidated around configurable logic, while the integrated transceiver resources support high-rate data movement when required. The verified 1.8 V supply and CMOS implementation make it appropriate for a board designed around a low-voltage digital power tree. The device can implement filters, packet handling, stream conversion, timing logic, and data-format adaptation, but exact DSP resources and performance are not included in the supplied data. Engineers should confirm logic-element capacity, embedded-memory limits, clocking architecture, and supported development-tool flow before committing the FPGA to a signal-processing design.
Recommended
Embedded Protocol Bridge
EP1M350F780C7ES is well suited to embedded protocol bridging because programmable logic can translate streams between different interfaces and protocols. The 486 user I/O count provides flexibility for parallel buses, status signals, clocks, and control paths, while the high-speed transceiver capability can carry serialized traffic. A practical implementation could receive a serial stream, perform buffering and packet processing, and expose converted data to a host processor or peripheral subsystem. The verified data states that any 8 channels can support 1.25 Gbps and the other 10 channels must operate at 1.0 Gbps or less. Those limits help bound the link architecture, but protocol support, lane configuration, and timing closure still require exact datasheet and tool validation.
Recommended
Test and Measurement Instrument
EP1M350F780C7ES can be used in test and measurement hardware that needs simultaneous capture, generation, formatting, and analysis of digital data. The 486 user I/O pins allow the FPGA to connect to measurement front ends, timing circuits, memory devices, and host interfaces, while the integrated clock-data recovery supports serialized acquisition paths. Its programmable fabric can implement counters, trigger logic, protocol decoding, correlation, and data packing around the acquisition system. The verified 780-pin BGA package is compact relative to the number of connections, but the 0 C to 85 C operating range and the unspecified thermal resistance must be considered during chassis and airflow design. Exact I/O standards, logic resources, and measurement timing performance are not available in the verified web data.
Recommended
Industrial Control and Automation
EP1M350F780C7ES is appropriate for industrial control equipment that combines deterministic logic with many external connections. The 486 user I/O count can accommodate encoders, actuator controls, status inputs, communication interfaces, and timing signals, while the FPGA fabric can implement state machines, synchronization, and real-time protocol handling. The integrated high-speed transceivers and clock-data recovery are useful when the controller must exchange high-rate data with another subsystem. The commercial 0 C to 85 C operating range supports typical indoor industrial environments, but environmental qualification, vibration, conformal coating, and extended-temperature requirements must be assessed separately. Exact package pinout, bank voltage restrictions, and configuration details are required before designing the industrial controller.
Recommended
High-Density Data Aggregation
EP1M350F780C7ES can aggregate multiple data sources into a higher-level processing or storage subsystem. The device family data states that any 8 channels can operate at 1.25 Gbps, while the other 10 channels must operate at 1.0 Gbps or less. This structure is useful for systems that combine several fast serial streams with lower-rate interfaces and then perform packetization, filtering, buffering, or time-domain processing in programmable logic. The 780-pin BGA package and 486 user I/O provide connection density for multi-channel boards. Successful implementation depends on careful channel assignment, reference-clock design, signal-integrity analysis, and confirmation of the exact number and capabilities of transceiver channels. Those parameters are not fully specified in the retrieved source.
Recommended
Recommended Products Summary
Engineering reference data for EP1M350F780C7ES — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M350F780C7 | EP1M350F780C5ES | EP1M350F780C6 | EP1M350F780C6N | EP1M350B780C7 |
|---|---|---|---|---|---|---|
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 780-pin FINE LINE BGA | 780-pin FINE LINE BGA | 780-pin BGA | 780-pin BGA | 780-pin BGA | 780-pin BGA |
| Product Type | FPGA | FPGA | FPGA | FPGA | FPGA | FPGA |
| User I/O | 486 pins | 486 pins | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Supply Voltage | 1.8 V | 1.8 V | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Maximum Stated Data Rate | 1.25 Gbps | 1.25 Gbps | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Clock Data Recovery | Supported | Supported | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Exact Pin-to-Pin Verification | Required for substitution | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Integrated high-speed serial capability (vs EP1M350B780C7)
- High user-I/O density (vs EP1M350F780C7)
- Verified channel-rate envelope (vs EP1M350F780C5ES)
- Commercial temperature range (vs EP1M350F780C6N)
Design Notes
Treat EP1M350F780C7ES as a fine-pitch 780-pin BGA design rather than a conventional perimeter-I/O FPGA. The verified source identifies FINE LINE BGA-780 but does not provide ball dimensions, pitch, stack-up recommendations, or escape geometry. Use the manufacturer package drawing as the controlling document, preserve a continuous reference plane, and calculate escape routing and via capacity from the exact land pattern. Do not begin production layout from a generic 780-BGA symbol.
The verified device entry specifies a 1.8 V supply, but a complete FPGA power design requires more than one rail and controlled sequencing. Confirm core, I/O-bank, transceiver, auxiliary, and configuration-rail limits from the datasheet before selecting regulators. Place local decoupling adjacent to the relevant power-entry and transceiver areas, minimize shared impedance, and verify startup and shutdown sequencing. The supplied data does not include regulator-current values, current transients, or power-consumption limits, so those values must not be inferred.
The transceiver feature set makes channel placement and reference-clock quality central to reliable operation. The verified data states that any 8 channels can support 1.25 Gbps and the other 10 channels must operate at 1.0 Gbps or less. Route high-speed pairs over an uninterrupted reference plane with controlled impedance, minimize stubs and layer changes, and follow the datasheet rules for differential-pair spacing and connector breaks. Confirm the actual lane count, transmitter and receiver limits, clock requirements, and allowable channel loss before freezing the design.
FPGA junction temperature depends on configuration activity, logic utilization, toggle rates, transceiver traffic, supply voltage, airflow, and board construction. The verified source gives a 0 C to 85 C operating range but does not provide thermal resistance, power limits, or airflow requirements. Estimate power only after selecting a representative configuration, then verify it with the manufacturer power-estimation workflow and bench measurements. Keep the BGA and surrounding voltage-regulator area free of unintended thermal bottlenecks and provide an airflow strategy appropriate to the final system.
Do not infer interchangeability from the EP1M350 family name, a 780-pin package description, or a similar speed suffix. The exact ordering code can affect speed grade, temperature grade, transceiver options, configuration, or other device characteristics that are not present in the retrieved data. Before using a same-family part, compare the complete manufacturer ordering table, pin mapping, voltage limits, package drawing, transceiver resources, development-tool support, and required bitstream or license compatibility. If any item differs, treat the candidate as a new design rather than a drop-in replacement.
Compliance Information
The verified source data does not provide RoHS, REACH, lead-free, halogen-free, conflict-minerals, or AEC-Q100 information. No compliance claim is inferred from the FPGA category or Intel brand.
