EP1M350F780I6 - 350K Gates 14400 Cells Mercury 1.8V FPGA | Altera
MPN: EP1M350F780I6 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $285 | $285.00 |
| 10 | $268 | $2,680.00 |
| 100 | $245 | $24,500.00 |
| 500 | $225 | $112,500.00 |
| 1,000 | $210 | $210,000.00 |
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View Datasheet →EP1M350F780I6 Maximum Ratings & Electrical Characteristics
| Family | Mercury (PLD) |
| Logic Cells | 14,400 |
| Equivalent Gates | 350,000 |
| User I/Os | 486 |
| Embedded Memory (bits) | 114,688 |
| Core Supply Voltage | 1.8 V |
| Package | 780-ball FC-FBGA (Fine-line) |
| Operating Temperature | 0 C to 85 C (Industrial) |
| Process Technology | CMOS |
| Multi-Gigabit Transceivers | Up to 1.25 Gbps with embedded CDR |
| Configuration | JTAG (IEEE 1149.1) / Active Serial (EPC) |
| LAB Count | 1,440 (per Mouser listing) |
| Mounting Type | Surface Mount |
EP1M350F780I6 780-ball fc-fbga (fine-line) Pin Configuration Guide
Complete pinout information for EP1M350F780I6 (780-ball fc-fbga (fine-line) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1M350F780I6.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M350F780I6 is suitable for 6 applications: Telecommunications Line Cards, Software-Defined Radio Data Path, Industrial Imaging and Machine Vision, High-Speed Protocol Bridging and Aggregation, DSP and Signal Processing Accelerators, Legacy Test and Measurement Instrumentation.
Telecommunications Line Cards
The EP1M350F780I6 fits telecommunications line-card designs because it offers 350K equivalent gates, 14,400 logic cells, and 486 user I/Os in a single 780-ball FC-FBGA package, with multi-gigabit transceivers supporting up to 1.25 Gbps with embedded CDR. These transceivers cleanly aggregate SPI-4.2, POS-PHY, or custom backplane links without external PHYs, while the high I/O count accommodates parallel LVDS buses to network processors. The 114,688-bit embedded memory provides packet-buffer headroom, and 1,440 LABs are ample for header parsing, lookup, and QoS classification. Industrial 0-85 C operation lets the same silicon be reused in CO and outdoor-cabinet designs.
Recommended
Software-Defined Radio Data Path
The EP1M350F780I6 supports software-defined radio (SDR) data paths because the Mercury architecture combines 14,400 logic cells with 114,688 bits of embedded memory and dedicated hardware multipliers for DSP. Up- and down-conversion, channelization, and pulse-shaping FIRs map efficiently onto the multiplier blocks, while the 1.25 Gbps transceivers move digitized IF/RF samples to and from ADC/DAC companion devices. 486 user I/Os are sufficient to fan out to multiple ADC/DAC channels plus JTAG, SPI, and control buses. The 1.8V core eases power budget design versus higher-voltage legacy PLDs, and the industrial temperature rating supports tactical and outdoor deployments.
Recommended
Industrial Imaging and Machine Vision
The EP1M350F780I6 is well matched to industrial imaging pipelines because it offers 14,400 logic cells and 114,688 bits of embedded memory for line-buffer storage, Bayer demosaicing, and color-space conversion without external SRAM. The 486 user I/Os accept Camera Link, LVDS, or parallel CMOS sensor data directly, and the multi-gigabit transceivers at 1.25 Gbps support emerging CoaXPress or GigE-Vision links. Hardware multipliers accelerate convolution kernels for edge detection and defect classification. Industrial 0-85 C operation and the rugged FC-FBGA package suit factory-floor deployments where vibration and thermal cycling are routine.
Recommended
High-Speed Protocol Bridging and Aggregation
The EP1M350F780I6 is a natural fit for protocol-bridging designs because the multi-gigabit transceivers with embedded CDR (to 1.25 Gbps) provide direct connection to SFP/SFP+ optical modules, while the 486 user I/Os run parallel LVDS/LVCMOS links to legacy ASICs and ASSPs. Its 14,400 logic cells implement bridging logic, rate adaptation, and packet segmentation/reassembly in a single chip. Embedded 114,688-bit memory buffers traffic across speed mismatches, and industrial temperature rating supports deployment in edge routers and industrial gateways. The 780-ball FC-FBGA package routes the differential pairs cleanly to maintain signal-integrity margins above 1 Gbps.
Recommended
DSP and Signal Processing Accelerators
The EP1M350F780I6 accelerates DSP workloads because Mercury-family FPGAs integrate dedicated hardware multipliers alongside 14,400 logic cells and 114,688 bits of embedded memory. FIR filters, FFT butterflies, and matrix-multiply pipelines benefit from the parallel multiplier fabric, while 1,440 LABs provide register-rich datapaths for high clock rates. Industrial 0-85 C operation allows use in factory automation controllers and outdoor wireless base stations, and the 1.8V core simplifies thermal design versus legacy 2.5V/3.3V PLD families. 486 user I/Os stream multiple parallel ADC channels into the device at sample rates above 100 MHz.
Recommended
Legacy Test and Measurement Instrumentation
The EP1M350F780I6 fits legacy test-and-measurement chassis because it provides 14,400 logic cells, 1,440 LABs, and 486 user I/Os to instrument parallel buses, plus 1.25 Gbps transceivers for high-speed serial front-ends. Pattern generators, protocol analyzers, and bit-error-rate testers all benefit from the configurable logic and abundant block RAM for capture buffers. Industrial temperature rating supports lab and field-deployed instrumentation, while the FC-FBGA package preserves signal integrity at the BGA-to-backplane transition. Engineers maintaining installed ATE systems can source this part through authorized distributors and authorized brokers to extend system life cycles.
Recommended
Recommended Products Summary
Engineering reference data for EP1M350F780I6 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M350F780C7 | EP1M350F780I5 | EP1M350F780C7N | EP1M350F780C7ES | EP1M350F780C6 | EP1M350F780C5 | EP1M350B780I6 |
|---|---|---|---|---|---|---|---|---|
| Package | 780-ball FC-FBGA | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same | 780-ball FC-FBGA - same |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Family | Mercury (PLD) | Mercury (PLD) | Mercury (PLD) | Mercury (PLD) | Mercury (PLD) | Mercury (PLD) | Mercury (PLD) | Mercury (PLD) |
| Logic Cells | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 | 14,400 |
| User I/Os | 486 | 486 | 486 | 486 | 486 | 486 | 486 | 486 |
| Operating Temperature | 0 to 85 C (Industrial) | 0 to 70 C (Commercial) | 0 to 85 C (Industrial) | 0 to 70 C (Commercial) | 0 to 70 C (Commercial) | 0 to 70 C (Commercial) | 0 to 70 C (Commercial) | 0 to 85 C (Industrial) |
| Speed Grade | -6 (I6) | -7 (C7, faster) | -5 (I5, slower) | -7 (C7, faster) | -7 (C7, faster) | -6 (C6, similar) | -5 (C5, slowest) | -6 (I6) |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Approx. 1k-unit price (USD) | 210 | 210 | 210 | 215 | [DATA_NEEDED] | 200 | 195 | 210 |
Key Differentiators
- Exact same-die drop-in for obsolete or constrained inventory (vs EP1M350F780I5)
- Higher I/O density than Cyclone/ACEX predecessors in the same generation (vs EP1K100FC484-3 (ACEX 1K))
- Embedded CDR on every multi-gigabit channel (vs Generic 350K-gate FPGAs without transceivers)
Design Notes
Estimated: core current for the EP1M350F780I6 scales roughly linearly with toggle rate and clock frequency; at a typical 0.5-1.0 W at quiescent and 2-4 W at full operating speed. Decouple the 1.8V VCCINT plane with at least four 10 uF bulk ceramic capacitors plus 0.1 uF high-frequency bypasses within 5 mm of each BGA power ball. 3.3V VCCIO banks also need their own bulk decoupling if any LVCMOS/LVDS outputs are switching at high frequency. Use a multi-zone power island layout to avoid IR drop on the 780-ball FC-FBGA power/ground grid.
Estimated: the 780-ball FC-FBGA package dissipates 2-5 W under typical SDR/telecom workloads; without a thermal pad and airflow the junction can approach 100 C in industrial 85 C ambient environments. Reference the Mercury datasheet thermal resistance theta_JA and provide at least 100 cm^2 of inner-plane copper directly beneath the BGA. For sealed enclosures, add a small heatsink or a thermally-conductive gap-pad to the chassis wall and verify with a thermal probe under worst-case utilization.
Estimated: route the multi-gigabit transceiver channels on the top microstrip/stripline layer immediately above a solid ground plane; keep 100-ohm differential impedance and minimize vias (no more than two per Tx/Rx pair). Use length matching within 0.13 mm for 1.25 Gbps signals per Mercury datasheet guidelines. JTAG TMS/TCK/TDO/TDI must be 4.7k pull-ups on TCK/TMS and 4.7k pull-up on TDO per IEEE 1149.1; do not omit these or JTAG configuration will fail. Decoupling capacitors must sit on the same layer as their associated BGA balls to minimize loop inductance.
Do not confuse speed grades: -I6, -I5, -C7, -C6, -C5 differ in Fmax (C7 fastest, C5 slowest), but the die, package, and pinout are identical. Do not substitute a 484-ball Mercury variant without re-laying out the PCB - the ball-map differs. Verify configuration mode (JTAG vs Active Serial EPC) on every prototype build; a missing EPC configuration device causes the FPGA to hang at startup with all I/Os tri-stated. Lastly, regenerate timing analysis in Quartus II after any change of speed grade to confirm the design still meets Fmax.
Compliance Information
Mercury family is mature legacy silicon from Altera (now Intel PSG); explicit RoHS/REACH/AEC-Q100 status not present in the verified web data and is marked [DATA_NEEDED]. The -N suffix on Mercury variants (e.g., EP1M350F780C7N) historically denotes lead-free / RoHS-compliant finish per Altera naming conventions, but this should be confirmed with the manufacturer's material declaration before use in regulated markets.
