EPM3512ATC256-10N - MAX 3000A CPLD, 512 Macrocells | Altera
MPN: EPM3512ATC256-10N ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $32.4 | $324.00 |
| 100 | $27.85 | $2,785.00 |
| 500 | $23.6 | $11,800.00 |
| 1,000 | $20.1 | $20,100.00 |
Drop-in alternatives for EPM3512ATC256-10N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM3512AFC256-10N
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View Datasheet →EPM3512AFC256-7N
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View Datasheet →EPM3512AFI256-10N
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View Datasheet →EPM3512AFI256-7N
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View Datasheet →EPM3512ATC256-10N Maximum Ratings & Electrical Characteristics
| Family | MAX 3000A |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Macrocells | 512 |
| Logic Array Blocks (LABs) | 16 |
| Maximum User I/O Pins | 208 |
| Package | FBGA-256 (FineLine BGA, 17x17 mm, 1.0 mm pitch) |
| Propagation Delay (tPD1) | 10 ns |
| Core Supply Voltage (VCCINT) | 3.3 V |
| I/O Supply Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Programming Interface | JTAG (IEEE Std. 1149.1) - in-system programmable |
| Operating Temperature | 0 C to +70 C (commercial, "C" suffix) |
| Process Technology | 0.30 um CMOS EEPROM |
| Mounting Type | Surface Mount |
| RoHS Status | unknown |
| Lead-Free | unknown |
EPM3512ATC256-10N fbga-256 (fineline bga, 17x17 mm, 1.0 mm pitch) Pin Configuration Guide
Complete pinout information for EPM3512ATC256-10N (fbga-256 (fineline bga, 17x17 mm, 1.0 mm pitch) package) with 208 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM3512ATC256-10N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 208 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM3512ATC256-10N is suitable for 6 applications: 32-Bit Microprocessor Bus Interface Bridging, Address Decoding and Chip-Select Generation, I/O Expansion and GPIO Multiplexing, State-Machine and Sequencer Controllers, ASIC and FPGA Peripheral Glue Logic, Board-Level JTAG Test and Configuration Networks.
32-Bit Microprocessor Bus Interface Bridging
The EPM3512ATC256-10N's 512 macrocells and 208 user I/O pins make it an ideal glue-logic bridge between legacy 32-bit microprocessors and modern peripherals. The 10 ns tPD1 propagation delay allows the CPLD to decode a 32-bit address bus and generate chip-select signals within a single clock cycle, while MultiVolt I/O banks support 5.0 V, 3.3 V, 2.5 V, and 1.8 V mixed-voltage interfaces on the same die. Engineers typically use it to bridge between an MPU's 3.3 V address/data bus and 5 V peripheral memories or ASICs, with JTAG-supported in-field reprogrammability enabling late-stage board bring-up fixes.
Recommended
Address Decoding and Chip-Select Generation
With 512 macrocells organized into 16 LABs, the EPM3512ATC256-10N can implement large multi-bank address decoders for systems with many peripheral chip-selects, including SDRAM banks, Flash memory, I/O expansion chips, and DMA controllers. The non-volatile EEPROM configuration means the decoder is active at power-on with no boot PROM required - a key advantage over SRAM-based FPGAs in deterministic-startup applications. The 10 ns tPD1 propagation delay is fast enough to keep up with 50-66 MHz bus cycles, and the FBG256 1.0 mm pitch BGA provides clean signal integrity for parallel address/data buses.
Recommended
I/O Expansion and GPIO Multiplexing
The EPM3512ATC256-10N's 208 user I/O pins can be configured as multi-function GPIO multiplexers, routing signals between multiple peripherals and a microcontroller or DSP. Each I/O pin supports MultiVolt operation, so a single CPLD can buffer and level-shift between 1.8 V, 2.5 V, 3.3 V, and 5 V domains without external level translators. This dramatically simplifies board design when integrating mixed-voltage sensors, displays, memory buses, and wireless modules onto a single board, while the 10 ns propagation delay is fast enough for SPI, I2C, UART, and parallel display interfaces.
Recommended
State-Machine and Sequencer Controllers
The MAX 3000A architecture is well-suited for implementing multiple parallel state machines, sequencers, and protocol controllers. Each of the 16 LABs can host an independent state machine, and the deterministic 10 ns tPD1 timing ensures glitch-free state transitions. Common designs include motor-control sequencers, power-supply sequencing controllers, multi-phase clock generators, and custom protocol handlers. The 512 macrocells provide ample headroom for combinational logic plus per-state register allocation, while JTAG-supported in-system programmability enables field updates of the sequencer firmware.
Recommended
ASIC and FPGA Peripheral Glue Logic
When designing around a high-pin-count ASIC or FPGA that has insufficient general-purpose I/O for all peripherals, the EPM3512ATC256-10N can offload glue-logic functions such as clock distribution, reset coordination, peripheral chip-select decoding, and watchdog timing. Its 208 user I/O pins and MultiVolt capability allow it to interface with both the 1.8 V/2.5 V core domain of an FPGA and 3.3 V/5 V peripheral domain on the same board. The non-volatile EEPROM-based configuration boots instantly at power-on, which is critical for systems that cannot tolerate FPGA-configuration delays.
Recommended
Board-Level JTAG Test and Configuration Networks
The EPM3512ATC256-10N supports the IEEE Std. 1149.1 JTAG interface for both device programming and board-level boundary-scan testing. With 208 user I/O pins, the CPLD can act as a JTAG hub for a board containing multiple JTAG-chain devices, providing TAP multiplexing, scan-path reordering, and custom test-mode control. The FBG256 package exposes the maximum I/O count for boundary-scan coverage of densely populated BGA-based designs, and the device's MultiVolt I/O simplifies integration with mixed-voltage scan chains.
Recommended
Recommended Products Summary
Engineering reference data for EPM3512ATC256-10N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM3512AFC256-10N | EPM3512AFC256-7N | EPM3512AFI256-10N | EPM3512AFI256-7N |
|---|---|---|---|---|---|
| Brand | Altera | Altera | Altera | Altera | Altera |
| Package | FBGA-256 | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) | FBGA-256 (same) |
| Macrocells | 512 | 512 | 512 | 512 | 512 |
| Maximum User I/O | 208 | 208 | 208 | 208 | 208 |
| tPD1 (Pin-to-Pin Delay) | 10 ns | 10 ns | 7.5 ns | 10 ns | 7.5 ns |
| Temperature Grade | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | 0 C to +70 C (commercial) | -40 C to +85 C (industrial) | -40 C to +85 C (industrial) |
| Packing Option | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tape & Reel |
| Lifecycle Status | Obsolete (EOL) | Active (per Mouser 2026-09 listing) | Obsolete | Active | Obsolete |
| Core Voltage (VCCINT) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Key Differentiators
- Drop-in tray-pack variant of the same 512-macrocell MAX 3000A die (vs EPM3512AFC256-10N)
- Industry-standard 10 ns speed grade matches most 50-66 MHz bus-bridge applications (vs EPM3512AFC256-7N)
- Higher macrocell count than smaller MAX 3000A siblings (vs EPM3256AQC208-10N)
Design Notes
The FBG256 FineLine BGA at 1.0 mm ball pitch requires PCB pad design per IPC-7351 / IPC-7095 with non-solder-mask-defined (NSMD) pads for best solder-joint reliability. Use a 4-6 layer stackup with continuous GND and PWR planes under the BGA, and place 0.1 uF + 1 uF + 10 uF decoupling capacitors on each VCCINT and VCCIO rail within 2-3 mm of the balls. Fanout trace width should be 0.075-0.1 mm (3-4 mil) to escape between BGA balls, and via-in-pad is recommended for inner-row signals to improve routability.
JTAG pin assignment: TCK, TMS, TDI, TDO, and TRST (if used) must be reserved exclusively for JTAG and not be used as user I/O - assigning them to user logic will lock the device out of in-system programming. Each MultiVolt I/O bank shares a single VCCIO rail, so all pins in a bank operate at the same voltage - mixing 5 V and 1.8 V within the same bank is not allowed. When using 5 V-tolerant inputs, set VCCIO of that bank to 3.3 V (5 V tolerance is enabled on input pins only, not outputs).
Signal-integrity considerations for parallel bus designs: route address and data buses with matched lengths (within +/- 2 mm) to avoid skew on the 10 ns tPD1 budget, and use series-termination resistors (22-33 ohm) on high-speed outputs to dampen reflections on long traces. Place the EPM3512ATC256-10N close to the bus controller to minimize stub lengths, and keep the clock-distribution traces short and isolated from switching signals. For JTAG chain routing, daisy-chain TDI to TDO of all devices and provide a 10 kohm pull-up on TCK and TMS per IEEE 1149.1 recommendations.
Compliance Information
RoHS, REACH, lead-free, and halogen-free status not specified in the verified web data for EPM3512ATC256-10N. Compliance information should be confirmed with the manufacturer (Intel, formerly Altera) or distributor before use in regulated designs. AEC-Q100 not applicable for non-automotive CPLD grade.
