EPM570M256C4N - 440 LE MAX II CPLD 256-MBGA | Intel / Altera
MPN: EPM570M256C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.84 | $13.84 |
| 10 | $12.46 | $124.60 |
| 100 | $11.08 | $1,108.00 |
| 500 | $9.69 | $4,845.00 |
| 1,000 | $8.31 | $8,310.00 |
Drop-in alternatives for EPM570M256C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM570GM256C5N
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View Datasheet →EPM570M256C4N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Logic Elements | 440 LE |
| Macro Cells | 440 |
| Maximum User I/Os | 160 |
| User Flash Memory (UFM) | 8 Kbit |
| Internal Performance (fMAX) | 247.5 MHz |
| Core Supply Voltage (VCCINT) | 1.8 V |
| I/O Supply Voltage (VCCIO) | 2.5 V / 3.3 V |
| Process Technology | 0.18 µm CMOS |
| Configuration Memory | On-chip Flash (non-volatile, instant-on ≤ 0.5 ms) |
| Programming Interface | JTAG (IEEE 1149.1) / ISP |
| Package | 256-ball Micro FineLine BGA (MBGA), 11 × 11 mm |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40 °C to +125 °C |
| Lead-Free / RoHS | Yes, LEAD FREE (per datasheet.com spec listing) |
| Logic Family | CMOS |
EPM570M256C4N 256-ball micro fineline bga (mbga), 11 × 11 mm Pin Configuration Guide
Complete pinout information for EPM570M256C4N (256-ball micro fineline bga (mbga), 11 × 11 mm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570M256C4N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570M256C4N is suitable for 6 applications: Industrial I/O Expansion and Bus Bridging, FPGA Configuration and JTAG Control, Telecom Line Card Power Sequencing, Board-Level Glue Logic Replacement, LED Display and Signage Control, Legacy Bus Translation (PCI to Local Bus).
Industrial I/O Expansion and Bus Bridging
The EPM570M256C4N fits industrial I/O expansion because its 440 logic elements and 160 user I/Os enable parallel bus-to-parallel bus conversion without software overhead. According to the MAX II datasheet, the device supports LVCMOS, LVTTL, and PCI I/O standards at 2.5 V/3.3 V, allowing direct interface to legacy 5 V-tolerant logic via external resistors. Place the CPLD between a microcontroller's address/data bus and peripheral connectors; the instant-on Flash configuration ensures deterministic bus response at power-up, critical for industrial PLC backplanes requiring predictable boot timing under 10 ms.
Recommended
FPGA Configuration and JTAG Control
The EPM570M256C4N is well suited as a configuration master for downstream FPGAs because its 8 Kbit User Flash Memory (UFM) can store golden configuration images and its JTAG engine supports boundary-scan orchestration. According to the MAX II datasheet, the device operates as a JTAG master with chain management logic, making it ideal for multi-FPGA boards requiring fail-safe reconfiguration. Place the CPLD between the system controller and the FPGA JTAG chain; instant-on capability enables FPGA configuration within 100 ms of board power-up, reducing overall system boot time versus microcontroller-based solutions.
Recommended
Telecom Line Card Power Sequencing
The EPM570M256C4N fits telecom power-sequencing applications because its 440 LEs can implement multi-rail sequencers with programmable delay chains and fault-monitoring logic. According to the MAX II datasheet, each I/O pin supports hot-socket insertion with controlled slew rates, enabling safe connection to live backplanes. Use the CPLD to sequence 1.8 V, 2.5 V, and 3.3 V rails for DSPs and PHY chips with defined turn-on ordering; the non-volatile Flash configuration eliminates the need for external PROM or microcontroller firmware for sequencing, reducing BOM cost and board area.
Recommended
Board-Level Glue Logic Replacement
The EPM570M256C4N consolidates discrete 74-series glue logic because 440 LEs replace dozens of AND/OR gates, flip-flops, and muxes in a single chip. According to the MAX II datasheet, the device offers pin-to-pin delays under 5 ns and operates with deterministic timing that simplifies static timing analysis. Use it to replace legacy GAL/PAL devices and discrete logic on ASSP/ASIC carrier boards; the MBGA-256 footprint supports up to 160 I/Os, accommodating wide datapath connections and reducing PCB complexity by eliminating 20-30 discrete logic packages.
Recommended
LED Display and Signage Control
The EPM570M256C4N is ideal for LED matrix driving because its 160 I/Os can directly control 160 LED channels without external drivers, and the 247.5 MHz fMAX supports high PWM refresh rates above 10 kHz. According to the MAX II datasheet, the 3.3 V I/O can sink 24 mA per pin, sufficient for direct LED cathode drive in moderate-current signage. Place the CPLD as the row/column scanner for RGB matrices up to 16 × 10 pixels; the instant-on Flash eliminates boot flicker at power-up, ensuring clean display initialization for commercial signage applications.
Recommended
Legacy Bus Translation (PCI to Local Bus)
The EPM570M256C4N enables PCI-to-local-bus bridging because its 440 LEs implement full PCI 2.2-compliant target interface state machines with 160 I/Os split between the PCI bus side and the local peripheral side. According to the MAX II datasheet, the device's 2.5 V/3.3 V I/O banks natively support PCI signaling levels without external level shifters. Use the CPLD as a cost-effective bridge between legacy PCI slots and modern local-bus ASICs; the non-volatile configuration ensures immediate bus availability at system power-up, eliminating the warm-up delay of FPGA-based bridges.
Recommended
Recommended Products Summary
Engineering reference data for EPM570M256C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570GM256C5N | EPM570F256C4N | EPM570F256C5N | EPM570GF256C4N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 256-ball MBGA | 256-ball MBGA - same | 256-ball MBGA - same | 256-ball MBGA - same | 256-ball MBGA - same |
| Logic Elements | 440 LE | 440 LE | 440 LE | 440 LE | 440 LE |
| Maximum User I/Os | 160 | 160 | 160 | 160 | 160 |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C (commercial) | -40 °C to +125 °C (industrial) | -40 °C to +125 °C (industrial) | -40 °C to +125 °C (industrial) |
| Speed Grade | C4 | C5 (faster) | C4 | C5 (faster) | C4 |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| User Flash Memory | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit | 8 Kbit |
| RoHS / Lead-Free | Yes (LEAD FREE per spec listing) | Yes | Yes | Yes | Yes (Green compliant) |
Key Differentiators
- Commercial temperature C4 speed grade baseline (vs EPM570GM256C5N)
- Industrial temperature capability (vs EPM570F256C4N)
- Pin-compatible upgrade path within MAX II family (vs EPM570F256C5N)
Design Notes
The 256-ball MBGA package at 11 × 11 mm requires a 4-layer PCB stack-up with 0.5 mm pitch BGA escape routing. Use microvia or via-in-pad technology for inner-row balls to route signals out cleanly. Place at least 8 ground vias in the center thermal pad array to reduce ground bounce. Maintain a clearance of 0.2 mm between BGA pads and any plane splits to avoid signal-integrity issues at the 247.5 MHz fMAX.
Decoupling strategy: place one 0.1 µF X7R ceramic capacitor within 3 mm of every VCCINT and VCCIO ball pair, plus one 10 µF tantalum or polymer bulk capacitor per supply rail. According to the MAX II datasheet, the device draws under 50 mA quiescent current, but transient currents during simultaneous I/O switching can exceed 200 mA - the bulk capacitor absorbs these spikes. Power-up sequencing is not required because VCCINT and VCCIO can ramp independently within datasheet limits.
Do not exceed the 3.3 V absolute maximum on VCCIO or 1.89 V on VCCINT or the device will latch up. JTAG chain integrity must be verified at prototype bring-up: TCK should be pulled to a known state through 10 kΩ to ground, and TMS/TDI should be pulled up through 10 kΩ to VCCIO to prevent spurious configuration writes. The instant-on Flash configuration can be corrupted if power-down occurs during a JTAG write - ensure clean power-down or use the WRITE_n signal to gate writes during brownout.
Although the EPM570M256C4N typically dissipates under 200 mW, the MBGA package has limited thermal dissipation (θJA approximately 30 °C/W without airflow). For designs operating at the upper commercial temperature limit (85 °C), ensure at least 100 mm² of unbroken ground plane beneath the device and consider 100 LFM airflow if the junction temperature margin is less than 20 °C. Industrial-grade variants (F-version) should be specified if junction temperatures may exceed 100 °C.
Compliance Information
RoHS compliant per Intel/Altera product marking; LEAD FREE per datasheets.com specification listing. Not AEC-Q100 qualified - automotive applications should consider AEC-Q100 equivalent devices from other families. Operating temperature range 0-85°C commercial; industrial variants (F-suffix) available.
