H5CG24AGBDX022N - 16Gb DDR5 SDRAM DRAM | SK hynix
MPN: H5CG24AGBDX022N ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
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View Datasheet →H5CG24AGBDX022N Maximum Ratings & Electrical Characteristics
| Manufacturer | SK hynix |
| Product Family | H5CG24 series DDR5 SDRAM |
| Memory Type | DDR5 SDRAM |
| Density | 16 Gbit (2 GB) |
| Mounting Type | Surface Mount |
| On-Die ECC | Yes (DDR5 generation feature) |
| Interface Type | SSTL / POD (DDR5 per JEDEC) |
| RoHS Status | unknown |
H5CG24AGBDX022N [data_needed: fbga package code and body size] Pin Configuration Guide
Complete pinout information for H5CG24AGBDX022N ([data_needed: fbga package code and body size] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: fbga package code and body size] package pinout diagram for H5CG24AGBDX022N](/assets/package-diagrams/default.svg?v=1788069619)
No detailed pinout data available for H5CG24AGBDX022N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
H5CG24AGBDX022N is suitable for 6 applications: PC Client DDR5 UDIMM / SODIMM Modules, Server RDIMM / LRDIMM Memory Subsystems, Embedded Memory-Down Industrial x86 Boards, AI Accelerator and GPU Memory Subsystems, Networking and Telecom Appliance Memory, Automotive and Edge Compute Modules.
PC Client DDR5 UDIMM / SODIMM Modules
The H5CG24AGBDX022N is a primary building block for consumer and commercial PC DDR5 UDIMM and SODIMM modules, where eight or sixteen 16 Gb components deliver 16 GB or 32 GB per module across two independent 32-bit sub-channels. Its on-die ECC corrects internal cell errors before they reach the module bus, raising effective reliability without the cost of ECC-capable chipsets. Because the DDR5 PMIC sits on the module, board designers integrate the component with standard SPD hub wiring and JEDEC fly-by command/address routing. At X022 speed-code timing, memory controllers train ODT and VREF automatically, so this component fits mainstream Intel and AMD client platforms with no firmware-level customization beyond standard SPD programming.
Recommended
Server RDIMM / LRDIMM Memory Subsystems
In server platforms, the H5CG24AGBDX022N populates registered (RDIMM) and load-reduced (LRDIMM) DDR5 modules where per-GB cost and channel bandwidth are the dominant metrics. The 16 Gb density allows single-rank 32 GB RDIMMs built from sixteen x8 components, and the DDR5 sub-channel architecture doubles effective concurrency per DIMM versus DDR4. On-die ECC plus module-level RCD register buffering lets hyperscale designs hit the memory bandwidth targets of modern Xeon and EPYC memory controllers. Designers should program the SPD/PMIC configuration for the X022 speed bin and validate thermal derating because dense server memory channels see sustained junction temperatures that require airflow-based derating per the SK hynix thermal guidelines.
Recommended
Embedded Memory-Down Industrial x86 Boards
Industrial COM Express, SMARC, and ATX carrier designs increasingly mount DDR5 components directly on the baseboard (memory-down) instead of using SODIMM sockets, saving height and improving vibration immunity. The H5CG24AGBDX022N fits this pattern because its surface-mount package tolerates reflow assembly and its dual 32-bit sub-channels pair cleanly with embedded x86 memory controllers that natively support DDR5 sub-channel training. A two-chip build provides 4 GB; eight chips provide 16 GB. Key layout requirements are matched-length CA routing, per-byte-lane DQ/DQS symmetry, and an on-board DDR5 PMIC supplying the correct core and VDDQ rails; the component's on-die ECC then adds industrial-grade error robustness without external logic.
Recommended
AI Accelerator and GPU Memory Subsystems
AI inference and training cards pair HBM with large DDR5 host-memory buffers, and the H5CG24AGBDX022N serves those DDR5-side capacity pools. The X022 speed code targets the mainstream DDR5 data-rate range that host CPUs and accelerator-side DMA engines sustain, while on-die ECC protects long-running training jobs from silent cell errors that would otherwise corrupt checkpoints. The component's bank-group parallelism keeps random-access latency low during embedding lookups and weight streaming from DDR5 into SRAM/HBM staging. Designers mounting this component on accelerator boards should size the DDR5 PMIC for peak burst current and follow the controller's DFE training sequence to maintain eye margins at high data rates across temperature.
Recommended
Networking and Telecom Appliance Memory
Routers, switches, and 5G telecom appliances use DDR5 memory-down banks for packet buffering tables, control-plane state, and logging, where the H5CG24AGBDX022N provides 2 GB per component at mainstream DDR5 speeds. The dual sub-channel architecture lets network processors split one component between a data-plane buffer engine and a control-plane CPU share, reducing total component count versus DDR4 designs. On-die ECC addresses bit-error accumulation in always-on equipment where unrepaired soft errors would otherwise require watchdog resets. Because networking appliances run 24/7 at elevated ambient temperatures, designers should apply the SK hynix thermal derating guidance and validate refresh behavior (including any extended-temperature refresh modes) at the maximum operating temperature of the enclosure.
Recommended
Automotive and Edge Compute Modules
Edge compute and ADAS-adjacent platforms require high-bandwidth volatile memory with strong error robustness, and the H5CG24AGBDX022N supplies 16 Gb DDR5 capacity in a surface-mount package suitable for soldered, vibration-tolerant assemblies. Its on-die ECC reduces uncorrected-bit-error exposure in safety-relevant workloads, and the DDR5 sub-channel split lets one component serve both an image-processing ISP pipeline and a host CPU concurrently. Note that this standard-range part is not the automotive-qualified SKU; designs targeting AEC-Q100-grade deployments should confirm qualification status with SK hynix or select the automotive variant of the H5CG family. Layout should follow JEDEC DDR5 fly-by routing with careful impedance control on the CA bus to pass training margins across the full temperature range.
Recommended
Recommended Products Summary
Engineering reference data for H5CG24AGBDX022N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | H5CG24AGBDX022 | H5CG26AGBDX021 | H5CG28AGBDX022 | H5CG34MEBDX030N |
|---|---|---|---|---|---|
| Package | FBGA (DDR5) | FBGA (DDR5) - same | FBGA (DDR5) - same | FBGA (DDR5) - same | FBGA (DDR5) - same |
| Brand | SK hynix | SK hynix | SK hynix | SK hynix | SK hynix |
| Memory Type | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM | DDR5 SDRAM |
| Density | 16 Gbit (2 GB) | 16 Gbit (2 GB) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Speed Code | X022 | X022 | X021 | X022 | X030 |
| Die Revision Suffix | N | none | none | none | N |
| On-Die ECC | Yes | Yes | Yes | Yes | Yes |
| Data Rate | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Identical-die sibling availability for dual sourcing (vs H5CG24AGBDX022)
- Newer die generation in same footprint (vs H5CG28AGBDX022)
- On-die ECC at 16 Gb density (vs Older DDR4 16 Gb components)
Design Notes
DDR5 routes each DRAM as two independent 32-bit sub-channels with a multiplexed CA bus on fly-by topology. Keep CA trace skew within the controller's training window, set on-die termination (ODT) per the controller's recommendation table, and implement VREFCA training as part of the initialization sequence. A wrong ODT profile is the most common cause of first-boot training failure at X022-class data rates; re-run read/write leveling after any temperature-relevant mechanical change such as heatsink addition.
DDR5 moves power regulation from the platform to the memory subsystem: a module-level or on-board DDR5 PMIC must supply the core and VDDQ rails with correct sequencing and transient response sized for peak burst current. Estimated: for a 16 GB module built from eight 16 Gb components, peak DDR5 bus current can reach several amperes per rail during all-bank bursts; consult the SK hynix DDR5 PMIC reference design on the SK hynix Downloads portal for recommended inductor and output capacitor sizing. Never power DDR5 rails from fixed DDR4 regulators - voltage levels differ by generation.
Do not substitute DDR5 speed codes silently: the X022 code on H5CG24AGBDX022N defines the supported bin, and mixing X021/X030/X014 components on one module forces the whole module to the slowest bin and can break SPD-dependent training. Always program the SPD hub with the installed component's exact MPN and bin, and re-run full memory test (BIST/memtest) after any die-revision suffix change, including the N-suffix variants, before release to production.
Follow JEDEC DDR5 module reference routing: per-byte-lane DQ/DQS/DM symmetry, matched-length CA fly-by stubs, and controlled impedance on all high-speed nets. Place decoupling capacitors for both rails as close to each component ball as the fanout allows, and reference DDR5 nets to solid planes to limit crosstalk between adjacent sub-channels. Estimated: keep DQ length mismatch within the controller's per-byte skew budget (typically a few mils at module level; verify against your memory controller's routing guide).
Compliance Information
Compliance data was not present in the verified web data as of 2026-09-05. Consult the official SK hynix product page or Downloads portal for RoHS/REACH declarations for this MPN.
