K3K9K90BM-JGCT - Samsung LPDDR5 SDRAM | Samsung Electronics
MPN: K3K9K90BM-JGCT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.8 | $118.00 |
| 100 | $10.9 | $1,090.00 |
| 500 | $9.95 | $4,975.00 |
| 1,000 | $9.2 | $9,200.00 |
Drop-in alternatives for K3K9K90BM-JGCT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K3K9K90BM-MGCP
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$47.15 / Unit
View Datasheet →K3K8K80BM-JGCT
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View Datasheet →K3K8K80BM-MGCP
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View Datasheet →K3KL9L90CM-MGCT
✅ Drop-In✓ In Stock
$36.91 / Unit
View Datasheet →K3KL8L80CM-MGCT
✅ Drop-In✓ In Stock
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View Datasheet →K3K9K90BM-JGCT Maximum Ratings & Electrical Characteristics
| Memory Type | LPDDR5 SDRAM |
| Manufacturer | Samsung Electronics |
| Package Type | FBGA |
| Package Code | BM |
| Speed/Temperature Grade Code | JGCT |
| Mounting Type | Surface Mount |
K3K9K90BM-JGCT bm Pin Configuration Guide
Complete pinout information for K3K9K90BM-JGCT (bm package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K3K9K90BM-JGCT.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
K3K9K90BM-JGCT is suitable for 6 applications: Smartphone Main Memory, Edge-AI Accelerators, Tablets and Always-Connected PCs, Automotive Infotainment and Cockpit, 5G Networking and CPE Equipment, Smart Home and IoT Hubs.
Smartphone Main Memory
LPDDR5 is the dominant main-memory standard for flagship and upper-mid-tier smartphones, and the K3K9K90BM-JGCT fits this role directly. Samsung's K3K9 LPDDR5 family provides the low standby power and DVFS operating ranges that smartphone SoCs use to throttle memory bandwidth during idle periods, extending battery life measurably compared with LPDDR4X. In a typical design the component is mounted as a discrete FBGA or stacked in a PoP configuration directly beneath the application processor, with length-matched fly-by routing and controller-executed read/write training at boot. The JGCT speed grade must match the SoC's supported data-rate table; higher MGCP bins exist for bandwidth-critical flagship platforms.
Recommended
Edge-AI Accelerators
AI inference at the edge is frequently memory-bandwidth bound, making LPDDR5 a strong fit for the K3K9K90BM-JGCT's target use cases. LPDDR5's bank-group architecture with 16n prefetch and per-byte write masking improves efficiency for the bursty access patterns of convolutional and transformer workloads. In edge-AI modules the LPDDR5 device typically sits on a 32-bit or 64-bit memory bus beside an NPU or AI-enabled SoC, where DVFS lets firmware trade data rate against power during light inference loads. Compared with LPDDR4X-class parts, the LPDDR5 generation raises available bandwidth per watt, directly improving tokens-per-second or frames-per-second figures at the same power budget.
Recommended
Tablets and Always-Connected PCs
Tablets and ARM-based Always-Connected notebooks use LPDDR5 as main memory, and the K3K9K90BM-JGCT addresses this segment within Samsung's K3K9 family. These platforms benefit from LPDDR5's reduced command/address overhead and two-range DVFS, which together lower memory subsystem power during office-productivity and media-playback scenarios. The component is typically designed as two or four FBGA devices on a matched 32-bit to 128-bit bus around the SoC. Designers should budget PCB layer count for the length-matched routing and verify that the JGCT speed bin satisfies the platform's memory bandwidth target before finalizing the BOM.
Recommended
Automotive Infotainment and Cockpit
Automotive cockpit and infotainment SoCs increasingly specify LPDDR-class DRAM for map rendering, displays, and in-cabin AI. The K3K9K90BM-JGCT can serve non-safety infotainment functions where its JGCT temperature grade is adequate, but designers must verify whether the specific ordering code carries automotive qualification, since standard K3K9 parts target consumer segments. In cockpit designs the memory is placed close to the SoC with controlled-impedance routing and thermal derating for hot cabin environments. Samsung's automotive-qualified K4R LPDDR4X family is the conventional choice when AEC-Q100-class qualification is mandatory for the memory rail.
Recommended
5G Networking and CPE Equipment
5G small cells, customer-premises equipment, and gateways use LPDDR5-class DRAM for packet buffering, deep-packet-inspection tables, and control-plane software. The K3K9K90BM-JGCT fits designs whose SoC memory controllers support the LPDDR5 JGCT bin, delivering the family's bandwidth-per-watt advantage in always-on equipment where standby power dominates the energy bill. The FBGA device is laid out on a matched memory bus beside the network processor, typically with four devices forming a 64-bit interface. Thermal design should account for continuous full-rate operation, which is less forgiving than mobile burst workloads.
Recommended
Smart Home and IoT Hubs
Smart-home hubs, cameras with on-device vision, and IoT gateways converge on LPDDR5 as their main memory as SoC vendors retire LPDDR4X controllers. The K3K9K90BM-JGCT offers the K3K9 family's low-power profile, valuable in always-listening and always-connected products where a few hundred milliwatts of standby savings compound over battery-backup or energy-star requirements. The device runs on a compact 16-bit or 32-bit bus, and DVFS enables aggressive power scaling between active assist and idle states. Verify hub-controller compatibility with the JGCT data-rate bin and confirm the density code matches the hub OS memory map.
Recommended
Recommended Products Summary
Engineering reference data for K3K9K90BM-JGCT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K3K9K90BM-MGCP | K3K8K80BM-JGCT | K3KL9L90CM-MGCT |
|---|---|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Package | FBGA (BM) | FBGA (BM) - same | FBGA (BM) - same | FBGA (CM) - adjacent family |
| DRAM Technology | LPDDR5 | LPDDR5 (higher bin) | LPDDR5 | LPDDR5X |
| Density Code | K9 (per Samsung nomenclature) | K9 - same | K8 - different density | 64 Gb |
| Data Rate | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | 7500 Mbps |
| Speed/Temperature Grade | JGCT | MGCP | JGCT - same | MGCT |
| Supply Voltage Class | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Primary Application | Mobile / edge-AI main memory | Flagship mobile main memory | Cost-optimized mobile main memory | Flagship AI / flagship smartphone |
Key Differentiators
- Lower cost standard LPDDR5 bin (vs K3KL9L90CM-MGCT)
- Same-package same-family density flexibility (vs K3K8K80BM-JGCT)
- Consumer-segment optimization vs automotive parts (vs K4RHE086VB-BCWM)
Design Notes
LPDDR5 routing demands tight length matching on data, DQS, and command/address groups, with fly-by CA topology and on-die termination (ODT) settings trained by the SoC memory controller at boot. Keep the DRAM within the controller's specified trace-length budget, use reference-plane-continuous routing, and simulate eye diagrams at the JGCT speed bin before tape-out. Skipping pre-layout SI simulation on LPDDR5 is a leading cause of training failures at temperature extremes.
Power LPDDR5 with separate VDD and VDDQ rails and exploit the two-range DVFS: the controller switches voltage/frequency operating ranges dynamically, so the PMIC must support the required LPDDR5 rail sequencing and slew rates. Decouple each ball-side rail with the bulk and high-frequency capacitor network specified in the Samsung LPDDR5 design guide, and verify rail droop during frequency transitions, which are the highest di/dt events in a mobile platform.
Do not assume bin interchangeability: JGCT, MGCP, and MGCT suffixes encode different speed/temperature grades, and a controller validated for the JGCT bin may fail training on an MGCP/LPDDR5X bin at its published rate. Also confirm density compatibility (K3K8 vs K3K9 codes) with the SoC memory-map table before second-sourcing. Always validate the exact ordering code against the official Samsung LPDDR5 datasheet rather than family-level assumptions.
Compliance Information
Compliance statements were not present in the retrieved web data for this exact ordering code. Samsung production DRAM is typically RoHS-compliant and lead-free, but request official material declarations from Samsung for this MPN before design-in.
