K9HUGY8J5B-CCK0 - 3D V-NAND TLC Flash | Samsung | SSD Storage
MPN: K9HUGY8J5B-CCK0 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $12.5 | $12.50 |
| 10 | $11.8 | $118.00 |
| 100 | $10.9 | $1,090.00 |
| 500 | $10.2 | $5,100.00 |
| 1,000 | $9.6 | $9,600.00 |
K9HUGY8J5B-CCK0 Overview
NAND flash is a non-volatile memory technology that retains data without power. Within the memory hierarchy, NAND flash sits below DRAM as persistent mass storage: raw NAND packages like this one are soldered onto SSD controllers, eMMC/UFS modules, and embedded storage boards. TLC NAND stores three bits per cell, trading some endurance versus MLC for substantially lower cost per gigabyte, which is why TLC dominates consumer and client SSD markets.
Key characteristics of this family include stacked-oxide 3D cell arrays, multi-plane architecture for parallelism, ONFI-style asynchronous and toggle-mode interfaces common to Samsung raw NAND, and industrial/commercial temperature options indicated by the CCK0 grade suffix. Actual density, interface speed, and voltage ratings for K9HUGY8J5B-CCK0 require confirmation from the official Samsung datasheet.
Samsung fabricates its own V-NAND dies in-house, giving the company tight control over layer counts and cell reliability; related generations include the 128-layer V6 and 236-layer V8 devices analyzed by TechInsights in Samsung 990 PRO SSDs.
Typical applications include client SSDs, embedded storage modules, industrial data loggers, and set-top or networking appliances where high-density TLC raw NAND is paired with third-party controllers.
Designers must implement proper ECC (typically LDPC), wear-leveling, and bad-block management in the controller firmware, as raw NAND has no internal management layer.
This page synthesizes family cross-references, drop-in Samsung alternates, and practical design notes not found in distributor listings; parameters not yet verified are explicitly marked .
Drop-in alternatives for K9HUGY8J5B-CCK0 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with K9HUGY8J5B-CCK0 (same form factor and footprint) — differing in Memory Type, Cell Type, Technology, Product Family, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
K9HUGY8J5B-BCK0
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →K9FGGY8J5A-CCK0
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$9.95 / Unit
View Datasheet →K9FGGY8J5A-BCK0
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →K9DUGY8J5M-CCK0
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
K9EUGY8S0M-CCK0
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
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View Datasheet →K9HUGY8J5B-CCK0 Maximum Ratings & Electrical Characteristics
| Memory Type | 3D V-NAND TLC Flash |
| Manufacturer | Samsung Electronics |
| Mounting Type | Surface Mount |
K9HUGY8J5B-CCK0 standard Pin Configuration Guide
Pin configuration for K9HUGY8J5B-CCK0 (standard package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for K9HUGY8J5B-CCK0.
Refer to the datasheet for full pin configuration.
Typical Applications
K9HUGY8J5B-CCK0 is suitable for 6 applications: Client SSD Storage, Embedded Storage Modules, Industrial Data Loggers, Networking and Set-Top Appliances, Automotive Infotainment and Telematics Storage, Consumer Electronics and Wearables Storage.
Client SSD Storage
The K9HUGY8J5B-CCK0 serves as raw TLC V-NAND storage in client and enterprise-client SSD architectures, where Samsung's 3D V-NAND delivers the multi-plane parallelism and per-package density that SSD controllers need to sustain PCIe-class throughput. Samsung's own 990 PRO 4 TB SSD uses the related K9DYGY8J5B-CCK0 V-NAND package, confirming family suitability for high-performance NVMe designs. In the SSD power chain, the NAND is driven by the controller at toggle-mode DDR timing; performance depends on plane count and channel interleaving rather than a single parameter. Designers must budget LDPC ECC engine capability and thermal coupling between controller and NAND within the M.2 or U.2 module envelope.
Recommended
Embedded Storage Modules
For eMMC-adjacent and custom embedded storage boards, the K9HUGY8J5B-CCK0 provides high-density TLC V-NAND that pairs with third-party controllers implementing flash translation layers. Samsung's V-NAND vertical stacking yields more bits per land pattern than planar NAND, a decisive advantage in height- and area-constrained embedded platforms such as industrial PCs, smart meters, and networking appliances. The raw-NAND interface means the host system owns bad-block management and wear-leveling, so firmware maturity determines effective endurance. Because TLC endurance is lower than SLC/MLC, write-intensive logging applications should size over-provisioning accordingly and monitor block wear through the controller's status commands.
Recommended
Industrial Data Loggers
Industrial logging equipment benefits from the K9HUGY8J5B-CCK0's non-volatile TLC storage: recorded telemetry, event logs, and firmware images survive power loss without battery backup. Samsung V-NAND's stacked-cell structure improves program-disturb tolerance versus planar TLC, supporting the wide temperature and vibration profiles typical of factory-floor and grid-infrastructure hardware. The controller must implement power-loss protection sequencing, flushing caches on brown-out detection, since raw NAND has no internal write-interrupt protection. For frequently rewritten circular logs, wear-leveling plus reserve-block pools of 5-10% extend useful life; consult the Samsung datasheet for the CCK0 grade's specified operating temperature range before deployment.
Recommended
Networking and Set-Top Appliances
Routers, gateways, and set-top boxes use raw TLC V-NAND packages like the K9HUGY8J5B-CCK0 to host firmware images, application containers, and DVR-style content caches. Samsung's V-NAND generation offers the per-package density that lets these cost-sensitive appliances eliminate mechanical storage entirely, and its toggle-mode interface integrates with mainstream ARM SoC memory controllers. Design considerations include keeping the NAND within the SoC's supported timing spec at the appliance's operating temperature, and partitioning the array to isolate write-intensive cache regions from rarely-updated firmware regions so wear concentrates predictably. Retail-grade appliances commonly derate the specified P/E budget by 50% for reliability margin.
Recommended
Automotive Infotainment and Telematics Storage
Automotive head units and telematics gateways require multi-gigabyte non-volatile storage for map databases, media, and event data recorders, and TLC V-NAND packages such as the K9HUGY8J5B-CCK0 deliver that density in a surface-mount footprint compatible with automated assembly. Before automotive deployment, verify the CCK0 grade's qualification status - where AEC-Q100-level robustness is mandatory, Samsung's automotive-qualified suffix variants must be selected instead. In-vehicle designs add thermal-management requirements: NAND retention and endurance degrade at sustained junction temperatures above specification, so placement away from power stages and via-stitching to ground planes are standard practice. Extended-temperature grade suffixes within the same Samsung package family should be cross-checked in the ordering table.
Recommended
Consumer Electronics and Wearables Storage
Smart-home hubs, tablets, and connected consumer devices integrate raw TLC V-NAND like the K9HUGY8J5B-CCK0 for app storage and media libraries, valuing Samsung's bits-per-square-millimeter leadership to keep bill-of-materials cost down at multi-gigabyte capacities. Because these devices run full flash-translation stacks in the host SoC, the raw package integrates with minimal external circuitry - essentially supply decoupling and interface routing. Power-conscious designs exploit NAND suspend/resume commands to idle the die during bursts of inactivity, and the 1.8V-class I/O interface common to Samsung raw NAND reduces interface power versus legacy 3.3V signaling. Density, voltage, and speed ratings should be confirmed against the official Samsung datasheet during schematic capture.
Recommended
Recommended Products Summary
Engineering reference data for K9HUGY8J5B-CCK0 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | K9HUGY8J5B-BCK0 | K9FGGY8J5A-CCK0 | K9EUGY8S0M-CCK0 |
|---|---|---|---|---|
| Package | Samsung GY8J5B BGA (per family convention) | Samsung GY8J5B BGA - same | Samsung GY8J5A BGA | Samsung S0M BGA |
| Brand | Samsung Electronics | Samsung Electronics | Samsung Electronics | Samsung Electronics |
| Memory Technology | 3D V-NAND TLC | 3D V-NAND TLC (same die) | 3D V-NAND TLC, one generation older | 3D V-NAND TLC, GY generation |
| Grade Suffix | CCK0 | BCK0 | CCK0 | CCK0 |
| Pin Compatibility | Reference (GY8J5B family) | Pin-to-pin identical | Same family convention, verify footprint | Different outline, verify footprint |
Key Differentiators
- Newest GY8J5B V-NAND generation density (vs K9FGGY8J5A-CCK0)
- Pin-identical grade variant available (vs K9HUGY8J5B-BCK0)
- Fabricated on Samsung in-house V-NAND process (vs Micron/Kioxia cross-brand NAND)
Design Notes
Raw Samsung V-NAND such as K9HUGY8J5B-CCK0 has no internal ECC, wear-leveling, or bad-block management - these are controller responsibilities. Deploying raw TLC NAND without an LDPC-class ECC engine and a mature flash translation layer results in rapid data corruption. Confirm the exact density, interface timing, and command set from the official Samsung datasheet before firmware development, since the CCK0 grade suffix and generation code determine supported toggle-mode timing.
Samsung raw NAND packages typically require multiple supply rails (core VCC and I/O VCCQ, commonly 3.3V/1.8V-class) with independent decoupling. Provide each rail with bulk capacitance plus 0.1uF ceramics at every supply pin, and sequence VCC before or with VCCQ per the Samsung datasheet power-up timing to avoid latch-up or undefined states. Estimated: current depends on density and plane activity; verify ICC values in the datasheet rather than assuming from sibling packages.
Toggle-mode DDR interfaces on high-density V-NAND run with tight timing budgets. Keep command/data lines length-matched within the datasheet skew allowance, route strobes as differential pairs where specified, and avoid crossing plane splits under address and data buses. For multi-package arrays sharing a channel, add series termination near the controller and verify eye diagrams at the farthest package. Ground via stitching around the BGA field reduces simultaneous-switching noise during program operations.
Compliance Information
Compliance data for K9HUGY8J5B-CCK0 was not present in the verified web data. Samsung memory products are generally RoHS-compliant, but this must be confirmed from the official Samsung product page or certificate before use; values left unknown per anti-fabrication policy.
