M1AFS1500-2FG484I - Fusion Mixed-Signal FPGA 484-BGA | Microchip
MPN: M1AFS1500-2FG484I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $172.5 | $1,725.00 |
| 100 | $158 | $15,800.00 |
| 500 | $144 | $72,000.00 |
| 1,000 | $132 | $132,000.00 |
M1AFS1500-2FG484I Overview
An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a matrix of configurable logic blocks, routing fabric, and I/O cells that designers program after manufacturing. Unlike SRAM-based FPGAs, the Fusion family is flash-based, meaning configuration is stored on-chip in non-volatile flash and loads instantly at power-up with no external configuration ROM required. Fusion devices go further by integrating configurable analog blocks, large flash memory blocks, and comprehensive clock generation and management circuitry on a monolithic die, positioning them as mixed-signal system-on-chip programmable platforms within the programmable logic device hierarchy.
Key features of the M1AFS1500-2FG484I include its flash-based live-at-power-up architecture, 128-bit flash lock and industry-leading AES-128 decryption for securing programmed intellectual property and configuration data, and integrated analog peripherals that reduce bill-of-materials cost in mixed-signal systems. The 223 I/O count supports wide bus interfaces, and the 484-FBGA footprint provides a surface-mount solution for dense boards.
According to the Microsemi/Microchip Fusion family datasheet, the device operates from a 1.5V core supply with industrial-grade temperature specifications, making it suitable for instrumentation, industrial control, and secure embedded systems. The 130nm flash technology offers inherent live-at-power-up behavior: as soon as system power is applied and within normal operating specifications, Fusion devices are working.
Typical applications include industrial automation controllers, secure embedded systems requiring configuration encryption, mixed-signal sensor interfaces, and test equipment. Designers should budget I/O bank voltage assignments early and plan power distribution across the core, analog, and I/O rails. This page synthesizes distributor pricing data, drop-in alternatives within the Fusion family, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for M1AFS1500-2FG484I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with M1AFS1500-2FG484I (same form factor and footprint) — differing in Package, Family, System Gates, Process Technology, Configuration Memory.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS1500-FG484I
✅ Drop-In📋 Reference alternative (not in catalog)
M1AFS1500-2FG484
✅ Drop-In✓ In Stock
Contact for price
View Datasheet →M1AFS1500-1FG484
✅ Drop-In✓ In Stock
$1089.55 / Unit
View Datasheet →M1AFS600-2FG484I
✅ Drop-In✓ In Stock
$97.6 / Unit
View Datasheet →M7AFS600-2FG484I
✅ Drop-In✓ In Stock
$272.01 / Unit
View Datasheet →M1AFS1500-2FG484I Maximum Ratings & Electrical Characteristics
| Family | Fusion Mixed-Signal FPGA |
| System Gates | 1.5M gates |
| User I/O | 223 |
| Flash Memory | 276480 bits |
| Speed Grade | -2 |
| Core Voltage | 1.5 V |
| Process Technology | 130 nm flash |
| Configuration | Flash-based, live at power-up |
| Security | 128-bit flash lock, AES-128 decryption |
| Analog Blocks | Integrated configurable analog |
| Package | 484-Ball FBGA |
| Mounting Type | Surface Mount |
| Temperature Grade | Industrial (I) |
| Packaging | Tray |
M1AFS1500-2FG484I 484-ball fbga Pin Configuration Guide
Pin configuration for M1AFS1500-2FG484I (484-ball fbga package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-2FG484I.
Refer to the datasheet for full pin configuration.
Typical Applications
M1AFS1500-2FG484I is suitable for 6 applications: Industrial Automation Control, Secure Embedded Systems, Mixed-Signal Sensor Interfaces, Test and Measurement Equipment, Aerospace and Defense Prototyping, Power Monitoring and Management.
Industrial Automation Control
The M1AFS1500-2FG484I fits industrial controllers because its 1.5M gates of flash-based logic and 223 user I/Os can host motor control state machines, fieldbus interfaces, and glue logic on one die, while integrated configurable analog blocks digitize sensors without external ADCs. Flash configuration means the controller is functional the instant 1.5V core power is within specification - no configuration delay that could misfire actuator sequencing. The industrial temperature grade covers factory-floor ambient extremes. A trade-off is the 1.5V core on 130nm process: total dynamic power should be estimated in Libero before finalizing the supply design.
Recommended
Secure Embedded Systems
For designs protecting valuable IP, the M1AFS1500-2FG484I provides a 128-bit flash-based lock and AES-128 decryption that secure both programmed logic and configuration data, per the Microsemi Fusion datasheet. Because configuration resides in on-chip flash, there is no external bitstream bus to intercept - the fundamental attack surface of SRAM FPGAs is removed. The device is working as soon as power is applied, which also shortens secure-boot time. Designers should still lock JTAG access and use the flash lock features during production programming; the analog blocks can additionally implement tamper-detection monitoring without extra components.
Recommended
Mixed-Signal Sensor Interfaces
The Fusion family integrates configurable analog blocks alongside the 1.5M-gate fabric, so the M1AFS1500-2FG484I can directly condition and digitize sensor inputs, then process the data in the same die - reducing BOM count versus discrete ADC plus FPGA solutions. With 223 user I/Os, wide digital sensor arrays or multi-channel systems remain feasible, and the 484-FBGA footprint offers enough balls for power and ground integrity around the analog section. Note that analog block performance is modest compared to dedicated precision converters; for sub-millivolt accuracy, pair the FPGA with an external precision ADC and use the fabric for filtering and protocol conversion.
Recommended
Test and Measurement Equipment
Bench and rack instruments benefit from the M1AFS1500-2FG484I's live-at-power-up behavior: the 1.5V-core, flash-based device begins operating immediately, eliminating the configuration latency of SRAM FPGAs that users would observe at instrument power-on. The -2 speed grade provides the fastest timing available in the Fusion 1500 family for high-throughput acquisition triggers and interface logic, and 223 I/Os support wide parallel buses to front-end circuitry. For designs needing more compute, the fabric can host soft processors alongside custom peripherals. Verify timing closure at the -2 grade in Libero before finalizing front-panel bus speeds.
Recommended
Aerospace and Defense Prototyping
Microsemi (now Microchip) programmable logic has a long heritage in aerospace programs, and the M1AFS1500-2FG484I serves as a prototyping and ground-equipment platform where flash-based, single-chip configuration and the AES-128 security features are valuable. The 130nm flash process offers intrinsic radiation-tolerance advantages in architecture compared to SRAM cells, although this commercial-grade industrial part is not flight-qualified - designers should migrate to RTAX-series devices (such as RTAX2000S-CQ352V) for flight hardware. Use the 484-FBGA evaluation on ground test benches to validate logic before porting to the rad-tolerant family.
Recommended
Power Monitoring and Management
Because Fusion devices integrate clock generation and management circuitry plus analog monitoring blocks, the M1AFS1500-2FG484I can act as a system power supervisor and sequencer while simultaneously hosting digital control logic - consolidating functions traditionally spread across a CPLD, supervisor IC, and ADC. The flash fabric is monitoring within microseconds of power application, allowing early fault capture during brownout events. The 276,480-bit flash array logs event data. Keep in mind the 1.5V core rail must be present for logic operation; analog monitoring of pre-regulator rails requires resistor dividers into the analog inputs.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-2FG484I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-FG484I | M1AFS1500-2FG484 | M1AFS600-2FG484I | M7AFS600-2FG484I |
|---|---|---|---|---|---|
| Package | 484-Ball FBGA | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same | 484-Ball FBGA - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1.5M | 1.5M | 1.5M | 600K | 600K |
| Speed Grade | -2 | -1 | -2 | -2 | -2 |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Temperature Grade | Industrial (I) | Industrial (I) | Commercial | Industrial (I) | Industrial (I) |
| Configuration Security | 128-bit flash lock, AES-128 | 128-bit flash lock, AES-128 | 128-bit flash lock, AES-128 | 128-bit flash lock, AES-128 | 128-bit flash lock, AES-128 |
Key Differentiators
- Highest logic density in the Fusion 484-FBGA lineup (vs M1AFS600-2FG484I)
- Faster timing than the -1 grade sibling (vs M1AFS1500-FG484I)
- Industrial temperature rating (vs M1AFS1500-2FG484)
Design Notes
Estimated: the 1.5V core rail carries the majority of dynamic power on this 130nm flash FPGA. Exact current depends on design utilization and clock rates; use Microchip's power estimation tool in Libero SoC with your actual gate and toggle counts rather than datasheet maximums. Provide independent I/O bank supplies and allow for inrush-free soft start - flash-based devices draw configuration current instantly at power-up because they are live at power application.
The 484-ball FBGA requires controlled-impedance PCB layout with via-in-pad or dog-bone fanout; plan a minimum of 6 layers for signal escape on the outer ball rows. Dedicate solid ground planes beneath the die and keep analog block references on a quiet region of the board. Follow the Microchip Fusion PCB layout guidelines in the family datasheet for ball assignment of power, ground, and analog pins.
Do not confuse the M1AFS1500-2FG484I with its siblings: the FG484/FGG484 ball-type variants and -1 speed grade parts are footprint-similar but differ in timing and, for FGG, ball metallurgy. Confirm the exact ordering P/N against your BOM before assembly. Additionally, this industrial part is not flight-qualified - aerospace designers must migrate to RTAX-series devices for flight hardware.
Compliance Information
RoHS, REACH, and lead-free status not explicitly stated in the retrieved distributor data. Request a compliance certificate from Microchip Technology or XAIPART before production procurement.
