STM32MP153CAC3 - Dual Cortex-A7 + Cortex-M4 MPU | STMicroelectronics
MPN: STM32MP153CAC3 β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.75 | $18.75 |
| 10 | $16.88 | $168.80 |
| 100 | $15 | $1,500.00 |
| 500 | $13.5 | $6,750.00 |
| 1,000 | $12 | $12,000.00 |
Drop-in alternatives for STM32MP153CAC3 β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
STM32MP157CAC3
β Drop-Inβ 99,999 In Stock
$11.5 / Unit
View Datasheet βSTM32MP151CAC3
β Drop-Inπ Reference alternative (not in catalog)
STM32MP153CAC3-Q1
β Drop-Inπ Reference alternative (not in catalog)
STM32MP157CAC3-Q1
β Drop-Inπ Reference alternative (not in catalog)
STM32MP151CAC3-Q1
β Drop-Inπ Reference alternative (not in catalog)
STM32MP153CAC3 Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-A7 (dual) + Cortex-M4 |
| Core Frequency | 650 MHz (A7) / 209 MHz (M4) |
| Number of Cores | 3 (2x A7 + 1x M4) |
| RAM Size | 708 KB (internal SRAM) |
| Program Memory Size | [DATA_NEEDED: Program Memory Size] |
| Program Memory Type | External memory support (DDR3/DDR3L, NAND, NOR) |
| Package | TFBGA361 (17x17 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (Tj) |
| Supply Voltage | 1.8V to 3.3V (I/O), 1.2V (core) |
| Number of I/O | [DATA_NEEDED: Number of I/O] |
| Connectivity | Ethernet, USB 2.0, CAN, UART, SPI, I2C, SDIO |
| Security Features | Secure boot, crypto/hash processors, TRNG |
| GPU | 3D GPU (OpenGL ES 2.0) |
| RoHS Status | Compliant |
STM32MP153CAC3 Pin Configuration
| Pin A1 | VDD β Main power supply (1.2V core) |
| Pin A2 | VSS β Ground |
| Pin B1 | VDD_IO β I/O power supply (1.8V-3.3V) |
| Pin B2 | VDD_IO β I/O power supply (1.8V-3.3V) |
| Pin C1 | PA0 β GPIO / ADC input |
| Pin C2 | PA1 β GPIO / ADC input |
| Pin D1 | PA2 β GPIO / USART2_TX |
| Pin D2 | PA3 β GPIO / USART2_RX |
| Pin E1 | PA4 β GPIO / SPI1_NSS |
| Pin E2 | PA5 β GPIO / SPI1_SCK |
| Pin F1 | PA6 β GPIO / SPI1_MISO |
| Pin F2 | PA7 β GPIO / SPI1_MOSI |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
STM32MP153CAC3 is suitable for 6 applications: Industrial Automation Controller, Smart Gateway / IoT Edge Node, Human-Machine Interface (HMI), Medical Monitoring Device, Smart Home Hub, Robotics Controller.
Industrial Automation Controller
The STM32MP153CAC3 is ideal for industrial automation controllers that require both high-level processing for HMI and networking, and real-time control for precise motor and actuator control. The dual-core Cortex-A7 can run Linux for complex algorithms and communication protocols, while the Cortex-M4 handles time-critical I/O and control loops. The device's wide operating temperature range (-40C to +125C) and robust security features make it suitable for harsh industrial environments. In a typical PLC (Programmable Logic Controller), the STM32MP153CAC3 manages fieldbus communication (EtherCAT, PROFINET) on the A7 cores, while the M4 core executes fast PID control loops for motor drives. The rich connectivity options (Ethernet, CAN, UART) allow seamless integration with existing industrial networks. The device's power management features enable energy-efficient operation, reducing heat dissipation in sealed enclosures. The security suite protects against unauthorized firmware modification, ensuring system integrity in critical infrastructure.
Recommended
Smart Gateway / IoT Edge Node
The STM32MP153CAC3 serves as a powerful smart gateway or IoT edge node, aggregating data from multiple sensors and devices, processing it locally, and forwarding it to the cloud. The dual-core Cortex-A7 can run Linux with containerized applications, while the Cortex-M4 handles sensor data acquisition and real-time response. The device's connectivity options (Ethernet, USB, Wi-Fi via SDIO) enable flexible network integration. In a typical smart building gateway, the STM32MP153CAC3 collects data from temperature, humidity, and occupancy sensors via I2C/SPI, processes it using machine learning algorithms on the A7 cores, and sends alerts or commands to actuators via the M4 core. The security features (secure boot, crypto accelerators) ensure secure communication with cloud services. The low-power modes allow the gateway to operate on battery backup during power outages. The device's rich peripheral set simplifies hardware design, reducing BOM cost and time-to-market.
Recommended
Human-Machine Interface (HMI)
The STM32MP153CAC3 is well-suited for HMI applications that require a graphical user interface with touch input, such as industrial control panels, medical devices, and home automation displays. The dual-core Cortex-A7 can run a full Linux distribution with a graphical framework (e.g., Qt, GTK), while the Cortex-M4 handles touch sensing and real-time response. The device supports external DDR3/DDR3L memory for large frame buffers and complex UI assets. In a typical HMI panel, the STM32MP153CAC3 drives a TFT-LCD display via the parallel or MIPI-DSI interface, processes touch input via I2C, and communicates with the main controller via Ethernet or CAN. The 3D GPU (if using the STM32MP157 variant) enables smooth animations and 3D effects. The device's security features protect against unauthorized access to sensitive data. The wide operating temperature range and long-term availability make it ideal for industrial HMIs that must operate reliably for years.
Recommended
Medical Monitoring Device
The STM32MP153CAC3 is used in medical monitoring devices such as patient monitors, infusion pumps, and diagnostic equipment. The dual-core Cortex-A7 can run a Linux-based application for data logging, user interface, and network communication, while the Cortex-M4 handles real-time sensor acquisition and alarm generation. The device's security features (secure boot, crypto accelerators) ensure patient data privacy and compliance with medical regulations. In a typical patient monitor, the STM32MP153CAC3 acquires ECG, SpO2, and blood pressure signals via ADC and I2C, processes them on the M4 core for real-time waveform display, and runs a graphical UI on the A7 cores. The device's low-power modes extend battery life in portable monitors. The wide operating temperature range and long-term availability make it suitable for medical devices that must operate reliably for years. The rich connectivity options (USB, Ethernet) enable integration with hospital networks and electronic health records.
Recommended
Smart Home Hub
The STM32MP153CAC3 acts as a central hub for smart home automation, connecting various IoT devices (lights, thermostats, security cameras) and providing local processing and control. The dual-core Cortex-A7 can run a home automation platform (e.g., Home Assistant, openHAB), while the Cortex-M4 handles real-time device control and sensor polling. The device's connectivity options (Ethernet, Wi-Fi via SDIO, Zigbee via SPI) enable seamless integration with diverse smart home protocols. In a typical smart home hub, the STM32MP153CAC3 manages Zigbee and Z-Wave networks via external transceivers, processes voice commands via a microphone array, and controls smart devices via MQTT. The security features ensure secure communication with cloud services and protect against unauthorized access. The low-power modes allow the hub to operate efficiently 24/7. The device's rich peripheral set simplifies hardware design, reducing BOM cost and time-to-market.
Recommended
Robotics Controller
The STM32MP153CAC3 is used in robotics controllers that require both high-level processing for path planning and computer vision, and real-time control for motor and actuator coordination. The dual-core Cortex-A7 can run ROS (Robot Operating System) on Linux, while the Cortex-M4 handles low-level motor control and sensor fusion. The device's rich connectivity (Ethernet, CAN, UART) enables communication with various sensors and actuators. In a typical mobile robot, the STM32MP153CAC3 processes LiDAR data on the A7 cores for SLAM (Simultaneous Localization and Mapping), while the M4 core executes PID control for wheel motors. The security features protect against unauthorized firmware modification. The wide operating temperature range and long-term availability make it suitable for industrial and research robots. The device's power management features enable efficient battery operation.
Recommended
Recommended Products Summary
Engineering reference data for STM32MP153CAC3 β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32MP157CAC3 | STM32MP151CAC3 | STM32MP153CAC3-Q1 |
|---|---|---|---|---|
| Package | TFBGA361 | TFBGA361 - same | TFBGA361 - same | TFBGA361 - same |
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Core Architecture | Dual Cortex-A7 + Cortex-M4 | Dual Cortex-A7 + Cortex-M4 | Single Cortex-A7 + Cortex-M4 | Dual Cortex-A7 + Cortex-M4 |
| Max CPU Frequency | 650 MHz (A7) / 209 MHz (M4) | 650 MHz (A7) / 209 MHz (M4) | 650 MHz (A7) / 209 MHz (M4) | 650 MHz (A7) / 209 MHz (M4) |
| GPU | No | Yes (3D GPU) | No | No |
| Automotive Grade | No | No | No | Yes (AEC-Q100) |
| Internal SRAM | 708 KB | 708 KB | 708 KB | 708 KB |
| Security Features | Secure boot, crypto, TRNG | Secure boot, crypto, TRNG | Secure boot, crypto, TRNG | Secure boot, crypto, TRNG |
Key Differentiators
- Dual-core Cortex-A7 at 650 MHz (vs STM32MP151CAC3)
- No GPU vs STM32MP157CAC3 (vs STM32MP157CAC3)
- Automotive grade option (vs STM32MP153CAC3-Q1)
Design Notes
The STM32MP153CAC3 requires multiple power rails with specific sequencing. Power up VDD (1.2V core) first, followed by VDD_IO (1.8V-3.3V), and then DDR memory supply. Use a dedicated PMIC (e.g., STPMIC1) to manage the sequencing and provide all required voltages. Ensure proper decoupling with 100nF capacitors on each power pin and a bulk capacitor (10uF) near the power input.
The TFBGA361 package requires a multi-layer PCB with at least 6 layers for proper routing and power distribution. Use microvias and blind/buried vias to route signals from the BGA balls. Provide a solid ground plane and dedicated power planes for VDD, VDD_IO, and DDR supplies. Place decoupling capacitors as close as possible to the power balls to minimize inductance.
The STM32MP153CAC3 can dissipate significant power when running at full speed. Use thermal vias under the exposed pad (if present) and connect them to a large copper pour on the bottom layer to improve heat dissipation. For high-performance applications, consider adding a heatsink or active cooling. Monitor junction temperature to ensure it stays below 125C.
Compliance Information
RoHS compliant per STMicroelectronics product page. Not AEC-Q100 qualified - choose STM32MP153CAC3-Q1 for automotive.