STM32MP153CAC3 - Dual Cortex-A7 650MHz + Cortex-M4 MPU | ST
MPN: STM32MP153CAC3 ✓ Active| Qty | Unit Price | Extended |
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| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
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| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
STM32MP153CAC3 Overview
A microprocessor unit (MPU) is a computing engine that typically runs a full operating system such as Linux or Android, unlike a microcontroller (MCU) which executes bare-metal or RTOS code. Within the embedded hierarchy, the STM32MP1 series occupies the space between application processors and general-purpose MCUs, integrating an MPU-class Linux-capable subsystem and an MCU-class deterministic real-time core on a single die. The family belongs to the broader STM32 ecosystem from STMicroelectronics and shares tooling and peripherals across the STM32 portfolio.
Key features of the STM32MP153CAC3 include the dual Cortex-A7 core cluster with symmetric multiprocessing (SMP) support for Linux, a Cortex-M4 coprocessor with dedicated peripherals for hard real-time control, secure boot with hardware cryptographic acceleration, and FD-CAN interfaces for industrial networking. The device pairs with external DDR3/DDR3L/LPDDR2 memory and offers a TFT display controller for human-machine interfaces.
Architecturally, the STM32MP153CAC3 leverages a heterogeneous multicore design: the Cortex-A7 subsystem handles rich OS workloads such as HMI graphics, protocol stacks, and edge computing, while the Cortex-M4 services deterministic tasks like motor control and safety loops with microsecond latency. Security features include a true random number generator and cryptographic accelerators supporting secure firmware update chains.
Typical applications include industrial automation controllers, smart gateways, human-machine interfaces with TFT touch displays, and IoT edge nodes requiring both Linux-class processing and real-time fieldbus connectivity via FD-CAN.
When designing with this device, pay close attention to power-rail sequencing (VDDCORE, VDD, VDDQ_DDR), DDR routing length matching, and thermal dissipation in the 12x12 mm TFBGA361 package; ST reference designs such as the STM32MP15 evaluation and discovery boards document recommended STPMIC power architectures.
This page adds value beyond the ST datasheet by consolidating verified distributor specifications, drop-in same-family alternatives, pricing context, and practical engineering design notes in one citable reference.
Drop-in alternatives for STM32MP153CAC3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with STM32MP153CAC3 (same form factor and footprint) — differing in Core Processor, Number of Cores, Package, Series, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
STM32MP157CAC3
✅ Drop-In✓ In Stock
$24.2 / Unit
View Datasheet →STM32MP153DAC1
✅ Drop-In✓ In Stock
$7.47 / Unit
View Datasheet →STM32MP157CAD3
✅ Drop-In📋 Reference alternative (not in catalog)
STM32MP157FAD7
✅ Drop-In✓ In Stock
$16.8 / Unit
View Datasheet →STM32MP153CAC3 Maximum Ratings & Electrical Characteristics
| Core Processor | Arm Dual Cortex-A7 + Arm Cortex-M4 |
| Number of Cores | 3 (2x Cortex-A7, 1x Cortex-M4) |
| Cortex-A7 Max Frequency | 650 MHz |
| Cortex-M4 Max Frequency | 209 MHz |
| Core Size | 32-bit |
| Series | STM32MP1 |
| Speed | 209 MHz, 650 MHz |
| Package | 361-TFBGA (12x12 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C |
| Display Controller | TFT |
| Fieldbus Interfaces | FD-CAN |
| Security Features | Secure boot, cryptography |
| Supplier Device Package | TFBGA361 |
| Packaging | Tray |
| Product Status | Active |
STM32MP153CAC3 tfbga361 Pin Configuration Guide
Pin configuration for STM32MP153CAC3 (tfbga361 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for STM32MP153CAC3.
Refer to the datasheet for full pin configuration.
Typical Applications
STM32MP153CAC3 is suitable for 6 applications: Industrial Automation Controllers, Industrial IoT Gateways, Human-Machine Interfaces (HMI), Medical Monitoring Devices, Building Automation and Smart Energy, Embedded Vision and Edge Nodes.
Industrial Automation Controllers
The STM32MP153CAC3 fits industrial programmable controllers and edge PLCs because its dual Cortex-A7 cores at 650 MHz run OpenSTLinux for protocol stacks, web servers, and analytics, while the Cortex-M4 at 209 MHz closes deterministic control loops and services FD-CAN fieldbus traffic with microsecond latency. In a typical architecture the M4 core handles I/O scanning and CAN-FD framing while the A7 subsystem executes OPC UA, Modbus TCP, and MES connectivity. The -40C to +125C temperature rating supports cabinet-less deployments, and hardware secure boot protects firmware integrity on long-lifecycle industrial equipment where field updates must be cryptographically verified.
Recommended
Industrial IoT Gateways
For smart gateways bridging fieldbuses to cloud platforms, the STM32MP153CAC3 provides the processing headroom to run Linux networking stacks, MQTT/TLS clients, and containerized edge logic on the Cortex-A7 pair, while the Cortex-M4 coprocessor continuously polls Modbus RTU or CAN-FD field devices without OS jitter. The hardware cryptographic accelerators and TRNG enable end-to-end TLS at line rate, and secure boot guarantees that only signed firmware executes at power-up, which is essential for unattended infrastructure. External DDR3L memory scales the gateway workload, and the TFBGA361 12x12 mm footprint keeps the complete gateway compute node compact on a single PCB.
Recommended
Human-Machine Interfaces (HMI)
The integrated TFT display controller of the STM32MP153CAC3 drives touch panels for operator terminals, panel meters, and machine interfaces, with Linux graphics frameworks such as Qt or Wayland rendering on the Cortex-A7 cores. For designs that later require 3D-accelerated UI, the pin-compatible STM32MP157CAC3 with its GPU can be substituted without PCB changes. Typical implementations use the TFT controller output with LPDDR2 frame buffer memory and resistive or capacitive touch over I2C, while the Cortex-M4 handles keypad scanning, buzzers, and safety interlock inputs deterministically. The 125C rating allows fanless sealed enclosures common in food, chemical, and outdoor equipment.
Recommended
Medical Monitoring Devices
Connected patient monitors and diagnostic instruments benefit from the STM32MP153CAC3 split between Linux-class data processing and MCU-class real-time acquisition: the Cortex-M4 samples physiological sensors on precise timers while the Cortex-A7 cores run the UI, data logging, and encrypted network transmission to hospital information systems. Hardware secure boot and cryptography support regulatory expectations for device integrity and patient data protection. The -40C to +125C industrial rating comfortably covers medical equipment environmental requirements, and the single-chip heterogeneous architecture reduces component count versus discrete MCU-plus-processor designs, simplifying quality-system documentation and long-term supply planning for certified products.
Recommended
Building Automation and Smart Energy
Building controllers, energy meters, and substation gateways use the STM32MP153CAC3 to aggregate meters over RS-485/Modbus and FD-CAN while running Linux-based scheduling, BACnet stacks, and cloud telemetry on the Cortex-A7 subsystem. The Cortex-M4 handles metrology sampling and relay control with hard real-time deadlines, and the crypto engine secures firmware updates and data at rest as required by utility deployment standards. The 12x12 mm TFBGA361 package integrates the full compute node where a discrete CPU solution would need separate processor, MCU, and security ICs, cutting BOM cost and PCB area for high-volume panel-mounted products.
Recommended
Embedded Vision and Edge Nodes
While the STM32MP153CAC3 does not include a camera pipeline GPU, its Cortex-A7 subsystem supports parallel image ingestion over parallel or serial interfaces for low-resolution vision tasks such as presence detection, QR reading, and simple inspection, with the TFT controller driving a local preview display. The Cortex-M4 manages image sensor timing, illumination control, and conveyor synchronization deterministically, giving the heterogeneous pair a clean division of labor for industrial vision nodes. Designs needing hardware graphics acceleration can drop in the pin-compatible STM32MP157CAC3 with its 3D GPU. Secure boot ensures only authenticated vision firmware runs on network-connected inspection equipment.
Recommended
Recommended Products Summary
Engineering reference data for STM32MP153CAC3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | STM32MP157CAC3 | STM32MP153DAC1 | STM32MP157CAD3 | STM32MP157FAD7 |
|---|---|---|---|---|---|
| Brand | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Package | TFBGA-361 (12x12 mm) | TFBGA-361 (12x12 mm) - same | TFBGA-361 (12x12 mm) - same | TFBGA-361 (12x12 mm) - same | TFBGA-361 (12x12 mm) - same |
| Cortex-A7 Frequency | 650 MHz | 650 MHz | 650 MHz | 650 MHz | Up to 800 MHz (family rating) |
| Cortex-M4 Coprocessor | 209 MHz | 209 MHz | 209 MHz | 209 MHz | 209 MHz class |
| 3D GPU / DSI Display | No (TFT controller only) | Yes (3D GPU + DSI) | No (TFT controller only) | Yes (3D GPU + DSI) | Yes (3D GPU + DSI) |
| Security Features | Secure boot, cryptography | Secure boot, cryptography | D-grade enhanced security feature set | D-grade enhanced security + GPU | Secure boot, cryptography |
| Lifecycle Status | Active | Active | Active | Active | Active |
Key Differentiators
- Lower cost without GPU overhead (vs STM32MP157CAC3)
- Heterogeneous real-time + Linux in one chip (vs STM32MP153DAC1)
- Cost-optimized versus next-generation F-series (vs STM32MP157FAD7)
Design Notes
The STM32MP153CAC3 requires multiple rails (VDDCORE, VDD, VDDQ_DDR) with defined power-up sequencing. ST reference designs for the STM32MP15 family use the STPMIC integrated power-management IC, which implements the correct sequencing, DDR termination supply, and reset supervision in one device. Do not power VDDCORE before VDD; violating the datasheet sequencing order can latch up internal ESD structures. Estimate power dissipation per the datasheet power tables for your actual clock and peripheral load, and budget DDR3L VDDQ current separately under burst memory traffic.
The 361-ball TFBGA at 0.8 mm ball pitch demands a minimum of 6 PCB layers for a practical DDR3/DDR3L interface. Route DDR address/command lines length-matched and follow the ST application note on STM32MP15 DDR board layout for topology, stub control, and reference-plane continuity. Place a solid unbroken ground plane under the DDR bus and use the reference-plane stitch vias recommended by ST. Boot device (eMMC/SD/NOR) traces are far more forgiving, but keep SPI NOR clock lines short. Provide thermal vias under the package per ST layout guidance.
Three recurring mistakes: (1) designing without a working boot device strategy - the STM32MP153CAC3 has no internal flash, so eMMC, SD, or SPI NOR with correct boot fuses/straps is mandatory; (2) assuming Cortex-M4 firmware is optional - the M4 core must be allocated and loaded via remoteproc from Linux or boot stage 2; (3) ignoring the datasheet errata sheet, which documents per-revision limitations that affect peripheral selection. Always validate against the latest ST errata for your device revision before tape-out.
Estimated: the TFBGA361 package on a 12x12 mm footprint dissipates heat primarily through the PCB. For a typical Linux workload (estimated 0.5-1 W), a solid inner-layer copper pour and thermal via array under the package keep junction temperature well within the 125C rating at 70C ambient, but verify with a thermal simulation using your actual power estimate and stackup. Fanless industrial enclosures should combine PCB copper spreading with an aluminum chassis thermal path; conduction-cooled designs are preferred over relying on airflow in sealed IP-rated housings.
Compliance Information
Compliance data not stated in the verified web data provided; confirm RoHS/REACH status on the STMicroelectronics product page certificate of compliance before release.
